电路板制作流程.ppt

电路板制作流程.ppt

《电路板制作流程.ppt》由会员分享，可在线阅读，更多相关《电路板制作流程.ppt（32页珍藏版）》请在冰豆网上搜索。

PCBProcessIntroduction（TentingProcess）PCBProcessIntroduction（TentingProcess）PCBManufacturingProcessFlowPCBManufacturingProcessFlowPCBManufacturingProcessFlowPCBManufacturingProcessFlowPCBManufacturingProcessFlowPCBManufacturingProcessFlowPCBManufacturingProcessFlowPCBManufacturingProcessFlowSHEARINGCNCDRILLPTHD/FPHOTOIMAGE（INNERLAYER）LAMINATIONCNCDRILLPANELPLATINGD/FPHOTOIMAGE（OUTERLAYER）LIQUIDSOLDERMASKHOTAIRLEVELINGROUTINGELECTRICALTESTO.Q.C.0徐振連JOHNNYHSU流流程程圖圖PCBMfg.FLOWCHARTUPDATED:

1999,04,16顧客（CUSTOMER）工程製前（FRONT-ENDDEP.）裁板（LAMINATESHEAR）內層乾膜（INNERLAYERIMAGE）預疊板及疊板（LAY-UP）通孔電鍍（P.T.H.）液態防焊（LIQUIDS/M）外觀檢查（VISUALINSPECTION）成型（FINALSHAPING）業務（SALESDEPARTMENT）生產管理（P&MCONTROL）蝕銅（I/LETCHING）鑽孔（PTHDRILLING）壓合（LAMINATION）外層乾膜（OUTERLAYERIMAGE）二次銅及錫鉛電鍍（PATTERNPLATING）蝕銅（O/LETCHING）檢查（INSPECTION）噴錫（HOTAIRLEVELING）電測（ELECTRICALTEST）出貨前檢查（OQC）包裝出貨（PACKING&SHIPPING）曝光（EXPOSURE）壓膜（LAMINATION）前處理（PRELIMINARYTREATMENT）顯影（DEVELOPIG）蝕銅（ETCHING）去膜（STRIPPING）黑化處理（BLACKOXIDE）烘烤（BAKING）預疊板及疊板（LAY-UP）壓合（LAMINATION）後處理（POSTTREATMENT）曝光（EXPOSURE）壓膜（LAMINATION）二次銅電鍍（PATTERNPLATING）錫鉛電鍍（T/LPLATING）去膜（STRIPPING）蝕銅（ETCHING）剝錫鉛（T/LSTRIPPING）塗佈印刷（S/MCOATING）預乾燥（PRE-CURE）曝光（EXPOSURE）顯影（DEVELOPING）後烘烤（POSTCURE）多層板內層流程（INNERLAYERPRODUCT）MLB全板電鍍（PANELPLATING）銅面防氧化處理（OSP（EntekCu106A）外層製作（OUTER-LAYER）TENTINGPROCESS鍍金手指（G/FPLATING）鍍化學鎳金（E-lessNi/Au）ForO.S.P.選擇性鍍鎳鍍金（SELECTIVEGOLD）印文字（SCREENLEGEND）網版製作（STENCIL）圖面（DRAWING）工作底片（WORKINGA/W）製作規範（RUNCARD）程式帶（PROGRAM）鑽孔,成型機（D.N.C.）底片（MASTERA/W）磁片,磁帶（DISK,M/T）藍圖（DRAWING）資料傳送（MODEM,FTP）AOI檢查（AOIINSPECTION）除膠渣（DESMER）通孔電鍍（E-LESSCU）DOUBLESIDE前處理（PRELIMINARYTREATMENT）前處理（PRELIMINARYTREATMENT）前處理（PRELIMINARYTREATMENT）全面鍍鎳金（S/GPLATING）雷射鑽孔（LASERABLATION）BlindedVia顯影（DEVELOPIG）1PCBManufacturingProcessintroduction顧顧客客CUSTOMER裁裁板板LAMINATESHEAR業業務務SALESDEP.生生產產管管理理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁帶藍圖DRAWING資料傳送MODEM,FTP網版製作STENCILDRAWING圖面RUNCARD製作規範PROGRAM程式帶鑽孔,成型機D.N.C.工工程程製製前前FRONT-ENDDEP.工作底片WORKINGA/W

（1）Front-endProcess（Tooling）2PCBManufacturingProcessintroduction

（2）多多層層板板內內層層製製作作流流程程曝光EXPOSURE壓膜LAMINATION前處理PRELIMINARYTREATMENT去膜STRIPPING蝕銅ETCHING顯影DEVELOPING黑化處理BLACKOXIDE烘烤BAKINGLAY-UP預疊板及疊板後處理POSTTREATMENT壓合LAMINATION內層乾膜內層乾膜INNERLAYERIMAGE預疊板及疊板預疊板及疊板LAY-UP蝕蝕銅銅I/LETCHING鑽鑽孔孔DRILLING壓壓合合LAMINATION多層板內層流程INNERLAYERPRODUCTMLBAOI檢檢查查AOIINSPECTION裁裁板板LAMINATESHEARDOUBLESIDE雷雷射射鑽鑽孔孔LASERABLATIONBlindedVia裁板初初裁裁破靶捞边3PCBManufacturingProcessintroduction通通孔電鍍孔電鍍P.T.H.鑽鑽孔孔DRILLING外外層層乾乾膜膜OUTERLAYERIMAGE二次銅及錫鉛電鍍二次銅及錫鉛電鍍PATTERNPLATING檢檢查查INSPECTION前處理PRELIMINARYTREATMENT二次銅電鍍PATTERNPLATING蝕銅ETCHING全板電鍍全板電鍍PANELPLATING外層製作OUTER-LAYERO/LETCHING蝕蝕銅銅TENTINGPROCESSDESMER除膠渣E-LESSCU通孔電鍍前處理PRELIMINARYTREATMENT剝錫鉛T/LSTRIPPING去膜STRIPPING壓膜LAMINATION錫鉛電鍍T/LPLATING曝光EXPOSURE（3）OuterLayerProcessFlow顯影DEVELOPING4PCBManufacturingProcessintroduction液態防焊液態防焊LIQUIDS/M外觀檢外觀檢查查VISUALINSPECTION成成型型FINALSHAPING檢檢查查INSPECTION電電測測ELECTRICALTEST出貨前檢查出貨前檢查OQC包包裝裝出出貨貨PACKING&SHIPPING塗佈印刷S/MCOATING前處理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING顯影POSTCURE後烘烤預乾燥PRE-CURE噴噴錫錫HOTAIRLEVELING銅面防氧化處理OSP（EntekCu106A）HOTAIRLEVELINGG/FPLATING鍍金手指鍍化學鎳金E-lessNi/AuForO.S.P.印印文文字字SCREENLEGEND選擇性鍍鎳鍍金SELECTIVEGOLD（4）SurfaceFinished&FinalInspection全面鍍鎳金GOLDPLATING5PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess1.（基板）THINCORE2.（压膜）DryFilmResistCoatEtchEtchPhotoresistPhotoresist（D/F）D/F）LaminateCopperFoil6PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess4.（显影）Develop3.（曝光）ExposeA/W（PhotoTools）A/W（PhotoTools）7PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess5.（蚀刻）Etch6.（剥膜）StripResist8PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess7.（叠合）Lay-up8.（压合）LaminationLAYER2LAYER3LAYER4LAYER5LAYER1LAYER69PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess9.（钻孔）Drilling（Primary）10.（PTH&镀铜）PTH&CopperDeposition10PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess11.（外层压膜）DryFilmLamination（Outerlayer）12.（曝光）Expose11PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess13.（显影）Develop14.（镀二铜）PatternPlating12PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess15.（镀锡铅）TinPlating16.（剥膜）FilmStripping13PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess15.（蚀刻）Etch16.（剥锡铅）TinStripping14PCBManufacturingProcessintroductionTypicalPCBManufacturingProcess18.（表面处理）SurfaceFinished（ElectrolessNi/Au,HAL）17.（防焊）SolderMask（SprayCoating）15PCBManufacturingProcessintroductionLay-upStructure.COPPERFOIL0.5OZCOPPERFOIL0.5OZThinCore,FR-4ThinCore