回流传导焊接和胶固化设备的工艺控制要求精选.docx

回流传导焊接和胶固化设备的工艺控制要求精选.docx

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回流传导焊接和胶固化设备的工艺控制要求精选

三阶文件1.ProductRevision产品版本

ProductName产品名称

ApplicableProductBOMRevision

适用的产品BOM版本

2.Changehistory更改记录

UpdatedVer.最新版本

Effectivedate生效日期

Preparedby起草人

BriefofAmendments

更改内容摘要

3.Purpose目的

Thepurposeofthisdocumentistodefinethestandardoperationandprocess-monitoringproceduresforreflowsoldering,conductivesolderingandadhesivecuringequipment.

4.Scope范围

ThisprocedureisapplicabletoEnicsSuzhoufacilitythatutilizetheabove-mentionedprocess.

Enics5.Definitions定义

IPC-T-50-TermsandDefinitionsforInterconnectingandPackagingElectronicCircuits.

IPC-T-50电子装联产品的术语和定义

6.Responsibilities职责

SMToperators

ItistheresponsibilityoftheSMTOperatortoensurethecorrectprofileprogramisloaded.

SMT作业员负责正确加载回流炉程序.

SMTTechnicians

Itistheresponsibilityofthetechniciantoensurethattheprofilesareavailable,andanynewprofilesarenotsavedasaDatapaqprofileuntiltheyarewithinspecification,andalsoberesponsibleforfabricatingtestingprofileboard,testingprofileandprintingtheprofile.

SMT技术人员负责确保炉温曲线的有效性，保存符合规格要求的炉温曲线，并且负责制作炉温测试板，测试炉温并打印炉温曲线.

SMTLineSupervisors

ItistheresponsibilityoftheSMTLineSupervisorstoensureonlytrainedoperatorsareloadingprofilesintothemachine.

SMT线主管负责确保只有培训合格的作业员才能加载回流炉程序.

SMTEngineer

ItistheresponsibilityoftheSMTEngineertoindicateonanyECN,therequirementtore-profileanassembly,wherethechangesmadecouldaffectthethermalpropertiesofthatassemblyandthereforethesolderabilityofcomponents,alsoberesponsibleforsettingDataPaqsoftwareconfigure,temperatureparameterandverifytheprofiletestingresult.

SMT工程师负责指出任何的ECN，重测炉温的要求，哪些更改可能会影响产品的热性能和元件的可焊性，而且负责设置DataPaq软件配置，炉温参数和确认炉温曲线结果.

QAtechnicains

ItistheresponsibilityoftheQAtechnicianstoverifywhetherondutySMTtechnicianstestprofile,printprofile,pasteitonthereflow’sdesignatedareaornot.

QA检查并确认当班SMT技术人员是否测试、打印、张贴炉温曲线于炉子的制定区域.

7.Description描述

7.1processoverview总体制程

AnyEnicsSuzhousiteutilizingthisprocessisresponsibleforensuringimplementationandconformancetothisprocedure.

任何使用这个制程的Enics苏州生产工厂都应确保执行并符合这个程序.

SolderReflow/ConductionandAdhesiveCurearethemeansbywhichmechanicalattachmentofcomponentstoaPrintedCircuitBoard（PCB）isachievedinthesurfacemounttechnology（SMT）process.

焊锡回流/传导和胶固化的意思是指在SMT工艺中通过某种方式让元件与PCB板形成良好的结合.

Figure1–SMTProcessFlow

Note:

Manualorautomatedinspectionstepsmayoccurwithinthisflowbutarenotwithinthescopeofthisdocument.

注：

在制程中可以有手动或自动检查步骤，但这个文件里没有讲.

7.2TrainingRequirements培训要求

AllpersonnelwhooperateSMTequipmentshallbetrainedinaccordancewithdefinedspecificfunctiontrainingprograms.Specificfunctiontrainingplansandtrainingrecordsshallbeavailableandmaintained.Employeesthathavenotcompletedtherequiredtrainingorthosenotintheprocessofcompletingapprovedapprenticeshipprogramsarenotallowedtooperatetheequipmentasnotedinthisprocedure.

所有要操作SMT设备的人员都要根据特殊功能培训程序进行培训.特殊功能培训计划和培训要记录并且保存.任何人员没有完成培训或未出师的学徒不能操作这份文件中讲到的设备.

Allpersonnelwhoperformprofilingoncustomerproductshallbetrainedinaccordancewithdefinedprofilingspecificfunctiontrainingprograms.

所有将要执行测量客户产品炉温曲线的人员将要接受相关培训.

7.3ProcessRequirements（technicaloperation）制程要求（技术性操作）

EndProductWorkmanship终端产品的工艺

AllPWAsprocessedthroughtheconvection/conductionsolderingoradhesivecuremachineshallmeettheQualityrequirementslistedinIPC-A-610,unlessotherwisespecifiedbythecustomer.Workinstructionsshalldefinepersonnelresponsibilitieswiththeassociatedconvection/conductionsolderandadhesivecureequipment.Inaddition,theworkinstructionsshalldefineapplicableinformationsuchasstartup,machinespecificinformationandshutdown.Machinespecifictroubleshootingmayalsobeincluded.Assemblyspecificinformationsuchasorientationofproduct,useoftooling,pallets,machinesettings,etcshallbedocumentedintheproductchangeoverchecklist.

所有的PWA有经过回流/传导焊接或胶固化机器都有应符合IPC-A-610所列出的品质要求,除非客户有特殊要求.操作指导书应该定义操作回流/传导焊接或胶固化机器人员的责任.另外，操作指导书要定义相关信息比如开机，机器的特殊信息及关机，还应包括解决机器故障.组装方面的特殊信息比如产品的方向，使用的治具，机器设定等都应该包括在产品更换记录表里.

Convection/ConductionSolderTooling回流/传导焊接工治具

Allconvection/conductionsoldertoolingusedtosupporttheprocessshallberevisioncontrolledandclearlylabeledorresideinalabeledcontainerandbedocumentedforthespecificPWA.Additionally,eachtoolshallhaveatoolingnumberassignedtoitpertheequipmentmanagementrequirements.Thetoolingshallbe,butnotlimitedto:

shields,customoruniversalpallets,weights,alignmentfixtures,andhold-downs.ToolingshallbemanufacturedwithESDcompliantmaterials.

所有用于回流/传导焊接制程的工治具应该有版本控制并且有清楚的标签或放入到有标签的箱子里并且要做特殊保存，另外每个工治具都应该根据设备管理的要求进行编号.工治具最少包括：

防护盖、夹具盘、砝码、定位治具以及压板治具.所有治具都要用ESD材料做.

ThermalProfiling温度曲线

Avalidtemperatureprofileisrequiredforeachproductionassemblypermachine.IfanotherassemblyusesthesamePCBandPCBrevision,thefirstprofilecanbeacceptableprovideditisreviewedbythefactoryengineeringteamforchangesinthethermalmass.SiteshallmaintainasystemtotracktheapprovalofassemblieswherethePCBandPCBrevisionwereusedfromadifferentassembly.Allvalidprofilesmustbestoredforfuturereference.AnapprovedEnicsworkinstructionwilldefinehowtheprofilesarecreated,named,approved,andcontrolled.

每台机器上有生产的每个产品都要有一条正确的温度曲线.假如另外一个装配使用相同的PCB和PCB版本,倘若它被工厂工程部重新评估整体能量的变化后,最先的炉温曲线是可以接受的.工厂将要维护一个系统去追踪已被正式批准的用于不同的装配的PCB和PCB版本.所有有效的温度曲线都要保存起来供以后参考.批准后的Enics操作指导书定义了曲线如何建立,命名,批准和控制.

Note:

Intheeventasoldersampleorscrappcbisusedforprofilingortroubleshootingpurposes,itmustbeeitherpermanentlymarked（i.e.withanXorwordsScrap）orrenderedunusable（i.e.holepunchedinboard）inordertopreventitsunintendeduse.

注意：

在机器设定或者故障修复时，如果有用到样品板或报废板，需要在这类板上做上记号（如打X或者注明报废）,或者破坏此板（如在板上打孔）,以避免这类板被不小心当成品使用.

EnicsSuzhousitewillappointadesigneetocheckanexistingthermalprofileduringthesetupofatypicalproductionrunbycomparingthethermalprofiledocumentationtotheovenrecipe.Ifthereisadiscrepancybetweentheovenrecipeandtheprofiledocumentation,theexistingrecipewillbedeletedandanewthermalprofilewillbecreated.

经过比较温度曲线与机器设定而确定的一个典型的产品在开始生产时,Enics苏州工厂要指定专人去检查现有的温度曲线.如果机器设定与温度曲线不一致时,必须删除现有设定并重新测量温度曲线.

Re-profilingofanassemblyisrequiredunderthefollowingconditions:

出现下面情况必须重新测量产品的温度曲线：

1）significantmechanicaladjustment

重要的机械调整

2）equipmentre-validation

机器重新确认

3）adjustmenttotheconveyorspeed

调整链速

4）adjustmenttoazonetemperature

调整区间温度

5）changeofsolderalloy

焊膏合金变化

6）changeoffluxchemistry

助焊剂化学成分改变

Re-profilingshouldbeconsideredunderthefollowingconditions:

出现以下情况要考虑重新测量曲线

1.softwarechange

软件变更

2.machineretrofits

机器更新

3.Changeinproductrevision

产品版本变更

Machineretrofitsandsignificantmechanicaladjustmentsareassociatedwithconveyorspeed,heatingorcoolingsystems.

机器更新和重大的机器调整指与链速,加热或冷却系统相关的调整/变化.

Sitesmanufacturingmedicaldevices（whereprocessvalidationisrequiredandimplemented）mustassessallchangestothereflowovenspecifications,methods,processes,andproceduresforverificationorre-validation.Allrecipechangesmustbeverifiedwithanewthermalprofile（andanewfirstarticleassembly）.Asitespecificworkinstructiondescribinghowreflowovenchangeswillbeidentified,documented,assessed,verified,orre-validated,andthelocationoftherecordsoftheseactivities,mustbecreatedbytheapplicablemedicalmanufacturingsites.

制造医疗产品的生产基地（在该基地要求执行制程确认）必须对所有涉及炉子规格，方法、工艺和程序的变化进行评估以进行确认或重新验收.所有的程序变更必须用新的温度曲线确认（或新的首板）.相关医疗产品生产工厂要建立操作指导书描述如何标识,记录,评估,确认或重新验收回流炉的变更以及所有这些活动的记录的保存地点.

Convection/ConductionReflowProfileGuidelines对流/传导回流曲线指南

Solderreflowprofilingisusedtocontroltheprocessperassemblytoinsurehighreliabilitysolderingisoccurringwithoutaffectingthereliabilityofthecomponents.Inthecreationofaprofile,thefollowingcriterianeedtobemet:

焊锡回流曲线用于控制每个产品的制程以确保良好焊接,不影响元件的可靠性,建立一条曲线要符合以下要求：

1.HighqualitysolderjointsasspecifiedbyIPC-A-610

高品质的焊点要求IPC-A-610

2.Customerspecificrequirements

客户特殊要求

3.BoundaryconditionsoutlinedinTable1

表1中的各种界限要求

4.PasteprocesswindowsoutlinedinWISMTReflow/CureProcessControl

在SMT回流和固化制程的控制要求中有关焊膏工艺窗口中的要点.

5.Thermalconstraintsofanyindividualcomponent

个别吸热较大的元件

Tooptimizetheprofilethesolderqualityshouldbereviewedandthepasteprocesswindowtargeted.Table1,isderivedfromIPC9502andEnicsbestpracticesforcommonmanufacturingmaterials,substratesurfacefinishes,substratetypes,components,andcustomerrequirements.TheprofileforamachineandassemblyshallnotexceedthespecificationsoutlinedinTable1.Ifbecauseofmaterialdifferences,specialprocess,tooling,machinecapabilityandcustomerspecification,theconditionsinTable1cannotbemetadeviationisrequired.ConditionsinTable1arearangeofparameterslistedformultiplepastetypes.RefertoWI（SMTReflow/CureProcessControl）foramoredetailedreflowprofileparameterrangelisting.

要优化温度曲线就要检查焊接质量并且以焊膏工艺窗口的曲线规格要求为目标.表1的数据来源基于IPC-9502及Enics对满足普通生产材料,不同PCB表面处理方式,不同基材,不同元件和客户要求的最佳经验,在机器和产品上的温度曲线不得超出表1的规格要求.如果因材料不同,特殊制程,工治具,机器能力和客户规格等情况不能符合表1要求需要做一个偏差说明.表1所罗列的参数范围是给多种焊膏.请参照WI（SMT回流和固化制程的控制要求）更为详细的炉温参数范围清单.

PROCESSPARAMETER

Tin-Lead

Lead-Free

LOWERSPECLIMIT

UPPERSPECLIMIT

LOWERSPECLIMIT

UPPERSPECLIMIT

A

PreheatSlope（DegreesC/second）

N/A

4.0

N/A

4.0

B

PreheatDwell（seconds）*

N/A

165

N/A

165

C

TimeAboveLiquidus（seconds