汽车电子系统中英文对照外文翻译文献.docx

汽车电子系统中英文对照外文翻译文献.docx

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汽车电子系统中英文对照外文翻译文献

汽车电子系统中英文对照外文翻译文献

（文档含英文原文和中文翻译）

TheChangingAutomotiveEnvironment:

High-TemperatureElectronics

R.WayneJohnson,Fellow,IEEE,JohnL.Evans,PeterJacobsen,JamesR.（Rick）Thompson,andMarkChristopher

Abstract—Theunderhoodautomotiveenvironmentisharshandcurrenttrendsintheautomotiveelectronicsindustrywillbepushingthetemperatureenvelopeforelectroniccomponents.Thedesiretoplaceenginecontrolunitsontheengineandtransmissioncontrolunitseitheronorinthetransmissionwillpushtheambienttemperatureabove125℃.However,extremecostpressures,increasingreliabilitydemands（10year/241350km）andthecostoffieldfailures（recalls,liability,customerloyalty）willmaketheshifttohighertemperaturesoccurincrementally.Thecoolestspotsonengineandinthetransmissionwillbeused.Theselargebodiesdoprovideconsiderableheatsinkingtoreducetemperatureriseduetopowerdissipationinthecontrolunit.Themajorityofneartermapplicationswillbeat150℃orlessandthesewillbeworstcasetemperatures,notnominal.ThetransitiontoX-by-wiretechnology,replacingmechanicalandhydraulicsystemswithelectromechanicalsystemswillrequiremorepowerelectronics.Integrationofpowertransistorsandsmartpowerdevicesintotheelectromechanicalactuatorwillrequirepowerdevicestooperateat175℃to200℃.Hybridelectricvehiclesandfuelcellvehicleswillalsodrivethedemandforhighertemperaturepowerelectronics.Inthecaseofhybridelectricandfuelcellvehicles,thehightemperaturewillbeduetopowerdissipation.Thealternatestohigh-temperaturedevicesarethermalmanagementsystemswhichaddweightandcost.Finally,thenumberofsensorsinvehiclesisincreasingasmoreelectricallycontrolledsystemsareadded.Manyofthesesensorsmustworkinhigh-temperatureenvironments.Theharshestapplicationsareexhaust

gassensorsandcylinderpressureorcombustionsensors.High-temperatureelectronicsuseinautomotivesystemswillcontinuetogrow,butitwillbegradualascostandreliabilityissuesareaddressed.Thispaperexaminesthemotivationforhighertemperatureoperation,thepackaginglimitationsevenat125Cwithnewerpackagestylesandconcludeswithareviewofchallengesatboththesemiconductordeviceandpackaginglevelastemperaturespushbeyond125℃.

IndexTerms—Automotive,extreme-environmentelectronics.

I.INTRODUCTION

IN1977,theaverageautomobilecontained$110worthofelectronics[1].By2003theelectronicscontentwas$1510pervehicleandisexpectedtoreach$2285in2013[2].Theturningpointinautomotiveelectronicswasgovernment

TABLEI

MAJORAUTOMOTIVEELECTRONICSYSTEMS

TABLEII

AUTOMOTIVETEMPERATUREEXTREMES（DELPHIDELCOELECTRONICSYSTEMS）[3]

regulationinthe1970smandatingemissionscontrolandfueleconomy.Thecomplexfuelcontrolrequiredcouldnotbeaccomplishedusingtraditionalmechanicalsystems.Thesegovernmentregulationscoupledwithincreasingsemiconductorcomputingpoweratdecreasingcosthaveledtoaneverincreasingarrayofautomotiveelectronics.AutomotiveelectronicscanbedividedintofivemajorcategoriesasshowninTableI.

Theoperatingtemperatureoftheelectronicsisafunctionoflocation,powerdissipationbytheelectronics,andthethermaldesign.Theautomotiveelectronicsindustrydefineshigh-temperatureelectronicsaselectronicsoperatingabove125℃.However,theactualtemperatureforvariouselectronicsmountinglocationsvariesconsiderably.DelphiDelcoElectronicSystemsrecentlypublishedthetypicalcontinuousmaximumtemperaturesasreproducedinTableII[3].ThecorrespondingunderhoodtemperaturesareshowninFig.1.Theauthorsnotethattypicaljunctiontemperaturesforintegratedcircuitsare10℃to15℃higherthanambientorbaseplatetemperature,whilepowerdevicescanreach25℃higher.At-enginetemperaturesof125℃peakcanbemaintainedbyplacingtheelectronicsontheintakemanifold.

Fig.1.Enginecompartmentthermalprofile（DelphiDelcoElectronicSystems）[3].

TABLEIII

THEAUTOMOTIVEENVIRONMENT（GENERALMOTORSANDDELPHIDELCO

ELECTRONICSYSTEMS）[4]

TABLEIV

REQUIREDOPERATIONTEMPERATUREFORAUTOMOTIVEELECTRONIC

SYSTEMS（TOYOTAMOTORCORP.[5]

TABLEV

MECHATRONICMAXIMUMTEMPERATURERANGES（DAIMLERCHRYSLER,EATONCORPORATION,ANDAUBURNUNIVERSITY）[6]

Fig.2.Automotivetemperaturesandrelatedsystems（DaimlerChrysler）[8].

automotiveelectronicsystems[8].Fig.3showsanactualmeasuredtransmissiontemperatureprofileduringnormalandexcessivedrivingconditions[8].Powerbrakingisacommonlyusedtestconditionwherethebrakesareappliedandtheengineisrevvedwiththetransmissioningear.Asimilarreal-worldsituationwouldbeapplyingthrottlewiththeemergencybrakeapplied.Notethatwhenthetemperaturereached135℃,theovertemperaturelightcameonandatthepeaktemperatureof145℃,thetransmissionwasbeginningtosmellofburnttransmissionfluid.

TABLEVI

2002INTERNATIONALTECHNOLOGYROADMAPFORSEMICONDUCTORSAMBIENTOPERATINGTEMPERATURESFORHARSHENVIRONMENTS（AUTOMOTIVE）[9]

The2002updatetotheInternationalTechnologyRoadmapforSemiconductors（ITRS）didnotreflecttheneedforhigheroperatingtemperaturesforcomplexintegratedcircuits,butdidrecognizeincreasingtemperaturerequirementsforpowerandlineardevicesasshowninTableVI[9].Highertemperaturepowerdevices（diodesandtransistors）willbeusedforthepowersectionofpowerconvertersandmotordrivesforelectromechanicalactuators.Highertemperaturelineardeviceswillbeusedforanalogcontrolofpowerconvertersandforamplificationandsomesignalprocessingofsensoroutputspriortotransmissiontothecontrolunits.Itshouldbenotedthatatthemaximumratedtemperatureforapowerdevice,thepowerhandlingcapabilityisderatedtozero.Thus,a200℃ratedpowertransistorina200℃environmentwouldhavezerocurrentcarryingcapability.Thus,theactualoperatingenvironmentsmustbelowerthanthemaximumrating.

Inthe2003editionoftheITRS,themaximumjunctiontemperaturesidentifiedforharsh-environmentcomplexintegratedcircuitswasraisedto150℃through2018[9].Theambientoperatingtemperatureextremeforharsh-environmentcomplexintegratedcircuitswasdefinedas40℃to125℃through2009,increasingto40℃to150℃for2010andbeyond.Power/lineardeviceswerenotseparatelylistedin2003.

TheITRSisconsistentwiththecurrentautomotivehigh-temperaturelimitations.DelphiDelcoElectronicSystemsofferstwoproductionenginecontrollers（oneonceramicandoneonthinlaminate）fordirectmountingontheengine.Thesecontrollersareratedforoperationoverthetemperaturerangeof40℃to125℃.TheECUmustbemountedonthecoolestspotontheengine.Thepackagingtechnologyisconsistentwith140℃operation,buttheECUislimitedbysemiconductorandcapacitortechnologiesto125℃.

ThefutureprojectionsintheITRSarenotconsistentwiththedesiretoplacecontrollerson-engineorin-transmission.Itwillnotalwaysbepossibletousethecoolestlocationformountingcontrolunits.DelphiDelcoElectronicsSystemshasdevelopedanin-transmissioncontrollerforuseinanambienttemperatureof140℃[10]usingceramicsubstratetechnology.DaimlerChryslerisalsodesigninganin-transmissioncontrollerforusewithamaximumambienttemperatureof150℃（Figs.4and5）[11].

II.MECHATRONICS

Mechatronics,ortheintegrationofelectricalandmechanicalsystemsoffersanumberofadvantagesinautomotiveassembly.Integrationoftheenginecontrollerwiththeengineallowspretestoftheengineasacompletesystempriortovehicleassembly.Likewisewiththeintegrationofthetransmissioncontrollerandthetransmission,pretestingandtuningtoaccountformachiningvariationscanbeperformedatthetransmissionfactorypriortoshipmenttotheautomobileassemblysite.Inaddition,mostofthewiresconnectingtoatransmissioncontrollerruntothesolenoidpackinsidethetransmission.Integrationofthecontrollerintothetransmissionreducesthewiringharnessrequirementsattheautomobileassemblylevel.

Fig.4.PrototypeDaimlerChryslerceramictransmissioncontroller[11]

Fig.5.DaimlerChryslerin-transmissionmodule[11].

Thetrendinautomotivedesignistodistributecontrolwithnetworkcommunications.AstheindustrymovestomoreX-by-wiresystems,thistrendwillcontinue.Automotivefinalassemblyplantsassemblesubsystemsandcomponentssuppliedbynumerousvendorstobuildthevehicle.Completemechatronicsubsystemssimplifythedesign,integration,management,inventorycontrol,andassemblyofvehicles.Asdiscussedintheprevioussection,highertemperatureelectronicswillberequiredtomeetfuturemechatronicdesigns.

III.PACKAGINGCHALLENGESAT125℃

Trendsinelectronicspackaging,drivenbycomputerandportableproductsareresultinginpackageswhichwillnotmeetunderhoodautomotiverequirementsat125℃.Mostnotableareleadlessandareaarraypackagessuchassmallballgrid

arrays（BGAs）andquadflatpacksno-lead（QFNs）.Fig.6showsthethermalcycletest40℃to125℃resultsfortwosizesofQFNfromtwosuppliers[12].Atypicalrequirementisfortheproducttosurvive2000–2500thermalcycleswith<1%failureforunderhoodapplications.SmallerI/OQFNshavebeenfoundtomeettherequirements.

Fig.7presentsthethermalcycleresultsforBGAsofvariousbodysizes[13].ThediesizeintheBGAremainedconstant（8.6*8.6mm）.Asthebodysizedecreasessodoesthereliability.Onlythe23-mmBGAmeetstherequirements.The15-mmBGAwiththe0.56-mm-thickBTsubstratenearlymeetstheminimumrequirements.However,theindustrytrendistouse