电子厂员工培训教材1.docx

电子厂员工培训教材1.docx

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电子厂员工培训教材1

培训教材

文件编号

DOCUMENTNO：

发行版本

VERSION：

数页

PAGINATION:

69

APPROVAL核准插的位置。

2.轴向引线元件——是一种只有两个管脚的元件，管脚在元件的两端反向伸出。

3.单端引线元件

4.印刷电路板（PCB）——还没有插元件的电路板。

5.成品电路板（PCP）——已经插好元件的印刷电路板。

6.单面板——电路板上只有一面用金属处理。

7.双面板——上、下两面都有线路的电路板。

文件编码:

XX-3-SOP-P-020XXXX科技（深圳）有限公司版本：

A.0培训教材页数：

2OF69

标第一章基础培训教材制订日期：

常用术语解释

（一）第一节题．

9.焊盘——PCB表面处理加宽局部引线，无绝缘漆覆盖的部分面积，用来连接元件、明线等等。

可以包括元件管脚洞。

10.元件面——即是电路板上插元件的一面。

11.焊接面——电路板中元件面的反面，有许多焊盘提供焊接用。

12.元件符号——每种元件，比如说电阻和电容，都有一个元件符号，这些符号通常被标在电路板的元件面上。

不同种类的元件用不同的字母识别，在同种类的元件中，用不同的数字从所有其它项目中识别出来。

例：

电容的元件符号为C，一块电路板上有7个电容，可分别表示为C4、C5、C10、C15、C16、C39、C40。

13.母板——插着子板的电路板是母板。

子板常插入母板的插座中。

14.金属化孔（PTH）——金属管穿过电路板孔洞的表面，连接双面板上的两面电路，在多层板中还起到连接内部电路的作用。

15.连接孔——那些一般不用来插元件和布明线的金属化孔。

16.极性元件——有些元件，插入电路板时必需定向，否则元件就有可能在测试时被融化或发生爆炸。

17.极性标志——在印刷电路板上，极性元件的位置印有极性符号，以方便正确插入元件。

18.导体——是指具有良好导电能力的物体。

如：

大部分金属材料。

人也是导体。

19.绝缘体——指导电性能差的物体，通俗一点的说法就是不导电的物体。

例如：

塑料、竹子、木头等。

文件编码：

XX-3-SOP-P-020XXXX科技（深圳）有限公司版本：

A.0培训教材页数：

3OF69

标第一章基础培训教材制订日期：

常用术语解释

（一）第一节题．

22．套管——绝缘管套在管脚上，防止管脚靠着其它的元件管脚、金属线或电路。

套管

23．阻抗——使电流流动缓慢。

24．管脚打弯——当元件的管脚插入电路板的洞时，管脚应靠着洞边打弯，所打弯的管脚与垂直方向0，这样可预防元件在焊接时掉下来。

45的夹角大于

25．预面型——为了预防元件主体和板之间的接触，可在元件没有插入电路板之前对元件管脚预先整型，经过预先整型的管脚插入板时有“劈啪”声，管脚不需要再打弯。

文件编码：

XX-3-SOP-P-020XXXX科技（深圳）有限公司版本：

培训教材页数：

4OF69

标第一章基础培训教材制订日期：

（二）常用术语解释第一节题．

3．冷焊——锡或锡膏在回风炉气化后，在锡垫上仍有模糊的粒状附着物。

4．桥接——有脚零件在脚与脚之间被多余之焊锡所联接短路，另一种现象则因检验人员使用镊子、竹签…等操作不当而导致脚与脚碰触短路，亦或刮

5．错件6．缺件7．极性反向8．零件倒置

9．零件偏位10．锡垫损伤——锡垫（PAD）在正常制程中，经过回风炉气化熔接时，不能损伤锡垫，一般锡垫损伤之原因，为修补时使用烙铁不当导致锡垫被破坏，轻者可修复正常出货，严重者列入次级品判定，亦或移植报废。

11．污染不洁——SMT加工作业不良，造成板面不洁或CHIPS脚与脚之间附有异物，或CHIPS修补不良、有点胶、防焊点沾漆均视为不合格品。

但修补品可视情形列入次级品判定。

12．SMT爆板——PC板在经过回风炉高温时，因板子本身材质不良或回风炉之温度异常，造成板子离层起泡或白斑现象属不良品。

13．包焊——焊点焊锡过多，看不到零件脚或其轮廓者。

14．锡球、锡渣——PCB板表面附着多余的焊锡球、锡渣，一律拒收。

15．异物——残脚、铁屑、钉书针等粘附板面上或卡在零件脚间，一律拒收。

16．污染——严重之不洁，如零件焊锡污染氧化，板面残余松香未清除，清洗不注意使CHIPS污染氧化及清洗不洁（例如SLOT槽不洁，SIMM不洁，板面CHIP或SLOT旁不洁，SLOT内侧上附有许多微小锡粒，PC板表面水纹…等）现象，则不予允收。

17．跷皮——与零件脚相关之接垫不得有超过10%以上之裂隙，无关之接垫与铜箔线路不得有超过25%以上之裂隙。

18．板弯变形——板子弯曲变形超过板子对角长度0.5%以上者，则判定拒收。

29．撞角、板伤——不正常缘故产生之板子损伤，若修复良好可以合格品允收，否则列入次级品判定。

20．DIP爆板——PC板在经过DIP高温时，因PC板本身材质不良或锡炉焊点温度过高，造成PC板离层起泡或白斑现象则属不良品。

21．跪脚——CACHERAM、K/BB10S…等零件PIN打折形成跪脚。

22．浮件——零件依规定须插到底（平贴）或定位孔，浮件判定标准为SLOT、SIMM浮高不得超过0.5mm，传统零件以不超过1.59mm为宜。

23．刮伤——注意PC板堆积防护不当或重工防护不当产生刮伤问题。

24．PC板异色——因回流焊造成板子颜色变暗或因烘烤不当变黄、变黑均不予以允收。

但视情形可列入次级品判定允收。

25．修补不良——修补线路未平贴基板或修补线路未作防焊处理，亦或有焊点残余松香未清理者。

文件编码：

XX-3-SOP-P-020XXXX科技（深圳）有限公司版本：

A.0培训教材页数：

5OF69

标第一章基础培训教材制订日期：

（二）常用术语解释第一节题．

REVIEW/CHECK审核

DRAFTING拟制CHIPS脚造成残余锡渣使脚与脚短路。

ISSUEDATE

发行日期

——元件的管脚在元件主体的同一端伸出。

——零件放置之规格或种类与作业规定或——应放置零件之位址，因不正常之缘故而产生空缺。

——极性方位正确性与加工工程样品装配不一样，即为极性错误。

——SMT之零件不得倒置，另——SMT所有之零件表面接着焊接点与

CR因底部全白无规格标示，虽无极性也不可倾倒放置。

BOM、ECN不符者，即为错件。

PAD位偏移不可超过

1/2面积。

培训教材目录

第一章基础培训教材第一节常用术语解释

（一）··············································································1

1．组装图··········································································1

2．轴向引线元件··································································1

3．单端引线元件··································································1

4．印刷电路板····································································1

5．成品电路板·····································································1

6．单面板···········································································1

7．双面板···········································································1

8．层板··············································································2

9．焊盘····························································································2

2········································································10．元件面

2·····································································11．焊接面···2···································································12．元件符号·2·································································13．母板············2·························PTH）······························14．金属化孔（·2···························································15．连接孔·············2·························································16．极性元件············2······················································17．极性标志·················2····················································18．导体······················2·················································19．绝缘体·······················3···············································20．半导体························3··············································21．双面直插·························3···········································22．套管································3·········································23．阻脚····································3······································24．管脚打弯······························3··········································································25．预面型·················

第一节常用术语解释

（二）·····················································································4

1．空焊··············································································4

2．假焊·······························································································4

3．冷焊·······························································································4

4．桥接·······························································································4

5．错件··············································································4

6．缺件··············································································4

7．极性反向········································································4

8．零件倒置·······································································4

9．零件偏位·························································································4

10．锡垫损伤·······································································4

4····································11．污染不洁··································4············································································．爆板12．

13．包焊··········································································4

14．锡球·············································································4

15．异物·············································································4

16．污染···········································································4

17．跷皮···········································································4

18板弯变形··························································································4

19．撞角、板伤···································································4

20．爆板······························································································4

21．跪脚····························································································4

22．浮高············································································4

4······································23．刮伤······································4···································24．PCB板异物·····························4··································25．修补不良·······································5·································································26．实体·····5·································································27．过程··········5·····························································28．程序·············5··························································29．检验················5·······················································30．合格····················5····················································31．不合格························5·············································32．缺陷···························5············································33．质量要求························5·········································34．自检···································5

·····································35．服务·······································6································第二节电子元件基础知识·······································6·······························

（一）阻器和电容器···········································

·6·······································································1．种类········6································································2．电阻的单位······················6··········································3．功率··················6······················································4．误差··························6-8··············································5．电阻的标识方法············8············································6．功率电阻·····························8-9·····································7．电阻网络································9································8．电位器·······························································9·······9．热敏电阻器··········································9····································································10．可变电阻器10···························································

（二）电容器·······················10···············································1．概念和作用·····················································10·····2．电路符号········································10·····················3．类型···········