印制电路板dfm通用技术要求General specification for printed circuit board DFM.docx

印制电路板dfm通用技术要求General specification for printed circuit board DFM.docx

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印制电路板dfm通用技术要求GeneralspecificationforprintedcircuitboardDFM

印制电路板dfm通用技术要求（GeneralspecificationforprintedcircuitboardDFM）

GeneralspecificationforprintedcircuitboardDFM

Thisstandardspecifiesthegeneralrequirementsfordesignformanufacturingsinglesidedprintedcircuitboard,includingmaterials,dimensionsandtolerances,printedwiresandpads,metalholes,holes,mountingholes,coating,coating,characterandmark.Asdesignersofprintedboards,designasingle,doublesided（Single/Double,sided,board）reference:

1Generalrequirements

1.1.ThisstandardservesasageneralrequirementforPCBdesign,specificationsforPCBdesignandmanufacturing,andeffectivecommunicationbetweenCADandCAM.

1.2weshallgiveprioritytothedesigndrawingsanddocumentsasthebasisforproductionintheprocessofdocumentation.

2PCBmaterial

2.1substrate

PCBsubstrateisusuallymadeofepoxyglassclothcoveredwithcopperplate,thatisFR4.（includingsinglepanel）

2.2copperfoil

A）morethan99.9%ofelectrolyticcopper;

B）doubleplatesurfacecopperfoilthicknessmorethan35m（1OZ）;specialrequirements,specifiedinthedrawingsordocuments.

3,PCBstructure,sizeandtolerance

3.1structure

（a）thedesignelementsthatconstitutethePCBshallbedescribedinthedesigndrawings.TheappearanceshallbeuniformlyexpressedbyMechanical1,layer（priority）orKeepoutlayer.Ifusedinthedesigndocumentatthesametime,thegeneralkeepoutlayerisusedforshieldingwithoutopening,andmechanical1isusedtorepresenttheforming.

（b）inthedesigndrawingsforopeninglongSLOTholesorhollowout,withMechanical1layerdrawthecorrespondingshapecan.

3.2platethicknesstolerance

Finishedplatethickness

0.4~1.0mm

1.1~2.0mm

2.1~3.0mm

tolerance

+0.13MM

+0.18mm

+0.2mm

3.3dimensionaltolerances

PCBtheoveralldimensionsshallcomplywiththerequirementsofthedesigndrawings.Whenthedrawingsarenotspecified,theoveralldimensiontoleranceis+0.2mm.（exceptforV-CUTproducts）

3.4flatness（warpage）tolerances

TheflatnessofPCBshallbeinaccordancewiththedesigndrawings.Whenthedrawingsarenotspecified,followthefollowing

Finishedplatethickness

0.4~1.0mm

1.0~3.0mm

Warpage

SMT=0.7%;SMT=1.3%

SMT=0.7%;SMT=1%

4printedwiringandpads

4.1layout

A）thelayout,linewidthandlinespacingofprintedwiresandpadsshallbespecifiedinaccordancewiththedesigndrawings.Butwewillhavethefollowingtreatment:

appropriateaccordingtoprocessrequirementsforlinewidth,PADringwidthcompensation,singlepanelgeneral,wewilltrytoincreasePAD,inordertostrengthenthereliabilityofcustomerwelding.

（b）whenthedesignlinespacingisnotuptothetechnicalrequirements（toocloselyaffectingperformanceandManufacturability）,weshalladjustthedesignspecificationsaccordingtothepresystemdesign.

C）weadvisecustomerstodesignsingleanddoubleboardsinprinciple.Thediameterofthroughhole（VIA）ismorethan0.3mm,theouterdiameterismorethan0.7mm,thedistancebetweenlinesis8mil,andthelinewidthisabove8mil.Tominimizetheproductioncycle,reducemanufacturingdifficulties.

D）ourminimumdrillingtoolis0.3,theproductisabout0.15mm.Theminimumlinespacingis6mil.Theminimumlinewidthis6mil.（butthemanufacturingcycleislongerandthecostishigher）

4.2wirewidthtolerance

Internalcontrolstandardforwidthtoleranceofprintedwiringis+15%

4.3meshprocessing

（a）inordertoavoidfoamingandheatingofcoppersurfacewhenwavesolderingoccurs,thePCBplateisbentduetothermalstress,andthelargecoppersurfaceisrecommendedtobelaidinagridform.

B）thegridspacingislargerthan10mil（lessthan8mil）,thegridwidthisgreaterthanorequalto10mil（lessthan8mil）.

4.4heatshield（Thermalpad）processing

Onthegroundoflargearea（electric）,oftenwithcomponentsofthelegsareconnectedtotheconnectinglegs,bothelectricalpropertiesandprocessrequirements,madeofcrossflowerpad（heatinsulationplate）,thepossibilityofresultingweldpointduetoexcessiveheatintheweldingsectionisgreatlyreduced.

5aperture（HOLE）

5.1definitionofmetallization（PHT）andnonmetallization（NPTH）

A）ourcompanydefaultstothenon-metallicholeasfollows:

WhentheclientsetsuptheKongFeimetallizationpropertyintheProtel99seadvancedproperties（platedtabremovedfromtheAdvancedmenu）,wedefaulttoanon-metallichole.

Whenthecustomerdirectlyusesthekeep,out,layerormechanical1layersofarctoindicatethedrilling（nomoreseparateholes）inthedesigndocument,wewillacceptthenon-metallicholeasthedefault.

Whenthecustomerplacedtheword"NPTH"nearthehole,weareresponsibleforthenon-metallizationofthehole.

Whenthecustomerexplicitlycallsforthecorrespondingaperturenon-metallization（NPTH）inthedesignnotice,theyareprocessedaccordingtothecustomer'srequirements.

（b）inadditiontotheaboveconditions,thecomponents,holes,mountingholes,andthroughholesshallbemetallized.

5.2holesizeandtolerance

（a）thePCBelementholesandmountingholesinthedesigndrawingsassumethefinalproductaperturesize.Theaperturetoleranceisusually+3mil（0.08mm）;

B）thethroughhole（thatisVIAhole）weusuallycontrolitasfollows:

thenegativetoleranceisnotrequired,andthepositivetoleranceislessthan+3mil（0.08mm）.

5.3thickness

Theaveragethicknessofthecopperplatedlayerofmetallizedholeisnotlessthan20m,andthethinnestisnolessthan18mum.

5.4holeroughness

PTHholewallroughnessiscontrolledinlessthan32um

5.5PINholeproblem

A）ourCNCmillingmachinepositioningpinis0.9mmminimum,andthepositioningofthethreePINholesshouldbetriangular.

（b）whenthecustomerhasnospecialrequirementandthedesignboreboreislessthan0.9mm,wewilladdthePINholeattheappropriatepositionoftheblankwirelesschannelorthebigcoppersurfaceintheboard.

Designof5.6SLOThole（slot）

A）itisrecommendedthattheSLOTholebedrawnwithMechanical1layer（Keep,out,layer）.Itcanalsobeexpressedasacontinuoushole,buttheholesshouldbeofthesamesizeandthecenteroftheholeisonthesamehorizontalline.

B）oursmallestslotknifeis0.65mm.

C）whentheSLOTholeisusedtoshieldandavoidcreepagebetweenthehighandlowpressure,itissuggestedthatthediameterisabove1.2mmtofacilitateprocessing.

6solderlayer

6.1coatingpartsanddefects

A）thesoldercoatingshallbeappliedtothePCBsurfaceexceptthesolderpads,MARKpoints,testpoints,etc..

（b）ifacustomerusesadiskrepresentedbyFILLorTRACK,acorrespondingsizegraphmustbedrawnonthesolderresist（Solder,mask）layertoindicatethepresenceoftinatthesite.（IstronglyrecommendthattherebenononPADformbeforedesign）

（c）ifthesolderneedstobecooledonalargecoppersheetorsprayedonanonlinebar,acorrespondingsizepatternmustalsobepaintedonthemask（Solder）layertoindicatethepresenceoftin.

6.2adhesion

Theadhesionofthesolderresistisrequiredbylevel2ofIPC-A-600FintheUnitedstates.

6.3thickness

Thethicknessofthesolderresistconformstothefollowingtable:

Linesurface

Linecorner

Substratesurface

Morethan10m

Morethan8m

20~30mum

7charactersandetchmarks

7.1basicrequirements

A）thecharactersofPCBshouldbedesignedbywordheight30mil,wordwidth5MIL,characterspacing4milormore,soasnottoaffectthedifferentiabilityoftext.

B）etching（metal）charactersshouldnotbebridgedwithwiresandtoensureadequateelectricalclearance.Generaldesignaccordingtowordheight30mil,wordwidth7milabovedesign.

（c）whenthecustomercharactersarenotclearlydefined,ourcompanywilladjusttheproportionofcharactersaccordingtothetechnicalrequirementsofourcompany.

D）whenthereisnoclearcustomer,wewillinthesilkprintinglayeristheproperpositionofourprintedtrademark,materialnumberandcycleaccordingtotherequirementsofourtechnology.

7.2PAD\SMTprocessingontext

Disc（PAD）canbeasilkscreenlogo,inordertoavoid.WhenthecustomerhasthedesignofPAD\SMT,ourcompanywilldopropermovementprocessing,theprincipleisthatitdoesnotaffecttheidentityofitsidentificationanddevice.

Theconceptof8layersandtheprocessingofMARKpoints

Layerdesign

Eight

1doublepanel,wedefaulttothetop（ieTop,layer）fortheface,topoverlayscreenlayercharactersarepositive.

8.2,singlepaneltotop（Top,layer）paintedcircuitlayer（Signallayer）,itmeansthatthelineisfacingtheface.

8.3,singlepaneltothebottom（Top,layer）paintedcircuitlayer（Signallayer）,thatthelayerisaperspectiveline.

DesignofMARKpoints

8.4whenthecustomerhasasurfacemount（SMT）fortheboardfile,itshouldbeplacedMARKatthepointofMark,andthecirclediameteris1.0mm.

8.5whenthecustomerhasnospecialrequirements,weputanarcofF1.5mmontheSolderMasklayertorepresentthefluxfreetoenhancetheidentifiability.

8.6whenthecustomerisasplicingboardfilesurfacepatchprocesssidedidnotputMARK,ourgeneralintheprocessofedgepositionofthediagonalmedianplusaMARKpoint;whenthecustomerisasplicingboardfilehasnosurfacepatchtechnology,isgenerallyrequiredtocommunicatewiththecustomerneedtoaddMARK.

9aboutV-CUT（cutVgroove）

9.1Vcutpanelsdonotleaveagapbetweentheboardandtheboard.However,attentionshouldbepaidtothedistancebetweentheconductorandthecenterlineoftheVcut.Generally,theconductorspacingonbothsidesoftheV-CUT