SK6812WWA三芯片白光LED灯珠英文规格书.docx

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SK6812WWA三芯片白光LED灯珠英文规格书.docx

SK6812WWA三芯片白光LED灯珠英文规格书

SK6812WWA

SPECIFICATION

INTEGRATEDLIGHTSOURCEINTELLIGENTCONTROLOF

CHIP-ON-TOPSMDTYPELED

DocumentNo.:

SPC/SK6812WWA

ModelNo.:

SK6812WWA

Description:

5.5x5.0x1.6mmTopSMDType0.2WattPowertegrated

lightsourceIntelligentcontrolLED

Rev.No.:

01

Date:

2015-07-08

 

 

INTEGRATEDLIGHTSOURCEINTELLIGENTCONTROL

OFCHIP-ON-TOPSMDTYPELED

Model:

SK6812WWA-XX

1.ProductOverview:

SK6812WWAisasmartLEDcontrolcircuitandlightemittingcircuitinonecontrolledLEDsource,

whichhastheshapeofa5050LEDchip.Eachlightingelementisapixel,andtheintensitiesofthe

pixelsarecontainedwithintheintelligentdigitalinterfaceinput.TheoutputisdrivenbypatentedPWM

technology,whicheffectivelyguaranteeshighconsistencyofthecolorofthepixels.Thecontrol

circuitconsistsofasignalshapingamplificationcircuit,abuilt-inconstantcurrentcircuit,andahigh

precisionRCoscillator.

ThedataprotocolbeingusedisunipolarNRZcommunicationmode.The24-bitdataistransmitted

fromthecontrollertoDINofthefirstelement,andifitisaccepteditisextractedpixeltopixel.Afteran

internaldatalatch,theremainingdataispassedthroughtheinternalamplificationcircuitandsentout

ontheDOporttotheremainingpixels.ThepixelisresetaftertheendofDIN.Usingautomatic

shapingforwardingtechnologymakesthenumberofcascadedpixelswithoutsignaltransmissiononly

limitedbysignaltransmissionspeed.

TheLEDhasalowdrivingvoltage(whichallowsforenvironmentalprotectionandenergysaving),

highbrightness,scatteringangle,goodconsistency,lowpower,andlonglife.Thecontrolcircuitis

integratedintheLEDabove.

2.MainApplicationField:

●FullcolorLEDstringlight,LEDfullcolormodule,LEDsuperhardandsoftlights,LEDguardrailtube,

LEDappearance/scenelighting

●LEDpointlight,LEDpixelscreen,LEDshapedscreen,avarietyofelectronicproducts,electrical

equipmentetc..

3.Description:

●TopSMDinternalintegratedhighqualityexternalcontrollineserialcascadeconstantcurrentIC;

●controlcircuitandthechipinSMD5050components,toformacompletecontrolofpixel,color

mixinguniformityandconsistency;

●built-indatashapingcircuit,apixelsignalisreceivedafterwaveshapingandoutputwaveform

distortionwillnotguaranteealine;

●Thebuilt-inpoweronresetandresetcircuit,thepowerdoesnotwork;

●grayleveladjustingcircuit(256levelgrayscaleadjustable);

●reddrivespecialtreatment,colorbalance;

●linedatatransmission;

●plasticforwardstrengtheningtechnology,thetransmissiondistancebetweentwopointsover10M;

●Usingatypicaldatatransmissionfrequencyof800Kbps,whentherefreshrateof30framespersec

4.MechanicalDimensions:

5.PINconfiguration

 

 

 

 

 

 

 

1.Features

ThePurposesofmakingOPSCO’scustomersanduserstohaveaclearunderstandingonthewayshowto

usetheLED.

2.Description

Generally.TheLEDcanbeusedthesamewayasothergeneralpurposedsemiconductors.Whenusing

OPSCO’sTOPSMDLED,thefollowingprecautionsmustbetakentoprotecttheLED.

3.Cautions

3.1.Dust&Cleaning

3.2.MoistureProofPackage

Inordertoavoidtheabsorptionofmoistureduringtransportationandstorage,LEDarepackedinthe

aluminumenvelop,Adesiccantisincludedinthealuminumenvelopasitabsorbsmoisture.When

moistureisabsorbedintotheAMTpackageitmayvaporizeandexpandduringsoldering.Thereisa

possibilitythatthiscancauseexfoliationofthecontactsanddamagetotheopticalcharacteristicsofthe

LEDs.Forthisreason,themoistureproofpackageisusedtokeepmoisturetoaminimuminthepackage.

3.3.Storage

Inordertoavoidtheabsorptionofmoisture,ItisrecommendedtostoreSMDLED(inbulkortaped)inthe

drybox(orthedesiccator)withadesiccant,Otherwisetostoretheminthefollowingenvironmentas

recommended.

a.Temperature:

5℃~30℃b.Humidity:

60%RHMax

ItisrecommendedtosoldertheLEDassoonaspossibleafterunpackingthealuminumenvelop,Butincase

thattheLEDhavetobeleftunusedafterunpackingenvelopagainisrequested.

TheLEDshouldbesolderingwithin1hoursafteropeningthepackage.

Ifbakingisrequired,Abakingtreatmentshouldbeperformedasfollows:

70℃±5℃formorethan24hours.

Thisemitterhasasiliconesurface,Therearemanybenefitstothesiliconesurfaceintermsofoptical

propertiesandimprovedreliability.However,siliconeisasoftermaterialandpronetoattractdust.Whilea

minimalamountofdustanddebrisontheLEDwillnotcausesignificantreductioninillumination,steps

shouldbetakentokeeptheemitterfreeofdust.

TheseincludekeepingtheLEDsinthemanufacturer’spackagepriortoassemblyandstoringassembliesin

anenclosedarea

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