光刻胶参数大全.docx

1、光刻胶参数大全Summary of Photoresists4000 rpmType application / condition Do mproductspray resists for complex topologies 6 AR-P 1250spray resist for different applications 0,5-10 AR-P 1210, 1220, 1230 newPositive resistsproduction of masks, optical applications 1,0 ; 0,6 AR-P 3110, 3120thick resists with

2、high struct. accuracy up to 40 m 10 ; 5 AR-P 3210, 3250thick resist with high transparency up to 100 m 10 AR-P 3220wide process range for patterns 6 m for 5 min) or in a convection oven at 85 C for 25 min.For exposure, the entire UV-range from 300 to 450 nm can be used. The duration of exposure time

3、 depends on the film size. For thickness values of about 8 m, the sensitivity is only approximately 50 mJ/cm. Thus, very short exposure times are possible, which is advantageous in order to avoid undesir- able reflections when topologically structured wafers are exposed.For the development of expose

4、d resists films, Developer AR 300-35 in dilutions of 3 : 1 to 1 : 1 are recommended. A 1 : 1-dilution should preferably be used in those case when edges of etched cavities are covered with only thin films. The development step should amount to roughly 1 - 3 min (3 min for1 : 1- dilutions).Immediatel

5、y after development, resist layers have to be rinsed and dried.3. Cleaning and RemovalSubstrates and equipments can be cleaned with the Thinner AR 300-12 or the Remover AR 600-70. To remove hard-baked layers it is recommended to use the Remover AR 300-70 or 300-72. Very hard-baked layers (plasma pro

6、cessing or UV-stabilization) need a treatment with oxidizing acids.4. Waste Water DisposalWastes may be disposed of at controlled landfills or by controlled combustion in officially authorized plants.5. Safety ReferencesResist, thinner, and remover contain organic solvents, demanding an adequate ven

7、tilation in the working area. Developer show an alkaline reaction and may irritate the skin. Avoid direct contact with products and their vapours (wear safety glasses and protective gloves)!Please ask for our safety data sheets. of Jan. 2009New development Photoresist series for spray coating AR-P 1

8、200 (positive) and AR-N 2200 (negative)1. General descriptionResists of the series AR-P 1210-1230 are sensitive, positively working spray resists for three routine applications with high structural quality. They are provided as ready-to-use resists and applicable with all commercially available spra

9、y coating devices. With their otherwise corresponding features, these resists are equivalent to the negative-tone spray resists of se- ries AR-N 2210-2230.Both resist series contain a different composition of solvents to allow a defined drying of films depending on the respective purpose and are off

10、ered for three general fields of application:AR-P 1210, AR-N 2210 for an even coverage of vertical trenches AR-P 1220, AR-N 2220 for etched 54 slopesAR-P 1230, AR-N 2230 for planar wafer surfacesIn contrast to spray resists for highly structured topologies (AZ 4999), the new developments AR-P 1210 a

11、nd AR-N 2210 form even surfaces, i.e. surfaces are smoother. Due to the specific solvent composition, evaporation is slower, but nevertheless a complete and sufficient coating of the substrate is given.The resists contain solvent mixtures with methyl ethyl ketone and 1-methoxy-2-propyl-acetate (safe

12、r sol- vent) as main components.2. ParameterProperties / ResistAR-P/N121012201230221022202230Solid content%444444Viscosity (25 C)mPas0.50.61.30.50.61.3Film thickness with spray coating m 4 - 10 3 - 8 0.5 - 1 4 - 10 3 - 8 0.5 - 1(strongly device-specific)Flash point C19371937Filtrationm0.2Storage C10

13、 - 18Storage guarantee from datemonth6of sale3. Process chemicalsDeveloperAR300-44Remover. . .AR300-70please turn over!4. Processing of AR-P/N 1210 2230(1.) After the resist has been adapted to the temperature of the preferably air-conditioned workspace (optimal conditions 20 - 25 C at a relative hu

14、midity of 30 - 50 %), the resists are filled into the cartridges of the spray coater under yellow safe light. The usually occurring gas formation in the resist supply line is not observed with AR resists. The resist is then applied via spray coating.The quality of the coating depends largely upon th

15、e respective spray coating device used. Manually ad- justable equipment parameters such as dispense rate, scanning speed, spray distance and chuck tem- perature have a major influence on the film forming process. Commercially available spraying equip- ments clearly differ with respect to the coating

16、 properties, and own experiments are thus absolutely required in order to determine optimal parameters.Exemplary parameters for AR-P 1220 and AR-N 2220 as determined with spray coater “Gamma Al- taspray“ are summarized in the table below:Spray coaterGamma Altaspray, Sss MicroTecPositive resist AR-P

17、1220Negative resist AR-N 2220Resist flow speed25 drops/min40 drops/minArm speed75 mm/s90 mm/sN2 - pressure0.9 bar0.9 barExposureNikon Stepper B14, i-line, NA = 0.65Nikon Stepper B14, i-line, NA = 0.65Sensitivity (film thickness)200 mJ/cm (5 m)70 mJ/cm (5 m)Development with AR 300-444 x 60 s puddle4

18、x 60 s puddleMinimum resolution1.2 m1.4 mtemperature of chuck: 82 C, nozzle height: 20 nmWith resists AR-P 1210 and 1220 as well as AR-N 2210 and 2210, film thickness values of 4 - 8 m can be obtained under standard conditions. Higher film thickness values can easily be generated with higher dispens

19、e rates or by multiple coating steps. In comparison with AZ 4999, these resists have a lower tendency to form disturbing beads.In order to produce thin films between 0.5 - 1 m, resists AR-P 1230 and AR-N 2230 are well suited, which can be used for spray coating and spin coating applications as well

20、as for resist deposition by spin coating. Film thickness values achieved by spin coating are in the range of approximately 50-120 nm.(2.) If the coating procedure is performed on heated chucks, resist films are sufficiently dried upon deposition at a temperature of 70 80 C, and no further bake step is required.Using non-heated chucks however, coated substrates should be baked on a hot plate at 85 - 90 C for 2- 5 min or in a convection oven at 85 C for 25 min in order to improve adhesion.