Glossary of Die Bond.docx

Glossary of Die Bond.docx

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GlossaryofDieBond

GlossaryDB/DA

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A

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Assist

Anyunplannedinterruptionorvariancefromspecificationsofequipmentoperationthatrequireshumaninterventionoffewerthansixminutestocorrect.Aftersixminuteshaselapsed,anassistbecomesafailure.Ifinterventionisrequired,butthereisnointerruptionofoperationwithinspecificationsandnocomponentisreplaced,theactionisdeemedtobeanassistindependentofitsduration.

B

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Ballbonding

Athermosonicbondingtechnique.Thewireendismeltedtoformaball,whichprovidesalargerareaofcontactthanotherwisepossible.

Ballbumpbonding

Ballbumpbondingplacesagoldballbumponanactivecircuitpriortobondingthewedgebondoftheassociatedinterconnectingwire.Usedforstackeddie,reversebondingandmulti-chipscalepackages.

BallGridArray（BGA）

Typeofchippackage.Anintegratedcircuitsurface-mountpackagewithanareaarrayofsolderballsthatareattachedtothebottomsideofasubstratewithroutinglayers.

BehaviorBasedEquipmentModel（B-BEM）

Softwarearchitecturethatrepresentsequipmentbasedonitsbehavior.

Bonddeformation

Thechangeintheformoftheleadproducedbythebondingtool,causingplastictoflowinmakingthebond.

Bondforce

Verticalforceonthebondingtool（capillary）duringthebondingcycle.

BondLineThickness（BLT）

Determinestheaveragethicknessofthebondingmaterial（epoxy,solder）.

Bondpad

Ametallizedregiononthetopsurfaceofsemiconductordieviawhichelectricalconnectiontoanexternalcircuitismadebymeansofabondwire.

Bondrange

Theusableareaofaleadframeorsubstrateforbonding.

BondVisionModule（BVI）

Diebonderopticalandelectronicmechanismforcontrollingpositionandorientationofachipinbondingposition.

Bondhead（BHD）

Thewirebonderdevicethatperformsallmovementsandoperationsnecessarytobondthewiretothebondpads.

Bumpchip

Achipthathasonitsterminationpadsabumpofsolderorotherbondingmaterialthatisusedtobondthechiptoexternalcontacts.

C

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Calibration（CALIB）

Setting-upamachinetoaknownreferencecondition

Capabilities（CAP）

Capabilitiesareoperationsperformedbytheequipment.TheseoperationsareinitiatedthroughthecommunicationsinterfaceusingsequencesofSECS-IImessages（orscenarios）.

Capillary（HDH）

Ahollowbondingtoolusedtoguidethebondingwireandtoapplyforcetothewireduringthebondingcycle.

Carrier（FAB）

Holdsthestrips（leadframes）forthetransfers.

Cassette

Carrierforwafers,mountedonwaferframes.

Cell

ClusterofmachinesunderthecontrolofaCellController.

Changeover

Changeofproductiontools（e.g.downholders,clamps,etc.）.

Chip

SeeDie

ChiponBoard（COB）

Ahybridtechnologythatexclusivelyemploysface-up-bondedchipdevicesinterconnectedtothesubstrateinaconventionalmanner,i.e.,byflyingwires.AgenerictermformountinganunpackagedsilicondiedirectlyontothePCB.

ChipScalePackaging（CSP）

Small-footprintintegratedcircuitpackages,sometimesdefinedas1.2timesthediesize;moreappropriatelyreferstoarraypackagesnearlythesamesizeasthechipstheycontain.

COB

SeeChiponBoard

CompressedDryAir（CDA）

Alsoreferredtoascleandryair.

Consumable

Materialforone-timeuse,e.g.goldwire,epoxy.

ControlledCollapseChipConnection（C4）

Themostcommonexampleofsolder-bump-basedflipchiptechnology.

CostOfOwnership（COO）

Thetotallifetimecostsassociatedwithacquisition,installation,andoperationofproductionequipment.

Cp

SeeProcessCapability

Cpk

Seeprocesscapabilityindex

CSP

SeeChipScalePackaging

Curing（CU）

Processstepforthehardeningofepoxy.

D

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Die

Asmallpieceofsiliconthatcontainsthecompletedevicebeingmanufactured.Alsocalledchipormicrochip.

DieAttach（DA）

DieBonder

DieBonder（DB）

Picks,placesandbondschipsontostrips,substratesorleadframes,sometimesreferredtoasdieattach.

Discrete

Adeviceorcomponentthathasasinglefunction,suchasadiodeortransistor.

Downholder/heaterassembly

Clampsandheatstheleadframeduringbonding.

Downtime（DT）

Thetimeduringwhichequipmentisnotinacondition,orisnotavailable,toperformitsintendedfunction.Thisdoesnotincludeanyportionofnon-scheduledtime.

DualWireDispenser（DWD）

Moduleonasoftsolderdiebonder;awiredispenserthatcandispensetwowiressimultaneously.

E

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EpoxyProcess

Processesforattachingadietoastrip,substrateorleadframethroughuseofepoxyglue.

EutecticProcess

Oneofthevariousprocessesforattachingadietoaleadframeusinganalloywithaminimizedmeltingpoint.

F

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Failure

Anyunplannedinterruptionorvariancefromthespecificationsofequipmentoperationotherthananassist

FiberOpticLink（FOL）

Fiberopticconnection.

FlipChip

Flipchipinterconnecttechnologypertainstothemountingofachipwithitsactivesidefacingthesubstrate.

FlipChipinPackage（FCIP）

Canbeasinglechippackageormultichipmodule.

FlipChiponBoard（FCOB）

Baresinglechipormultiplechipsmixedwithothercomponentsonaboard.

Freeairball

Ballformationpriortobondingcontact

G

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GenericEquipmentModel（GEM）

GenericModelforcommunicationandcontrolofSEMIequipment.Definesthebehaviorofsemiconductorequipmentasviewedthroughacommunicationslink,e.g.SECS-II;providesthedefinitionofmessagesanddataitemsexchangedbetweenthehostandtheequipment.GEMdefineswhichSECS-IImessagesshouldbeused.

GraphicalUserInterface（GUI）

Human/machineinterface（HMI）.

H

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HotLot

Lotwithhighestprioritythatwillbeprocessednext.

I

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Idle

Equipmentwaitinginareadystate.

Integratedcircuit（IC）

Chip,device.

IntegratedQualityControl（IQC）

Diebonderonboardinspectionsystemforcheckingquality,e.g.chipplacement,leadframefingers,etc.

Interconnection

Theconductivepathrequiredtoachieveelectricalconnectionbetweenacircuitelementandtherestofthecircuit.

L

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LeadOnChip（LOC）

Thedeviceisfixedwithatapeunderneaththesubstrate;nocuringneeded.

Leadwires

Wireconductorsusedforintra-connectionsorinput/outputleads.

Leadframe（L/F）

Sheetmetalframeworkuponwhichanintegratedcircuitisattached.

LeadframeHandler（LH）

Automaticallyloadsandtransportsleadframesduringthediebondingprocess.

LOC

SeeLeadOnChip

Local

Acommunicationstateoftheequipmentduringwhichtheequipmentiscontrolledbytheoperator,notbytheCC.

Loop–wirebond

Thecurveorarcofthewirebetweentheattachmentpointsateachendofawirebond.

Lot

Productionunit,collectionofcarriersorabatchofwafersprocessedatthesametime.

M

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MachineConfiguration（M/C）

Mostlyusedasanabbreviationfor“machine”.

Magazine

Carrierforstrips,substratesorleadframes.

MagazineHandler（MH）

Partofdiebonderorwirebonderforinputoroutputhandlingofmagazines.

Maintenance（MAG）

Ensuringthatequipmentiskeptinaconditionthatallowsittoperformitsintendedfunction.

MasterUnit（MU）

Thediebondermasterunitcontrolsallthemodules.

MCM

SeeMultichipModule

MeanTimeBetweenAssist（MTBA）

Theaveragetimeduringwhichtheequipmentperformeditsintendedfunctionbetweenassists;productivetimedividedbythenumberofassistsduringthattime.Seeassist

MeanTimeBetweenFailure（MTBF）

Theaveragetimeduringwhichtheequipmentperformeditsintendedfunctionbetweenfailures;productivetimedividedbythenumberoffailuresduringthattime.SeeFailure

MeanTimeToRepair（MTTR）

Theaveragetimerequiredtocorrectafailureandtoreturntheequipmenttoaconditioninwhichitcanperformitsintendedfunction.Thesumofallrepairtimeincurredduringaspecifiedperiod（includingequipmentandprocesstesttime,butexcludingmaintenancedelay）dividedbythenumberoffailuresduringthatperiod.

Metallization

Afilmpatternofconductivematerialdepositedonasubstratetointerconnectelectroniccomponents,orthemetalfilmonthebondingareaofasubstratethatbecomesapartofthebondandperformsbothanelectricalandamechanicalfunction.

MicroElectromechanicalSystems（MEMS）

Atechnologythatcombinescomputerswithtinymechanicaldevicessuchassensors,valves,gears,mirrorsandactuatorsembeddedinsemiconductorchips.

Micron（µm）

Unitoflengthequaltoonemillionthofameter.Conversion:

25.4micronsequals0.0254mm=0.001”=1mil=1,000microinches.

Mil

One-thousandthofaninch.Equalto25.4microns.

Mold

Third-partyequipmentusedtoencapsulatesemiconductordevicesontheleadframewithathermosettingplastic.

MultichipModule（MCM）

Apackagingapproachbasedontheinterconnectionofmultiplebaredieonasinglesubstrate.

MultichipPackage（MCP）

AnMCPcontainsafewbarechipsperpackage,andtheycanbearrangedeitherside-by-sideorstackedontopofeachother.MCPstypicallydonotincludediscreteorpassivecomponents.

O

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Offlineprogramming（OLP）

SoftwarethatenablestheteachingofcompleteorpartialwirebonderrecipesonaseparatePC.

OpticalBondCentering（OBC）

Visionsystemforcontrollingthepositionandorientationofthechipinbondingposition.OBCisusedasameansofqualityinspectionaswell.

P

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Package

Containerforadiethatprovidesprotectionandconnectiontothenexthigherlevelofintegration.

Passivation

Theformationofaninsulatinglayerdirectlyoveracircuitorcircuitelementtoprotectthesurfacefromcontaminants,moistureorparticles.

Patternrecognitionsystem（PRS）

Advancedalignmentsystembasedonobject-orientedprocessing.Employsgeometri