光刻胶参数大全.docx

光刻胶参数大全.docx

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光刻胶参数大全

SummaryofPhotoresists

4000rpm

Typeapplication/conditionDo[µm]

product

sprayresistsforcomplextopologies[6]AR-P1250

sprayresistfordifferentapplications[0,5-10]AR-P1210,1220,1230new

Positiveresists

productionofmasks,opticalapplications1,0;0,6AR-P3110,3120

thickresistswithhighstruct.accuracyupto40µm10;5AR-P3210,3250

thickresistwithhightransparencyupto100µm10AR-P3220

wideprocessrangeforpatterns<2µm2,0;1,4AR-P3510（T）,3540（T）

highresolutionforsub-structures1,4;1,4AR-P3740,3840

protectivecoat.,KOH-resistent,adhesionenlarged1,1;2,2AR-PC503,504

lift-off-structures5;1,0AR-P5320,5350

two-layers-lift-off-systemwithAR-P35101,0;0,5AR-P5460,5480

Image

reversaloptionalpositiveornegative

1,8;1,4;0,6AR-U4030,4040,4060

NewdevelopmentsNegativeresists

spraycoating,fordifferentapplications[0,5-10]AR-N2210,2220,2230new

✆positiveresistsAR-P1210-1230

stablesub-µmstructures,midanddeepUV1,4AR-N4240highresponsetoi-line（g-line,deepUV）1,4AR-N4340

CAR44:

layersupto100µm,aqueousalkalinedevelopment,easytoremove

1000rpm:

10;25;50

AR-N4400-10,-25,-50

additionalforlift-off-structures10AR-N4450-10

experimentalsamples,readyforproduction

resistsforspraycoating

thickresistwithhighvicosityandthermalstability

resistfordeepUV,etchresistant

alkalinestable,ableforstructuring

4000rpm:

6

0,6

1,4

newdevelopments:

XAR-P1270

XAR-P3220/7

XAR-P5800/7

XAR-P5900/4

Processchemicals

thinner:

safersolventAR300-12

developer:

bufferedsystems,concentratAR300-26,300-35developer:

metalionfree,differentconcentrationsAR300-44…-475

Remover:

organicsolventsAR600-70,300-70,-72

Remover:

aqueous-alkalineAR300-73

adhesionpromoterAR300-80,HMDS

✆pricelists:

photoresists,experimentalsamples,AVB

asofJanuary2011

PhotoresistforspraycoatingAR-P1250

1.Generaldescription

TheresistAR-P1250isahighlysensitive,positivelyworkingphotoresistforspraycoatingapplications.Itcontainsasolventmixturewhichfacilitatesafasterdryingofthefilms.

Duetothemodifiedsurfacetension,highlysmoothfilmscanbegeneratedwhichallowanimprovedcoveringoftopologicalstructures.

TheAR-P1250isdesignedforparticularlycomplextopologies.

Theresistcontainsasafersolventmixtureswithmethylethylketoneand（1-methoxy-2-propyl）-acetateasmaincomponents.

2.Parameters

Properties/ResistAR-P1250

Solidcontent%5

Viscosity（25°C）mPa⋅s1

Spraycoating

Resistthicknessdependsonusableequipmentheavy,Testsarenecessary

µm6

2-12

Flashpoint°C10

Filtrationµm0.2

Storage°C10-18

Guaranteefromdateofsalemonth6

3.Processchemicals

DeveloperAR300-35

RemoverAR300-70

4.ProcessingofAR-P1250

Aftertheresisthasbeenadaptedtothetemperatureofthepreferablyair-conditionedworkspace（op-timalconditionsare20-25°Catarelativehumidityof30-50%）,theresistisappliedusingaspraycoatingprocedure.Thequalityofthecoatingishighlydependentontherespectivespraycoatingequipmentbeingused.Manuallyadjustableequipmentparameterssuchasdispenserate,scanningspeed,anddistancehaveanimportantinfluenceonthefilmsgenerated.Ownexperimentstodetermineopti-mumparametersareabsolutelyrequired.

WithAR-P1250,filmthicknessvaluesofapprox.4-8µmcanbereachedwhenusingstan-dardparameters.Higherthicknessvaluescaneasilybeobtainedwithhigherdispenseratesormulti-plecoatingsteps.

Afterthecoatingstep,thebakeshouldbeperformedonahotplateat85-90°Cfor2–5min（>6µmfor5min）orinaconvectionovenat85°Cfor25min.

Forexposure,theentireUV-rangefrom300to450nmcanbeused.Thedurationofexposuretimedependsonthefilmsize.Forthicknessvaluesofabout8µm,thesensitivityisonlyapproximately50mJ/cm².Thus,veryshortexposuretimesarepossible,whichisadvantageousinordertoavoidundesir-ablereflectionswhentopologicallystructuredwafersareexposed.

Forthedevelopmentofexposedresistsfilms,DeveloperAR300-35indilutionsof3:

1to1:

1arerecommended.A1:

1-dilutionshouldpreferablybeusedinthosecasewhenedgesofetchedcavitiesarecoveredwithonlythinfilms.Thedevelopmentstepshouldamounttoroughly1-3min（3minfor1:

1-dilutions）.

Immediatelyafterdevelopment,resistlayershavetoberinsedanddried.

3.CleaningandRemoval

SubstratesandequipmentscanbecleanedwiththeThinnerAR300-12ortheRemoverAR600-70.Toremovehard-bakedlayersitisrecommendedtousetheRemoverAR300-70or300-72.Veryhard-bakedlayers（plasmaprocessingorUV-stabilization）needatreatmentwithoxidizingacids.

4.WasteWaterDisposal

Wastesmaybedisposedofatcontrolledlandfillsorbycontrolledcombustioninofficiallyauthorizedplants.

5.SafetyReferences

Resist,thinner,andremovercontainorganicsolvents,demandinganadequateventilationintheworkingarea.Developershowanalkalinereactionandmayirritatetheskin.Avoiddirectcontactwithproductsandtheirvapours（wearsafetyglassesandprotectivegloves）!

Pleaseaskforoursafetydatasheets.ofJan.2009

NewdevelopmentPhotoresistseriesforspraycoatingAR-P1200（positive）andAR-N2200（negative）

1.Generaldescription

ResistsoftheseriesAR-P1210-1230aresensitive,positivelyworkingsprayresistsforthreeroutineapplicationswithhighstructuralquality.Theyareprovidedasready-to-useresistsandapplicablewithallcommerciallyavailablespraycoatingdevices.Withtheirotherwisecorrespondingfeatures,theseresistsareequivalenttothenegative-tonesprayresistsofse-riesAR-N2210-2230.

Bothresistseriescontainadifferentcompositionofsolventstoallowadefineddryingoffilmsdependingontherespectivepurposeandareofferedforthreegeneralfieldsofapplication:

AR-P1210,AR-N2210foranevencoverageofverticaltrenchesAR-P1220,AR-N2220foretched54°slopes

AR-P1230,AR-N2230forplanarwafersurfaces

Incontrasttosprayresistsforhighlystructuredtopologies（AZ4999）,thenewdevelopmentsAR-P1210andAR-N2210formevensurfaces,i.e.surfacesaresmoother.Duetothespecificsolventcomposition,evaporationisslower,butneverthelessacompleteandsufficientcoatingofthesubstrateisgiven.

Theresistscontainsolventmixtureswithmethylethylketoneand1-methoxy-2-propyl-acetate（safersol-vent）asmaincomponents.

2.Parameter

Properties/Resist

AR-P/N

1210

1220

1230

2210

2220

2230

Solidcontent

%

4

4

4

4

4

4

Viscosity（25°C）

mPa⋅s

0.5

0.6

1.3

0.5

0.6

1.3

Filmthicknesswithspraycoatingµm4-103-80.5-14-103-80.5-1

（stronglydevice-specific）

Flashpoint

°C

1

9

37

1

9

37

Filtration

µm

0.2

Storage

°C

10-18

Storageguaranteefromdate

month

6

ofsale

3.Processchemicals

Developer

AR

300-44

Remover

...

AR

300-70

pleaseturnover!

4.ProcessingofAR-P/N1210…2230

（1.）Aftertheresisthasbeenadaptedtothetemperatureofthepreferablyair-conditionedworkspace（optimalconditions20-25°Catarelativehumidityof30-50%）,theresistsarefilledintothecartridgesofthespraycoaterunderyellowsafelight.TheusuallyoccurringgasformationintheresistsupplylineisnotobservedwithARresists.Theresististhenappliedviaspraycoating.

Thequalityofthecoatingdependslargelyupontherespectivespraycoatingdeviceused.Manuallyad-justableequipmentparameterssuchasdispenserate,scanningspeed,spraydistanceandchucktem-peraturehaveamajorinfluenceonthefilmformingprocess.Commerciallyavailablesprayingequip-mentsclearlydifferwithrespecttothecoatingproperties,andownexperimentsarethusabsolutelyrequiredinordertodetermineoptimalparameters.

ExemplaryparametersforAR-P1220andAR-N2220asdeterminedwithspraycoater“GammaAl-taspray“aresummarizedinthetablebelow:

Spraycoater

GammaAltaspray,SüssMicroTec

PositiveresistAR-P1220

NegativeresistAR-N2220

Resistflowspeed

25drops/min

40drops/min

Armspeed

75mm/s

90mm/s

N2-pressure

0.9bar

0.9bar

Exposure

NikonStepperB14,i-line,NA=0.65

NikonStepperB14,i-line,NA=0.65

Sensitivity（filmthickness）

200mJ/cm²（5µm）

70mJ/cm²（5µm）

DevelopmentwithAR300-44

4x60spuddle

4x60spuddle

Minimumresolution

1.2µm

1.4µm

temperatureofchuck:

82°C,nozzleheight:

20nm

WithresistsAR-P1210and1220aswellasAR-N2210and2210,filmthicknessvaluesof4-8µmcanbeobtainedunderstandardconditions.Higherfilmthicknessvaluescaneasilybegeneratedwithhigherdispenseratesorbymultiplecoatingsteps.IncomparisonwithAZ4999,theseresistshavealowertendencytoformdisturbingbeads.

Inordertoproducethinfilmsbetween0.5-1µm,resistsAR-P1230andAR-N2230arewellsuited,whichcanbeusedforspraycoatingandspincoatingapplicationsaswellasforresistdepositionbyspincoating.Filmthicknessvaluesachievedbyspincoatingareintherangeofapproximately50-120nm.

（2.）Ifthecoatingprocedureisperformedonheatedchucks,resistfilmsaresufficientlydriedupondepositionatatemperatureof70–80°C,andnofurtherbakestepisrequired.

Usingnon-heatedchuckshowever,coatedsubstratesshouldbebakedonahotplateat85-90°Cfor2-5minorinaconvectionovenat85°Cfor25mininordertoimproveadhesion.