通信类外文翻译中英文翻译.docx

1、通信类外文翻译中英文翻译Development of MEMS Vertical Planar Coil Inductors Through Plastic Deformation Magnetic Assembly (PDMA)Jinghong Chen*, Jun Zou*, Chang Liu* and Sung-Mo (Steve) Kang*Agere Systems, Holmdel, NJ 07733Department of Electrical and Computer Engineering,University of Illinois at Urbana-Champaig

2、n, Urbana, IL 61801 Jack Baskin School of Engineering, University of California, Santa CruzABSTRACTThis paper presents the results of the development of a vertical planar coil inductor. The planar coil inductor is first fabricated on silicon substrate and then assembled to the vertical position by u

3、sing a novel 3-Dimensional bathscale self-assembly process (Plastic Deformation Magnetic Assembly (PDMA). Inductors of different dimensions are fabricated and tested. The S-parameters of the inductors before and after PDMA are measured and compared,demonstrating superior performance due to reduced s

4、ubstrate effects and also increased substrate space savings for the vertical planar coil inductors.Keywords: MEMS, planar coil inductor, quality factor,PDMA, resonance frequency.1 INTRODUCTIONWith the development of integrated wireless communication systems, on-chip inductors with satisfactory perfo

5、rmance (enough quality factor and selfresonant frequency) are required. However, the conventional planar coil inductor suffers from substrate losses and parasitics since it is directly fabricated onto conductive substrate over a very thin dielectric layer 1.In recent years, much effort has been made

6、 to improve the performance of planar coil inductors. Metal materials with higher conductivity or thicker metal layers are utilized to decrease the resistance of the coil. Meanwhile,different methods are proposed to reduce the substrate loss and parasitics, including removing the substrate underneat

7、h the inductor 2, applying a thick polymide layer to separate the inductor farther away from thesubstrate 3, etc. More recently, planar coil inductors levitated above the substrate are realized using a sacrificial metallic mode (SMM) process 4. 3-Dimensional solenoid on-chip inductors developed by u

8、sing 3-D laser lithography or surface micromachining technology have also been demonstrated 5,6. This paper reports vertical planar coil inductors developed by using a novel 3-D self-assembly process-Plastic Deformation Magnetic Assembly (PDMA).Experimental results show that the vertical planar coil

9、 inductor suffers less substrate loss and parasitics than the conventional horizontal counterparts, and thus can achieve a higher quality (Q) factor and self-resonant frequency. Another major advantage of the vertical inductors is that they have almost zero footprints and thus occupy much smaller su

10、bstrate space.2 PLASTIC DEFORMATION MAGNETIC ASSEMBLY (PDMA)Fig. 1 A schematic illustration of a Plastic DeformationMagnetic Assembly process (PDMA)PDMA is the key technology to realize the vertical planar coil inductors. A detailed discussion of this assembly process will be presented in other publ

11、ications. A brief introduction of PDMA is given below by using acantilever beam as an example. Note that the region near the fixed end is intentionally made more flexible. First, a cantilever beam with a piece of magnetic material attached to its top surface is released from the substrate by etching

12、 away the sacrificial layer underneath (Fig. 1(a). Next, amagnetic field Hext is applied, the magnetic material piece is magnetized and the cantilever beam will be rotated off the substrate by the magnetic torque generated in the magnetic material piece (Fig. 1(b). If the structure is designed prope

13、rly, this bending will create a plastic deformation in the flexible region. The cantilever beam will then be able to remain at a certain rest angle ( ) above the substrate even after Hext is removed (Figure 1(c). By using ductile metal (e.g. gold) in the flexible region, a good electrical connection

14、 between the assembled structure and the substrate can be easily achieved, which is suitable for RF applications. After the vertical assembly, the structures can be further strengthened and the magnetic material can be removed if necessary. If the magnetic field is applied globally, thenall the stru

15、ctures on one substrate can be assembled in parallel.3 DESIGN AND FABRICATIONThe core structure of the vertical planar coil inductor is identical to the conventional horizontal one, which consists of two metal layers and one dielectric layer between. As a general rule, high conductivity metal andlow

16、 loss dielectric material should be used. In addition to this requirement, the structure of the inductor should facilitate the implementation of PDMA.The vertical planar coil inductor utilizes one-port coplanar waveguide (CPW) configuration with 3 test pads (Ground-Signal-Ground) with a pitch of 150m. The three test pads also serve as the anchor of the vertical inductors on the substrate.3.1 Material ConsiderationGold is use