工作中常用中英文.docx
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工作中常用中英文
斯比泰电子(深圳)有限公司*英语篇*
工作中常用中英文(含缩略语)
一、一般英语:
1.采购-purchase
2.材料-material
3.评估-evaluation
4.供应商-supplier/vendor
5.总经理-generalmanager(GM)
6.进料incoming
7.质量quality
8.控制-control
9.装箱单-packinglist
10.数量-quantity
11.型号-model
12.描述-description
13.制表/发布-issue
14.表格-form
15.文件-document
16.制造商-manufacturer
17.接收-accept(Acc.)
18.拒收-reject(Rej.)
19.项目-item
20.个-piece(Pc.)
21.放宽-waive
22.缺陷-defect
23.合格-pass
24.不合格-notgood(NG)
25.日期-date
26.生产线-productionline/line
27.备注-remark
28.仓库-store
29.产品-product
30.静电敏感元件-staticsensitivedevice(SSD)
31.静电释放-electricitystaticdischarge(ESD)
32.进-in
33.出-out
34.结余-balance
35.备注-remark
36.参数-reference
37.单位-UM
38.标签-label
39.打印-print
40.计划-plan
41.图表-chart
42.质量-quality
43.传真-fax
44.新加坡-Singapore
45.检查-check
46.箱子-case/carton
47.盒子-box
48.系列号-serialnumber(S/N)
49.部门-department(Dept.)
50.客户-customer
51.通知-notice
52.清单-bill
53.平均-average
54.文控中心-documentcontrolcenter(DCC)
55.计划员-planner
56.流程图-flowchart
57.工艺-instruction
58.校准-calibration
59.校验-verify
60.设备-equipment
61.培训-training
62.不良品-failedproduct
63.预计-forecast
64.安全-safety
65.程序-program/procedure
66.图纸-drawing
67.过程-process
68.隔离-separate/insulate
69.返工-rework
70.合同-contract
71.准时-justintime(JIT)
72.准时交付-deliveryontime
73.运输-shipment/transportation
74.方式-method
75.费用-cost
76.报废-scrap
二、专业英语:
物资部——常用中英文缩略语:
1.CO:
CustomerOrder客户订单
2.MO:
ManufactureOrder生产订单
3.PO:
PurchaseOrder采购订单
4.DO:
DeliveryOrder发货单
5.FCST:
ForecastOrder预测订单
6.MRPII:
ManufacturingResourcePlanningMRPII系统
7.FS:
FourthShift四班系统
8.PMC:
PlannerMaterialcontrol计划员
9.MRB:
MaterialReviewBoard物料评审会议
10.RTV:
ReturnToVendor退还供应商
11.ECN:
EngineeringChangeNotice工程更改通知
12.GRN:
GoodsReceivedNote材料入库单
13.PWO:
ProductionWorkOrder配发单
14.MRF:
MaterialsRequisitionForm材料申请单
15.AMRF:
Non-Prod/AuxMaterialsRequisitionForm辅助物料申请单
16.RTS:
ReturnToStore回库单
17.SCRAP:
ScrapForm报废单
18.RCN:
ResultChangedNote进检结果更改单
19.ITN:
InventoryTransferNote移库单
20.INV:
Invoice发票
21.DN:
DebitNote借方凭单
22.CN:
CreditNote贷方凭单
23.PCBA:
PrintedCircleBoardAssembly印刷线路板组装,
24.IQC:
IncomingQualityControl进料品质控制
25.IPQC:
InProcessQualityControl在线品质检查
26.SMT:
SurfaceMountingTechnology表面贴装技术
27.AI:
AutomaticInsertion自动插装
28.WIP:
WorkInProcess在制品
29.PCB:
PrintedCircleBoard印刷电路板
30.PCBA:
PrintedCircleBoardAssembly印刷电路板组装
31.P/A:
PCBAssembly电子产品装配
32.ICT:
InternalCircleTest内部线路测试
33.FCT:
FunctionTest功能测试
34.BOM:
BillofMaterial材料清单
35.AVL:
ApprovedVendorList合格供应商清单
36.DOC:
DeclarationofConformity符合性声明,由供方向客户或相关方提供。
37.SOC:
StatementofConformity符合性公告,由供方向公众提供。
38.VCAR:
VendorCorrectiveActionReport供应商改善措施报告
39.QA:
QualityAssurance品质保证
40.ESD:
ElectrostaticDischarge静电放电
41.4M1E:
Man/Machine/Material/Method/Environment人/机器/原材料/作业方法/环境
42.FMEA:
FailureModeEffectAnalysis失效模式与后果分析
43.CP:
ControlPlan控制计划
44.ISO:
InternationalStandardizationOrganization国际标准化组织
45.EDX-720:
EnergyDispersiveX-RaySpectrometer,能量色散型X荧光光谱仪。
品质部——常用中英文缩略语
1.4M1E:
Man/Machine/Material/Method/Environment人/机器/原材料/作业方法/环境
2.AI:
AutomaticInsertion自动插装
3.AQL:
AcceptedQualityLevel品质充收水准
4.AOI:
AutoOpticsInspection自动光学检测
5.AOQ:
AverageOutgoingQuality平均出货水平
6.APQP:
AdvancedProductQualityPlanning产品先期策划
7.AVL:
ApprovedVendorList合格供应商清单
8.BOM:
BillofMaterial材料清单
9.BS:
BottomSide下表面(通常指PCBA的焊点面)
10.CP:
ControlPlan控制计划
11.COC:
CertificateofConformance一致性声明
12.CAR:
CorrectiveActionReport改善措施报告
13.CPK:
CapabilityProcessIndex制程能力指数
14.CTQ:
CriticaltoQuality关键质量特性
15.DMAIC:
Define-Measure-Analyse-Improve-Control定义-测量-分析-改善-控制(6Sigma分析的5个步骤)
16.DOC:
DeclarationofConformity符合性声明
17.DPMO:
DefectPerMillionOpportunity百万缺陷机会数
18.DOE:
DesignofExperiment实验设计
19.ECN:
EngineeringChangeNotice工程更攺通知
20.EMC:
ElectroMagneticCompatibility电磁兼容
21.ESD:
ElectrostaticDischarge静电放电
22.FMEA:
FailureModeEffectAnalysis失效模式与后果分析
23.F/A:
Final(Product)Assembly最终装配(总装)
24.FQC:
FinalQualityCheck最终品质检查
25.FCT:
FunctionTest功能测试
26.FAAR:
FirstArticleApprovedReport首件检验报告
27.FIFO:
FirstInFirstOut先入先出
28.ISO:
InternationalStandardizationOrganization国际标准化组织
29.IQC:
IncomingQualityCheck进料品质检查
30.IPQC:
InProcessQualityControl在线品质检查
31.ICT:
InternalCircleTest内部线路测试
32.LSL:
LowerSpecificationLimit规格下限
33.LCL:
LowerControlLimit控制下限
34.MRB:
MaterialReviewBoard物料评审会议
35.MSA:
MeasureSystemAnalysis测量系统分析
36.MSDS:
MaterialSafetyDataSheet原材料安全资料
37.MTBF:
MeanTimeBetweenFailures平均无故障时间
38.ODM:
OriginalDesign&Manufacture委托设计与制造
39.OEM:
OriginalEquipmentManufacture委托代工
40.OQA:
OutgoingQualityAssurance出货品质保证
41.ORT:
OutgoingReliabilityTest出货产品可靠性测试
42.P/A:
PCBAssembly电子产品装配
43.PDCA:
Plan-Do-Check-Action计划-做-检查-规范(一种管理模式)
44.PCB:
PrintedCircleBoard印刷电路板
45.PCBA:
PrintedCircleBoardAssembly印刷电路板组装
46.PPAP:
ProductionPartApprovalProcess生产件批准程序
47.QA:
QualityAssurance品质保证
48.QCC:
QualityControlCircle品管圈
49.QE:
QualityEngineering品质工程
50.QFD:
QualityFunctionDeployment质量功能展开
51.QMS:
QualityManagementSystem品质管理体系
52.R&R:
Repeatability&Reproducibility(测量系统中)重复性和再现性
53.SCAR:
SupplierCorrectiveActionReport供应商改善措施报告
54.SMT:
SurfaceMountingTechnology表面贴装技术
55.SQE:
SupplierQualityEngineering供应商品质工程
56.SOC:
StatementofConformity符合性公告
57.SPC:
StatisticalProcessControl统计过程控制
58.TQM:
TotalQualityManagement全面质量管理
59.TPM:
TotalProductionManagement全面生产管理
60.TS:
TopSide上表面(通常指PCBA的元件面)
61.USL:
UpperSpecificationLimit规格上限
62.UCL:
UpperControlLimit控制上限
63.VCAR:
VendorCorrectiveActionReport供应商改善措施报告
64.WIP:
WorkInProcess在制品
65.WI:
WorkingInstruction操作指引
SMT——常用中英文缩略语
1.表面贴装技术-surfacemountingtechnology(SMT)
2.品质计划-qualityplan(QP)
3.制造工程师-manufacturingengineer(ME)
4.文控中心-documentcontrolcenter(DCC)
5.组织结构图-organizationchart
6.流程图-flowchart
7.产品品质先期策划-advancedproductqualityplanning(APQP)
8.潜在失效模式及影响分析-potentialfailuremodelandeffectanalysis(PFMEA)
9.控制计划-controlplan(CP)
10.工艺-instruction
11.出货检查标准-outgoingqualityinspectioninstruction
12.工程更改通知-engineeringchangenotice(ECN)
13.锡膏-solderpaste
14.红胶-glue
15.印锡-pasteprinting
16.在线测试-incircletest(ICT)
17.设备-equipment
18.培训-training
19.不良品-failedproduct
20.预计-forecast
21.生产订单-manufacturingorder(MO)
22.印锡机-printingmachine
23.贴片机-mounter
24.烘炉-oven
25.自动插机-automaticinsert(AI)
26.制程中-workinprocess(WIP)
27.百万分之-PPM
28.钢网:
stencil
29.表面贴装设备:
surfacemountdevice(SMD)
30.飞达:
feeder
31.印刷线路板:
printcircuitboard(PCB)
32.BS面:
bottomside(BS)
33.TS面:
topside(TS)
34.自动插件:
automaticinsertion(AI)
35.单列直插:
singlelinepackage(SIP)
36.双列直插:
duallinepackage(DIP)
37.小型封装晶体管:
smalloutlettransistor(SOT)
38.电阻:
resistor(R)
39.电容:
capacitor(C)
40.二极管:
diode(D)
41.三极管:
transistor(T)
42.电感:
inductor(L)
43.晶振:
crystal
44.连接器:
connector
45.开关:
switch
46.球形触点阵列:
ballgridarray(BGA)
47.四侧引脚扁平封装:
quadflatpackage(QFP)
48.板上芯片封装:
chiponboard(COB)
生产部——常用中英文缩略语
PCB组装
1.插机-insert/insertion
2.外观检查-visualinspection
3.波峰焊接-wavesoldering
4.过波峰模板-panel
5.分板-depanning
6.补焊-touchup
7.清洗-clearing
8.点胶-gluing
9.功能测试-functiontest
10.自动测试仪-automatictestmachine(ATM)
11.高压测试-hi-pottest
12.绝缘测试-insulationtest
13.老化-burn-in
14.包装-packing
15.客户样品-goldensample/customersample
16.试生产-trialrun
17.临时样品-temporarysample
18.功能测试-functiontest
19.终检-finalinspection
20.试产报告-trialrunreport
21.首件报告-firstarticleapprovalreport(FAAR)
22.在线品质控制-inprocessqualitycontrol(IPQC)
23.可疑材料-suspectmaterial
24.纠正措施-correctiveaction
25.预防措施-preventiveaction
26.改善措施报告-correctiveactionreport(CAR)
总装
27.总装-finalassembly
28.超音波焊接机-supersonicweldingmachine
29.基准-benchmark
30.测量系统分析-measurementsystemanalysis(MSA)
31.量具重复性和再现性-gaugerepeatability&reproducibility(GR&R
32.灌胶:
fillglue
其它
33.待检区:
check-waitingzone
34.周转箱:
boxturnover
35.电阻:
resistor(R)
36.电容:
capacitor(C)
37.二极管:
diode(D)
38.三极管:
transistor(T)
39.电感:
inductor(L)
40.晶振:
crystal
41.连接器:
connector
42.开关:
switch
43.成品区:
finishedproductzone
44.项目组:
itembrigade
45.工具:
Toolfacility
46.工艺-instruction
47.设备-equipment
48.不良品-failedproduct
49.生产订单-manufacturingorder(MO)
50.不良品-failedproduct
51.锡炉:
stannumfurnace
52.报表:
reportforms
53.宣传栏:
announcecote
ME部——常用中英文缩略语
1.品质计划-qualityplan(QP)
2.制造工程师-manufacturingengineer(ME)
3.项目工程师-projectengineer(PE)
4.文控中心-documentcontrolcenter(DCC)
5.组织结构图-organizationchart
6.流程图-flowchart
7.产品品质先期策划-advancedproductqualityplanning(APQP)
8.潜在失效模式及影响分析-potentialfailuremodelandeffectanalysis(PFMEA)
9.控制计划-controlplan(CP)
10.线路板总装-printcircuitboardassembly(PCBA)
11.工艺-workinstruction
12.出货检查标准-outgoingqualityinspectioninstruction
12.工程更改通知-engineeringchangenotice(ECN)
13.临时工程更改通知-temporarilyengineeringchangenotice(TECN)
14.设计更改通知-designengineeringchangenotice(DECN)
15.温度曲线-profile
16.x-ray
17.BGA返修台
18.锡膏-solderpaste
16.红胶-glue
17.印锡-pasteprinting
18.在线测试-incircletest(ICT)
17.设备-equipment
18.培训-training
19.不良品-failedproduct
20.预计-forecast
21.生产订单-manufacturingorder(MO)
22.印锡机-printingmachine
23.贴片机-mounter
24.烘炉-oven
25.自动插机-automaticinsert(AI)
26.制程中-workinprocess(WIP)
27.百万分之-PPM
产品技术部——常用中英文缩略语
1.charge 充电器
2.transformer 变压器
3.inductance 电感
4.leakage inductance 漏感
5.automatic test equipment自动测试设备
6.wron