半导体FAB常用单词.docx

半导体FAB常用单词.docx

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半导体FAB常用单词

◎A开头的单字◎1.   Abort                             取消操作2.   Abnormal                         　异常3.   AceticAcid（CH3COOH）       　　　醋酸4.   Acetone（CH3COCH3）       　　　　丙酮5.   Acid                               酸6.   Add                               增加7.   Adjust                           调整8.   AirShower                       洁净走道9.   Alignment                         对准10.  Alloy                             合金11.  Aluminum（Al）            　　　　 铝12.  Ammonia（NH4OH）         　　氢氧化胺（俗称:

氨水）13.  Analysis                         分析m~H14.  AR                               氩气15.  Automation                     　自动化  ◎B开头的单字◎1.   Bake                             烘烤2.   Bank                             暂存3.   Barcode                         条形码4.   Batch                             整批5.   BHLD                被工程师或客户BankHold短时间内不会Run的货6.   BlueTape                         蓝膜  7.   Boat                             石英晶舟8.   Bottom                           底部9.   BreakdownVoltage               击穿电压10.  Broken                           破片；损坏11.  Buffer                           生产暂存区12.  BufferChemical                   缓冲液◎C开头的单字◎1.  Calibration                       校正；调整2.  Camera                           照相机；摄影机3.  Cancel                             清除4.  Candela（cd）             　　　　烛光5.  Cart                               手推车6.  Cassette                           晶舟7.  Certify                           技能认证8.  Chamber                           反应室9.  Charge                             电荷10.Chipping                           崩裂11.ChipSuctionPen                   真空吸笔12.ChipTransfer-m（Machine）       翻转机13.CleanBench                       清洗台14.CleanRoom                       洁净室15.Cleaning                           清洗IF16.CleaningSequence                 清洗程序17.Clear                               清除18.Coat                               涂布19.Coater                             上光阻机台20.Coating                    上光阻；涂布上整个表面21.Completed                         结束；完成22.Confirm                             确认23.Contact                             接触24.Contamination                     污染25.ControlWafer（C/W）         控片26.Controller                          控制器27.CoolingWater                       冷却水28.Crucible，Pot                       坩埚29.Curing                             烘烤30.Customer                           客户  31.CVD（ChemicalVaporDeposition）   化学汽相沉积32.CycleTime                         生产周期◎D开头的单字◎1.  DailyMonitor                     每日检测2.  Data                              资料；数据3.  Date                               日期4.  Defect                            缺点；缺陷5.  Defocus                           散焦；无法聚焦6.  Del（Delete）                       清除；删除7.  Delay                             延迟8.  Department                       部门9.  Deposition（DEP）           　　　沉积10.Develop                             显影11.Developer                         显影器；显影液12.Die，Chip                   晶粒（台）；芯片（陆）13.DIWater                           去离子水14.Dicing                              切割15.Down                               当机16.Drain                               泄出17.DryEtching                        干蚀刻18.DryPump                   干式（无油封）的真空泵19.DummyWafer（D/W）         挡片◎E开头的单字◎1.  E/R（EtchingRate）                 蚀刻率2.  EmergencyStop                   紧急停止3.  EMO                               紧急停止按钮4.  Endpoint                          终点值5.  Engineer                           工程师6.  Epi–wafer            磊晶片（台）；外延片（陆）7.  Equipment                        机台；设备8.  ErrorMessage                     错误讯息9.  Etching                            蚀刻10.Evaporation                       蒸镀11.Exhaust                    抽出；抽风管；排（废）气12.ExpandingMachine               扩张机13.Exposure                          曝光；曝光量◎F开头的单字◎1.  FAC                                厂务2.  Facility                       厂务水电气系统3.  Film                               薄膜4.  Focus                           聚焦；焦距5.  ForwardCurrent                   顺向电流6.  ForwardVoltage（Vf）           顺向电压  7.  FQC                               最终检验员8.  Furnace                           炉管◎G开头的单字◎1.  Gallium（Ga）                   镓2.  GOR（GeneralOperationRule）   厂区操作规则3.  Group                              群组◎H开头的单字◎1.  Handle                             处理2.  HighCurrent                      高电流  3.  Highlight                          强调4.  HighVacuum                       高真空5.  HighVoltage                      高电压6.  History                            歴史7.  HMDS                            界面活性剂8.  Hold                              扣留；暂停9.  HoldDate                        留置日期10.HoldReason                       留置原因11.HoldUser                          留置者12.HotRun                           很急件13.HydrochloricAcid（HCL）       盐酸14.HydrofluoricAcid（HF）         氢氟酸15.HydrogenPeroxide（H2O2）     双氧水◎I开头的单字◎1.  Idle                                休息2.  Initial                           初始状态3.  Inspection                         检验4.  IPA（IsopropylAcetone）           异丙醇5.  IPQC                             制程检验员6.  IQC                              进料检验员7.  Item                               项目8.  IvTest                            Iv测试◎J开头的单字◎1.  Job                                 工作2.  Job–Name                     程序名称代号◎K开头的单字◎1.  KeyLock                        功能键；指令键  2.  Keyboard                           键盘◎L开头的单字◎1.  Leak                               泄漏2.  LHLD                    被Hold住的货（Hold在上一站）3.  LightEmittingDiode（LED）   发光二极体4.  Link                               连结；线5.  Lithography                       微影6.  Log                                记录7.  Lost                  机台是清空的，无人操作机台或机台没在Run货8.  Lot                                批货9.  LotHistoryInformation           批货历史资料10.Lot-ID                             批货编号11.LotInformation                   批货信息12.LotNote                           批货批注13.LotNoteInformation             批货批注信息14.LotOwner                         货主15.LotPosition                       批货位置16.LotProcessStatus                 批货生产状态17.LotStatus                          批货状态18.LPHL  被工程师Hold在当站，请依Lot NoteCall工程师或执行RunCard19.LuminousIntensity（Iv）         光的强度（单位:

cd，mcd）◎M开头的单字◎1.  Maintain                           维护2.  Maintenance                       维修；保护3.  Manufacture                       制造4.  Mark                               记号5.  Mask                               光罩6.  Merge                             合并7.  Metal                               金属8.  Microscope                    显微镜；实体显微镜9.  Misalign                           对偏  10.MissingLot                         失踪批货11.Missoperation（MO）           错误操作12.Multi                               多重的

◎N开头的单字◎1.NativeOxideLayer               自然氧化层2.NHLD    因下一站机台正在Run货或无法Run货而设的Hold（Hold在下一站）3.NitricAcid（NHO3）             硝酸4.Nitride                             氮化物5.Nitrogen（N）                     氮6.NormalLot                         普通货  7.Notavailable                       不可用的；无效的

8.Notch                               缺角9.Nozzle                             喷嘴◎O开头的单字◎1.OCAP（OutOfControlAction异常状况处理计划Plan）2.Off-line不与计算机联机；间接参与生产的人员3.OI（OperationInstruction）操作准则4.On-line与计算机联机；直接参与生产的人员5.Operation操作6.OperationCancel操作中止；取消操作7.OperationComplete操作完成8.OperationNumber（.）操作步骤编号9.OperationProcedure操作流程10.OperationStart操作开始11.OperationStartCancel取消＂操作开始＂12.OPI（OperatorInterface）操作接口13.OpticalAligner光对准曝光机14.OQC出货检验员15.OutOfControl（OOC）超出控制规格16.OutOfSpec（OOS）超出规格17.Outgassing指附着于固体表面的气体因压力降低或热量而升华18.Oven烤箱；炉子19.OverEtching过度蚀刻20.OverQ-Time超过限制时间21.Owner负责人22.Oxide氧化物

◎P开头的单字◎1.Parameter                       参数2.PartNumber                     型号3.Particle                        微粒子4.Passivation                     护层5.Password                        密码6.Pattern                         图案7.PatternShift                   图案偏移8.Peeling                         剥皮；剥离9.Phosphorus（P）                 磷10.PhosphorusAcid（H3PO4）       磷酸11.Photo                          黄光   12.PhotolithographicPatterning   微影图案13.PhotoResist（PR）             光阻；光阻液14.PhotoResistStripper          去光阻液15.PhysicalVaporDeposition（PVD）物理汽相沉积   16.Piece                          片数；张数17.Plasma                         电浆18.PM（PreventiveMaintenance）     机台定期例行保养  19.PN（ProductionNotice）          制造通报20.PNJunction                    PN结21.PostExposureBake             曝光后烘烤22.POD                          晶片专用盒（Run货専用）23.Port                           港口；舱门24.Press                          压；按下25.Pressure                       压力26.Priority                       优先次序27.Probe                          探针28.ProbeArea                     探索区29.ProbeCard                     探针卡30.Process                        制程31.Product                        产品32.Program                        程序  33.PumpDown                      抽真空34.PureWater                     纯水35.Purge                          清除36.Push                           推动◎Q开头的单字◎1.Q-Time                             限制的时数2.Quality                             品质3.QuaternaryCompound           四元化合物；季化合物  ◎R开头的单字◎1.  Range                              范围2.