PCB专业词汇.docx
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PCB专业词汇
1、印制电路:
printedcircuit
2、印制线路:
printedwiring
3、印制板:
printedboard
4、印制板电路:
printedcircuitboard(pcb)
5、印制线路板:
printedwiringboard(pwb)
6、印制元件:
printedcomponent
7、印制接点:
printedcontact
8、印制板装配:
printedboardassembly
9、板:
board
10、单面印制板:
single-sidedprintedboard(ssb)
11、双面印制板:
double-sidedprintedboard(dsb)
12、多层印制板:
mulitlayerprintedboard(mlb)
13、多层印制电路板:
mulitlayerprintedcircuitboard
14、多层印制线路板:
mulitlayerpritedwiringboard
15、刚性印制板:
rigidprintedboard
16、刚性单面印制板:
rigidsingle-sidedprintedborad
17、刚性双面印制板:
rigiddouble-sidedprintedborad
18、刚性多层印制板:
rigidmultilayerprintedboard
19、挠性多层印制板:
flexiblemultilayerprintedboard
20、挠性印制板:
flexibleprintedboard
21、挠性单面印制板:
flexiblesingle-sidedprintedboard
22、挠性双面印制板:
flexibledouble-sidedprintedboard
23、挠性印制电路:
flexibleprintedcircuit(fpc)
24、挠性印制线路:
flexibleprintedwiring
25、刚性印制板:
flex-rigidprintedboard,rigid-flexprintedboard
26、刚性双面印制板:
flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted
27、刚性多层印制板:
flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard
28、齐平印制板:
flushprintedboard
29、金属芯印制板:
metalcoreprintedboard
30、金属基印制板:
metalbaseprintedboard
31、多重布线印制板:
mulit-wiringprintedboard
32、陶瓷印制板:
ceramicsubstrateprintedboard
33、导电胶印制板:
electroconductivepasteprintedboard
34、模塑电路板:
moldedcircuitboard
35、模压印制板:
stampedprintedwiringboard
36、顺序层压多层印制板:
sequentially-laminatedmultilayer
37、散线印制板:
discretewiringboard
38、微线印制板:
microwireboard
39、积层印制板:
buile-upprintedboard
40、积层多层印制板:
build-upmulitlayerprintedboard(bum)
41、积层挠印制板:
build-upflexibleprintedboard
42、表面层合电路板:
surfacelaminarcircuit(slc)
43、埋入凸块连印制板:
b2itprintedboard
44、多层膜基板:
multi-layeredfilmsubstrate(mfs)
45、层间全内导通多层印制板:
alivhmultilayerprintedboard
46、载芯片板:
chiponboard(cob)
47、埋电阻板:
buriedresistanceboard
48、母板:
motherboard49、子板:
daughterboard
50、背板:
backplane
51、裸板:
bareboard
52、键盘板夹心板:
copper-invar-copperboard
53、动态挠性板:
dynamicflexboard
54、静态挠性板:
staticflexboard
55、可断拼板:
break-awayplanel
56、电缆:
cable
57、挠性扁平电缆:
flexibleflatcable(ffc)
58、薄膜开关:
membraneswitch
59、混合电路:
hybridcircuit
60、厚膜:
thickfilm
61、厚膜电路:
thickfilmcircuit
62、薄膜:
thinfilm
63、薄膜混合电路:
thinfilmhybridcircuit
64、互连:
interconnection
65、导线:
conductortraceline
66、齐平导线:
flushconductor
67、传输线:
transmissionline
68、跨交:
crossover
69、板边插头:
edge-boardcontact
70、增强板:
stiffener
71、基底:
substrate
72、基板面:
realestate
73、导线面:
conductorside
74、元件面:
componentside
75、焊接面:
solderside
76、印制:
printing
77、网格:
grid
78、图形:
pattern
79、导电图形:
conductivepattern
80、非导电图形:
non-conductivepattern
81、字符:
legend
82、标志:
mark
83、方形扁平封装:
QFP(QuadFlatPackage)
84、有引线塑料芯片栽体:
PLCC(PlasticLeadedChipCarrier)
85、双列直插封装:
DIP(DualIn-linePackage)
86、单列直插封装:
SIP(SingleinlinePackage)
87、小外形封装:
SOP(SmallOut-LinePackage)
88、J形引线小外形封装:
SOJ(SmallOut-LineJ-LeadedPackage)
89、板上芯片封装:
COB(ChiponBoard)
90、倒装焊芯片:
Flip-Chip
-----------------------
一、综合词汇
1、印制电路:
printedcircuit
2、印制线路:
printedwiring
3、印制板:
printedboard
4、印制板电路:
printedcircuitboard(PCB)
5、印制线路板:
printedwiringboard(PWB)
6、印制元件:
printedcomponent
7、印制接点:
printedcontact
8、印制板装配:
printedboardassembly
9、板:
board
10、单面印制板:
single-sidedprintedboard(SSB)
11、双面印制板:
double-sidedprintedboard(DSB)
12、多层印制板:
mulitlayerprintedboard(MLB)
13、多层印制电路板:
mulitlayerprintedcircuitboard
14、多层印制线路板:
mulitlayerpritedwiringboard
15、刚性印制板:
rigidprintedboard
16、刚性单面印制板:
rigidsingle-sidedprintedborad
17、刚性双面印制板:
rigiddouble-sidedprintedborad
18、刚性多层印制板:
rigidmultilayerprintedboard
19、挠性多层印制板:
flexiblemultilayerprintedboard
20、挠性印制板:
flexibleprintedboard
21、挠性单面印制板:
flexiblesingle-sidedprintedboard
22、挠性双面印制板:
flexibledouble-sidedprintedboard
23、挠性印制电路:
flexibleprintedcircuit(FPC)
24、挠性印制线路:
flexibleprintedwiring
25、刚性印制板:
flex-rigidprintedboard,rigid-flexprintedboard
26、刚性双面印制板:
flex-rigiddouble-sidedprintedboard,rigid-flexdouble-
sidedprinted
27、刚性多层印制板:
flex-rigidmultilayerprintedboard,rigid-flexmultilayer
printedboard
28、齐平印制板:
flushprintedboard
29、金属芯印制板:
metalcoreprintedboard
30、金属基印制板:
metalbaseprintedboard
31、多重布线印制板:
mulit-wiringprintedboard
32、陶瓷印制板:
ceramicsubstrateprintedboard
33、导电胶印制板:
electroconductivepasteprintedboard
34、模塑电路板:
moldedcircuitboard
35、模压印制板:
stampedprintedwiringboard
36、顺序层压多层印制板:
sequentially-laminatedmulitlayer
37、散线印制板:
discretewiringboard
38、微线印制板:
microwireboard
39、积层印制板:
buile-upprintedboard
40、积层多层印制板:
build-upmulitlayerprintedboard(BUM)
41、积层挠印制板:
build-upflexibleprintedboard
42、表面层合电路板:
surfacelaminarcircuit(SLC)
43、埋入凸块连印制板:
B2itprintedboard
44、多层膜基板:
multi-layeredfilmsubstrate(MFS)
45、层间全内导通多层印制板:
ALIVHmultilayerprintedboard
46、载芯片板:
chiponboard(COB)
47、埋电阻板:
buriedresistanceboard
48、母板:
motherboard
49、子板:
daughterboard
50、背板:
backplane
51、裸板:
bareboard
52、键盘板夹心板:
copper-invar-copperboard
53、动态挠性板:
dynamicflexboard
54、静态挠性板:
staticflexboard
55、可断拼板:
break-awayplanel
56、电缆:
cable
57、挠性扁平电缆:
flexibleflatcable(FFC)
58、薄膜开关:
membraneswitch
59、混合电路:
hybridcircuit
60、厚膜:
thickfilm
61、厚膜电路:
thickfilmcircuit
62、薄膜:
thinfilm
63、薄膜混合电路:
thinfilmhybridcircuit
64、互连:
interconnection
65、导线:
conductortraceline
66、齐平导线:
flushconductor
67、传输线:
transmissionline
68、跨交:
crossover
69、板边插头:
edge-boardcontact
70、增强板:
stiffener
71、基底:
substrate
72、基板面:
realestate
73、导线面:
conductorside
74、元件面:
componentside
75、焊接面:
solderside
76、印制:
printing
77、网格:
grid
78、图形:
pattern
79、导电图形:
conductivepattern
80、非导电图形:
non-conductivepattern
81、字符:
legend
82、标志:
mark
二、基材:
1、基材:
basematerial
2、层压板:
laminate
3、覆金属箔基材:
metal-cladbadematerial
4、覆铜箔层压板:
copper-cladlaminate(CCL)
5、单面覆铜箔层压板:
single-sidedcopper-cladlaminate
6、双面覆铜箔层压板:
double-sidedcopper-cladlaminate
7、复合层压板:
compositelaminate
8、薄层压板:
thinlaminate
9、金属芯覆铜箔层压板:
metalcorecopper-cladlaminate
10、金属基覆铜层压板:
metalbasecopper-cladlaminate
11、挠性覆铜箔绝缘薄膜:
flexiblecopper-claddielectricfilm
12、基体材料:
basismaterial
13、预浸材料:
prepreg
14、粘结片:
bondingsheet
15、预浸粘结片:
preimpregnatedbondingsheer
16、环氧玻璃基板:
epoxyglasssubstrate
17、加成法用层压板:
laminateforadditiveprocess
18、预制内层覆箔板:
masslaminationpanel
19、内层芯板:
corematerial
20、催化板材:
catalyzedboard,coatedcatalyzedlaminate
21、涂胶催化层压板:
adhesive-coatedcatalyzedlaminate
22、涂胶无催层压板:
adhesive-coateduncatalyzedlaminate
23、粘结层:
bondinglayer
24、粘结膜:
filmadhesive
25、涂胶粘剂绝缘薄膜:
adhesivecoateddielectricfilm
26、无支撑胶粘剂膜:
unsupportedadhesivefilm
27、覆盖层:
coverlayer(coverlay)
28、增强板材:
stiffenermaterial
29、铜箔面:
copper-cladsurface
30、去铜箔面:
foilremovalsurface
31、层压板面:
uncladlaminatesurface
32、基膜面:
basefilmsurface
33、胶粘剂面:
adhesivefaec
34、原始光洁面:
platefinish
35、粗面:
mattfinish
36、纵向:
lengthwisedirection
37、模向:
crosswisedirection
38、剪切板:
cuttosizepanel
39、酚醛纸质覆铜箔板:
phenoliccellulosepapercopper-cladlaminates
(phenolic/paperCCL)
40、环氧纸质覆铜箔板:
epoxidecellulosepapercopper-cladlaminates
(epoxy/paperCCL)
41、环氧玻璃布基覆铜箔板:
epoxidewovenglassfabriccopper-cladlaminates
42、环氧玻璃布纸复合覆铜箔板:
epoxidecellulosepapercore,glasscloth
surfacescopper-cladlaminates
43、环氧玻璃布玻璃纤维复合覆铜箔板:
epoxidenonwoven/wovenglassreinforced
copper-cladlaminates
44、聚酯玻璃布覆铜箔板:
ployesterwovenglassfabriccopper-cladlaminates
45、聚酰亚胺玻璃布覆铜箔板:
polyimidewovenglassfabriccopper-cladlaminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:
bismaleimide/triazine/epoxidewoven
glassfabriccopper-cladlamimates
47、环氧合成纤维布覆铜箔板:
epoxidesyntheticfiberfabriccopper-clad
laminates
48、聚四乙烯玻璃纤维覆铜箔板:
teflon/fiberglasscopper-cladlaminates
49、超薄型层压板:
ultrathinlaminate
50、陶瓷基覆铜箔板:
ceramicsbasecopper-cladlaminates
51、紫外线阻挡型覆铜箔板:
UVblockingcopper-cladlaminates
三、基材的材料
1、A阶树脂:
A-stageresin
2、B阶树脂:
B-stageresin
3、C阶树脂:
C-stageresin
4、环氧树脂:
epoxyresin
5、酚醛树脂:
phenolicresin
6、聚酯树脂:
polyesterresin
7、聚酰亚胺树脂:
polyimideresin
8、双马来酰亚胺三嗪树脂:
bismaleimide-triazineresin
9、丙烯酸树脂:
acrylicresin
10、三聚氰胺甲醛树脂:
melamineformaldehyderesin
11、多官能环氧树脂:
polyfunctionalepoxyresin
12、溴化环氧树脂:
brominatedepoxyresin
13、环氧酚醛:
epoxynovolac
14、氟树脂:
fluroresin
15、硅树脂:
siliconeresin
16、硅烷:
silane
17、聚合物:
polymer
18、无定形聚合物:
amorphouspolymer
19、结晶现象:
crystallinepolamer
20、双晶现象:
dimorphism
21、共聚物:
copolymer
22、合成树脂:
synthetic
23、热固性树脂:
thermosettingresin
24、热塑性树脂:
thermoplasticresin
25、感光性树脂:
photosensitiveresin
26、环氧当量:
weightperepoxyequivalent(WPE)
27、环氧值:
epoxyvalue
28、双氰胺:
dicyandiamide
29、粘结剂:
binder
30、胶粘剂:
adesive
31、固化剂:
curingagent
32、阻燃剂:
flameretardant
33、遮光剂:
opaquer
34、增塑剂:
plasticizers
35、不饱和聚酯:
unsatuiatedpolyester
36、聚酯薄膜:
polyester
37、聚酰亚胺薄膜:
polyimidefilm(PI)
38、聚四氟乙烯:
polytetrafluoetylene(PTFE)
39、聚全氟乙烯丙烯薄膜:
perfluorinatedethylene-propylenecopolymerfilm(FEP)
40、增强材料:
reinforcingmaterial
41、玻璃纤维:
glassfiber
42、E玻璃纤维:
E-glassfibre
43、D玻璃纤维:
D-glassfibre
44、S玻璃纤维:
S-glassfibre
45、玻璃布:
glassfabric
46、非织布:
non-wovenfabric
47、玻璃纤维垫:
glassmats
48、纱线:
yarn
49、单丝:
filament
50、绞股:
strand
51、纬纱:
weftyarn
52、经纱:
warpyarn
53、但尼尔:
denier
54、经向:
warp-wise
55、纬向:
weft-wise,filling-wis