通信类外文翻译中英文翻译.docx
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通信类外文翻译中英文翻译
DevelopmentofMEMSVerticalPlanarCoilInductorsThroughPlasticDeformationMagneticAssembly(PDMA)
JinghongChen*,JunZou**,ChangLiu**andSung-Mo(Steve)Kang***
AgereSystems,Holmdel,NJ07733
DepartmentofElectricalandComputerEngineering,
UniversityofIllinoisatUrbana-Champaign,Urbana,IL61801JackBaskinSchoolofEngineering,UniversityofCalifornia,SantaCruz
ABSTRACT
Thispaperpresentstheresultsofthedevelopmentofaverticalplanarcoilinductor.Theplanarcoilinductorisfirstfabricatedonsiliconsubstrateandthenassembledtotheverticalpositionbyusinganovel3-Dimensionalbathscaleself-assemblyprocess(PlasticDeformationMagneticAssembly(PDMA)).Inductorsofdifferentdimensionsarefabricatedandtested.TheS-parametersoftheinductorsbeforeandafterPDMAaremeasuredandcompared,demonstratingsuperiorperformanceduetoreducedsubstrateeffectsandalsoincreasedsubstratespacesavingsfortheverticalplanarcoilinductors.
Keywords:
MEMS,planarcoilinductor,qualityfactor,PDMA,resonancefrequency.
1INTRODUCTION
Withthedevelopmentofintegratedwirelesscommunicationsystems,on-chipinductorswithsatisfactoryperformance(enoughqualityfactorandselfresonantfrequency)arerequired.However,theconventionalplanarcoilinductorsuffersfromsubstratelossesandparasiticssinceitisdirectlyfabricatedontoconductivesubstrateoveraverythindielectriclayer[1].
Inrecentyears,muchefforthasbeenmadetoimprovetheperformanceofplanarcoilinductors.Metalmaterialswithhigherconductivityorthickermetallayersareutilizedtodecreasetheresistanceofthecoil.Meanwhile,differentmethodsareproposedtoreducethesubstratelossandparasitics,includingremovingthesubstrateunderneaththeinductor[2],applyingathickpolymidelayertoseparatetheinductorfartherawayfromthe
substrate[3],etc.Morerecently,planarcoilinductorslevitatedabovethesubstratearerealizedusingasacrificialmetallicmode(SMM)process[4].3-Dimensionalsolenoidon-chipinductorsdevelopedbyusing3-Dlaserlithographyorsurfacemicromachiningtechnologyhavealsobeendemonstrated[5,6].Thispaperreportsverticalplanarcoilinductorsdevelopedbyusinganovel3-Dself-assemblyprocess-PlasticDeformationMagneticAssembly(PDMA).Experimentalresultsshowthattheverticalplanarcoilinductorsufferslesssubstratelossandparasiticsthantheconventionalhorizontalcounterparts,andthuscanachieveahigherquality(Q)factorandself-resonantfrequency.Anothermajoradvantageoftheverticalinductorsisthattheyhavealmostzerofootprintsandthusoccupymuchsmallersubstratespace.
2PLASTICDEFORMATIONMAGNETICASSEMBLY(PDMA)
Fig.1AschematicillustrationofaPlasticDeformation
MagneticAssemblyprocess(PDMA)
PDMAisthekeytechnologytorealizetheverticalplanarcoilinductors.Adetaileddiscussionofthisassemblyprocesswillbepresentedinotherpublications.AbriefintroductionofPDMAisgivenbelowbyusinga
cantileverbeamasanexample.Notethattheregionnearthefixedendisintentionallymademoreflexible.First,acantileverbeamwithapieceofmagneticmaterialattachedtoitstopsurfaceisreleasedfromthesubstratebyetchingawaythesacrificiallayerunderneath(Fig.1(a)).Next,a
magneticfieldHextisapplied,themagneticmaterialpieceismagnetizedandthecantileverbeamwillberotatedoffthesubstratebythemagnetictorquegeneratedinthemagneticmaterialpiece(Fig.1(b)).Ifthestructureisdesignedproperly,thisbendingwillcreateaplasticdeformationintheflexibleregion.Thecantileverbeamwillthenbeabletoremainatacertainrestangle(φ)abovethesubstrateevenafterHextisremoved(Figure1(c)).Byusingductilemetal(e.g.gold)intheflexibleregion,agoodelectricalconnectionbetweentheassembledstructureandthesubstratecanbeeasilyachieved,whichissuitableforRFapplications.Aftertheverticalassembly,thestructurescanbefurtherstrengthenedandthemagneticmaterialcanberemovedifnecessary.Ifthemagneticfieldisappliedglobally,then
allthestructuresononesubstratecanbeassembledinparallel.
3DESIGNANDFABRICATION
Thecorestructureoftheverticalplanarcoilinductorisidenticaltotheconventionalhorizontalone,whichconsistsoftwometallayersandonedielectriclayerbetween.Asageneralrule,highconductivitymetaland
lowlossdielectricmaterialshouldbeused.Inadditiontothisrequirement,thestructureoftheinductorshouldfacilitatetheimplementationofPDMA.
Theverticalplanarcoilinductorutilizesone-portcoplanarwaveguide(CPW)configurationwith3testpads(Ground-Signal-Ground)withapitchof150μm.Thethreetestpadsalsoserveastheanchoroftheverticalinductorsonthesubstrate.
3.1MaterialConsideration
Goldisuse