IGBT模块应用中的寿命和可靠性.docx

IGBT模块应用中的寿命和可靠性.docx

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IGBT模块应用中的寿命和可靠性

IGBT模块应用中的寿命和可靠性

系统寿命与可靠性关系：

可靠性：

产品在一定条件下无故障完成规定功能的能力或可能性

IGBT模块的失效模式：

功率周次Powercycling：

功率周次用于评估绑定线和Die焊层的机械寿命

Powercyclingcanestimatethebondingwireanddiesolder’slifetime

测试方法:

加载自加热，周期≤3秒，测试ΔTvj

Testmethod:

Selfheatingbyload,T_cycle≤3seconds,measureΔTvj

失效判据：

饱和压降Vcesat增大+5%

Failurecriteria:

Vcesatincreasemorethan5%

温度周次Thermalcycling

温度周次用于评估DCB下焊接层的寿命

ThermalcyclingcanestimateDCBsolder’slifetime

测试方法:

通电加热，周期5分钟，测量ΔTc

Testmethod:

Selfheatingbyload,5min/,measureΔTc

失效判据：

热阻Rthjc增大+20%

Failurecriteria:

R_thjcincrease20%

失效机理是两种材料不同的膨胀系数

（Differentmaterial’sCTE）[ppm/K]

不同应用下IGBT模块的寿命

LifetimeofIGBTmoduleindifferentapplication

Therearemanyapplicationsandsimilartypesofpowermodules.

Mainobjectiveis:

howtoselectanactivedeviceinordertoreachdesiredsystemlifetime?

Isitpossibletohavepowermodulesuitingtoallapplications?

由周期内系统工况变化获得温度变化

Getthetemperatureprofilebypowerprofileinacycle

温度变化导致的失效模式

FailuremodeswithΔT

Therearetwokeyfactorsintheselectionoftheappropriatepowermodule:

1）thermal:

Tvjop

2）reliability:

wearoutmechanismswhichdeterminemodulelifetimeasresultofmodule

reliabilitycurvesandthermalstresses

Note:

RBSOAandotherelectricalphenomenaarenotcoveredinthepresentation.

Factorsandimpacts:

1）TjFWDmax≤Tvjop

TjIGBTmax≤Tviop

NowadaysTvjop=150°C

2）DTjFWD&DTjIGBTrefertoPowerCyclingreliabilitycurves

ΔTCreferstoThermalCyclingreliabilitycurves

Reliabilitycurvesarealwaysgivenbypowermodulemanufacturer

绑定线老化——功率周次曲线

Bondwiredegradation–PCcurve

功率周次曲线修正因数

PCcurvecorrectionfactor

基板焊层老化——热循环曲线

Solderonbaseplatedegradation–TCcurve

功率温度循环（PC）次数评估计算

No.ofcycleestimationcalculationwithPowercyclingcurve

实例：

稳态周期系统的寿命估算

Simplemissioncycle--exampleoflifetimeestimation

Forrelativesimplemissioncyclesthemodulelifetimebasedonthethreepresentedreliability

curvesandpowerlossesconvertedintoajunctionandcasetemperatureswingcanbeeasily

estimated.PrimePACK™moduleinuse:

FF900R12IP4D

实例：

稳态周期系统的寿命估算

Simplemissioncycle--exampleoflifetimeestimation

Questionfromlastpage:

howtoestimatethepowermodulelifetimeunderthemissioncycle,

hastoberepeatedagain.Let’scalculatethemodulewearoutasafunctionofmissioncycleandtime.

Finallifetimemoduleestimation:

wearout/year=0,3%+5.8%+4,38ppm+8,76ppm≌6.1%

Asreliabilitycurvesaregivenfor100%lifetimethemodulecanworkintheexampleapplication

for:

100%/6.1%≌16.4years

Note:

ThesecalculationsaremadeforIGBTonly.FWDhastobecalculatedseparately.

动态负载周期的寿命估算方法

Dynamicloadcycle–lifetimeestimate

MatlabcalculateslossesforgivennumberoftheloadcyclesandappliesthemtothethermalnetworksspecificforselectedmoduleinSimulink.AsaresultthejunctiontemperatureprofileforIGBT,Diodeandtheprofileofthesoldertemperatureisobtained.

Inthatcase,thesimulationwillbestopped.Overthegraphtheinformationsays,whichelementhashighertemperaturethanallowed.Ifitsbelow..

雨流计数法---随机负载谱转化为变幅或恒幅的负载谱

•把负载变化周次种类减少

•根据有限的试验数据推算整个寿命周期的变化规律，获得典型谱

Fromthetemperatureprofileanalysisthelifetime（andwearofthelifetimein%）foreachelementandsolderwillbecalculated.ThegraphswillshowthelifetimewearforeachdeltaT.Thesumofthepercentsiscalculatedandalsoshownonthegraph.

IGBT4模块的性能提升

HighperformanceofIGBT4module

IGBT4模块的150度最高允许工作结温，源于内部焊线工艺的改进，使其可靠性指标-功率周次（PC）数大幅增加！

铜绑定线CopperBondingWire--EconoDUAL™3600A

真正实现EconoDUAL™3最大输出电流能力

---@TC=100°C,Tvj=175°C

降低引线电阻RCC‘EE‘

保证功率周次，满足风力发电，电动汽车需求

提供焊接/PressFIT两种兼容版本

提供650V,1200V,1700VIGBT4全系列，便于现有设计的功率升级

PressFIT端子压接技术

Press+FIT=PressFIT

PressFITTechnology

无铅以达到RoHS环保要求

简易无焊接安装节约生产组装的成本和时间

高可靠性减少工人焊接端子中失误导致的过温和静电损坏

可靠性已在多个高端客户的产品中得到验证

超声波焊接的功率端子Ultrasonicweldedterminals

功率端子采用超声波焊接

Internalterminalconnectionsultrasonicwelded

-可增加模块端子的鲁棒性Increasedmechanicalrobustness

-可增加模块端子电流通过能力Higherterminalcurrentspossible

-无焊料可增加热传导能力maximumtemperatureevenreduced

已应用在以下的模块封装中：

PrimePACK,IHM-BTractionseries,EconoPACK™4

模块基板和衬底材料的选择以提高温度周次