SK6812WWA三芯片白光LED灯珠英文规格书.docx
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SK6812WWA三芯片白光LED灯珠英文规格书
SK6812WWA
SPECIFICATION
INTEGRATEDLIGHTSOURCEINTELLIGENTCONTROLOF
CHIP-ON-TOPSMDTYPELED
DocumentNo.:
SPC/SK6812WWA
ModelNo.:
SK6812WWA
Description:
5.5x5.0x1.6mmTopSMDType0.2WattPowertegrated
lightsourceIntelligentcontrolLED
Rev.No.:
01
Date:
2015-07-08
INTEGRATEDLIGHTSOURCEINTELLIGENTCONTROL
OFCHIP-ON-TOPSMDTYPELED
Model:
SK6812WWA-XX
1.ProductOverview:
SK6812WWAisasmartLEDcontrolcircuitandlightemittingcircuitinonecontrolledLEDsource,
whichhastheshapeofa5050LEDchip.Eachlightingelementisapixel,andtheintensitiesofthe
pixelsarecontainedwithintheintelligentdigitalinterfaceinput.TheoutputisdrivenbypatentedPWM
technology,whicheffectivelyguaranteeshighconsistencyofthecolorofthepixels.Thecontrol
circuitconsistsofasignalshapingamplificationcircuit,abuilt-inconstantcurrentcircuit,andahigh
precisionRCoscillator.
ThedataprotocolbeingusedisunipolarNRZcommunicationmode.The24-bitdataistransmitted
fromthecontrollertoDINofthefirstelement,andifitisaccepteditisextractedpixeltopixel.Afteran
internaldatalatch,theremainingdataispassedthroughtheinternalamplificationcircuitandsentout
ontheDOporttotheremainingpixels.ThepixelisresetaftertheendofDIN.Usingautomatic
shapingforwardingtechnologymakesthenumberofcascadedpixelswithoutsignaltransmissiononly
limitedbysignaltransmissionspeed.
TheLEDhasalowdrivingvoltage(whichallowsforenvironmentalprotectionandenergysaving),
highbrightness,scatteringangle,goodconsistency,lowpower,andlonglife.Thecontrolcircuitis
integratedintheLEDabove.
2.MainApplicationField:
●FullcolorLEDstringlight,LEDfullcolormodule,LEDsuperhardandsoftlights,LEDguardrailtube,
LEDappearance/scenelighting
●LEDpointlight,LEDpixelscreen,LEDshapedscreen,avarietyofelectronicproducts,electrical
equipmentetc..
3.Description:
●TopSMDinternalintegratedhighqualityexternalcontrollineserialcascadeconstantcurrentIC;
●controlcircuitandthechipinSMD5050components,toformacompletecontrolofpixel,color
mixinguniformityandconsistency;
●built-indatashapingcircuit,apixelsignalisreceivedafterwaveshapingandoutputwaveform
distortionwillnotguaranteealine;
●Thebuilt-inpoweronresetandresetcircuit,thepowerdoesnotwork;
●grayleveladjustingcircuit(256levelgrayscaleadjustable);
●reddrivespecialtreatment,colorbalance;
●linedatatransmission;
●plasticforwardstrengtheningtechnology,thetransmissiondistancebetweentwopointsover10M;
●Usingatypicaldatatransmissionfrequencyof800Kbps,whentherefreshrateof30framespersec
4.MechanicalDimensions:
5.PINconfiguration
1.Features
ThePurposesofmakingOPSCO’scustomersanduserstohaveaclearunderstandingonthewayshowto
usetheLED.
2.Description
Generally.TheLEDcanbeusedthesamewayasothergeneralpurposedsemiconductors.Whenusing
OPSCO’sTOPSMDLED,thefollowingprecautionsmustbetakentoprotecttheLED.
3.Cautions
3.1.Dust&Cleaning
3.2.MoistureProofPackage
Inordertoavoidtheabsorptionofmoistureduringtransportationandstorage,LEDarepackedinthe
aluminumenvelop,Adesiccantisincludedinthealuminumenvelopasitabsorbsmoisture.When
moistureisabsorbedintotheAMTpackageitmayvaporizeandexpandduringsoldering.Thereisa
possibilitythatthiscancauseexfoliationofthecontactsanddamagetotheopticalcharacteristicsofthe
LEDs.Forthisreason,themoistureproofpackageisusedtokeepmoisturetoaminimuminthepackage.
3.3.Storage
Inordertoavoidtheabsorptionofmoisture,ItisrecommendedtostoreSMDLED(inbulkortaped)inthe
drybox(orthedesiccator)withadesiccant,Otherwisetostoretheminthefollowingenvironmentas
recommended.
a.Temperature:
5℃~30℃b.Humidity:
60%RHMax
ItisrecommendedtosoldertheLEDassoonaspossibleafterunpackingthealuminumenvelop,Butincase
thattheLEDhavetobeleftunusedafterunpackingenvelopagainisrequested.
TheLEDshouldbesolderingwithin1hoursafteropeningthepackage.
Ifbakingisrequired,Abakingtreatmentshouldbeperformedasfollows:
70℃±5℃formorethan24hours.
Thisemitterhasasiliconesurface,Therearemanybenefitstothesiliconesurfaceintermsofoptical
propertiesandimprovedreliability.However,siliconeisasoftermaterialandpronetoattractdust.Whilea
minimalamountofdustanddebrisontheLEDwillnotcausesignificantreductioninillumination,steps
shouldbetakentokeeptheemitterfreeofdust.
TheseincludekeepingtheLEDsinthemanufacturer’spackagepriortoassemblyandstoringassembliesin
anenclosedarea