DB界面菜单文档格式.docx

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DB界面菜单文档格式.docx

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DB界面菜单文档格式.docx

screwpositionX------------------65.0mm

E:

screwpositionY------------------22.0mm

F:

cableremovepositionX-----------75.0mm

G:

cableremovepositionY-----------22.0mm

H:

actualXposition---------------0mm

I:

actualYposition---------------0mm

4、leadframe

(1)clearindexer(4)dispensercycle(5)out.mag.setup(6)dispenserstandby(8)nextposition(9)nextdevice(10)indexeropenclmp(12)unloadout.mag.

5、testruns

(6)testrunequipment

(6)testrunequipment(8)testrunleadframe(9)testrunwafer(12)testruncomplete

6、pickandplacetools

(1)toggleneedle(3)ejector(4)teachZ-height(6)autocheckshaft(9)bondheadccw(10)bondheadcw(11)bondarmtopick(12)bondarmtotouch

7、leadframehandlertools

(1)clearindexer

8、warningcounters

A:

needlecountlimit--------------(300000)cycle

B:

needlecounter------------------222226cycle

C:

pickuptoolcountlimit--------(80000)cycle

D:

pickuptoolcounter------------36353cycle

E:

LFinputwarningcount---------()Ldfr

F:

LFoutputwarningcount--------()Ldfr

postbondmaxskipcount--------(10)pad

(7)resetneedle(8)resetpicktool

9、epoxytimersetting

currentdateandtime-----------08:

12:

1401/17/12

epoxystarttime----------------23:

04:

0501/16/12

epoxymode----------------------(expirydateandtime)

epoxyexpirywarningtime----------()

epoxyexecutiontime-----------9:

23:

8

epoxyremainingtime-----------323:

26:

42

epoxytime-----------------------stopimmediately

epoxytimestate---------------on

(7)stoptime

二、recipe

1、recipemanager

2、adjustwafer

pickoffsetinX-----------(0.02)mm

pickoffsetinY------------(0.01)mm

chipsizeX-----------------2.39mm

chipsizeY------------------1.22mm

opt.indexstepsizeX-------2.45mm

opt.indexstepsizeY--------1.55mm

(2)alignchip(3)nextchip(4)bondarmtopick(6)calc.pickoffset(7)learnchipsize(8)learnchip(11)autoimprint(12)resetoffset

3、adjustpickup

needlestate----------------bottomposition

needleposition------------0.000mm

(1)loadleadframe(3)bondheadccw(4)bondheadcw(7)defineneedle(9)bondarmtopick(10)defineDBHzero(11)toggleejector(12)bondheadtotouch

4、adjustleadframe

downset-------------()mm

(1)loadleadframe(7)topstackheight(9)learndisp.Z-height

三、optimizeprocess

1、bondprocess

(2)alignchip(3)nextchip(7)bondcycle(8)nextposition(9)nextdevice(11)pickchipblind(12)placechip

2、dispenseprocess

dispensepulsetime-------------------(24)ms

dispensepressure----------------------(0.3)bar

processmode-------------------------(on)

firstproc.Dev.OnLF----------------

(2)device

lastproc.Dev.OnLF-----------------

(2)device

firstpro.padondev.----------------

(1)pad

lastpro.padondev.--------------------(12)pad

loadLF--------------------------------(byhand)

QCmonitormode---------------------(fullcheck)

(1)loadleadframe

(2)proc.Tonextleadframe(3)dispenseshot(4)dispensercycle(5)dispenservalve(6)dispenserstandby(8)nextposition(9)learndispenserzLF(12)unloadout.mag.

四、correction

chipx-position-------------------(0.000)mm

chipy-position-------------------(0.000)mm

chipanglecorrection------------(0.000)mm

epoxyx-position-----------------(0.000)mm

chipandepoxyx-po.-------------(0.000)mm

chipandepoxyy-po.--------------(0.000)mm

bondheadx-correction------------(0.000)mm

bondheady-corection-------------(0.000)mm

lastcorr.Xchip---------------------0.05mm

J:

lastcorr.Xepoxy------------------0.000mm

K:

lastcorr.Ychip-----------------------0.025mm

L:

lastcorr.Yepoxy-------------------0.000mm

M:

lastanglecorrection----------------0.00deg

第四菜单

一、waferhandler

1、wafer

waferdiameter-------------------(200.0)mm

1stchipstartx-po.-----------------(-43.10)mm

1stchipstarty-po.-----------------(-87.27)mm

processdirection------------------(xbirdirection)

comfirmWMPoffinprod-------(yes)

waferloadblowtime-------------(3.0)s

waferunloadblowtime----------(5.0)s

expansionvalue--------------------(8.0)mm

tablemovementdalays-------------(0)ms

actualx-position--------------------0.00mm

actualy-position-------------------0.00mm

axtualexpansionpos.---------------12.06mm

actualdiameterofwafer-----------0.00mm

(1)loadwafer

(2)dummyload(3)search1stchip(4)toggleexpansion(7)definewafer(8)definefirstchip(10)alignchip(11)nextchip

2、chipsettings

alignmentmethod------------------(twopoint)

exclusionarea----------------------(off)

pre-alignmentmode---------------(off)

alternatepatternmode------------(off)

inkdotmode-------------------------(off)

cornermode-------------------------(off)

chipsurfacetest--------------------(off)

brockenwafercheck---------------(off)

alterxstepmode-----------------------(off)

alterystepmode-----------------------(off)

bordermode----------------------------(off)

lastlinemode---------------------------(off)

postpickcheck------------------------(off)

3、chipalignmentsettings

fieldofview--------------------(10.0)mm

dirctillumination---------------(100)

indirctillumination-------------(0)

searchrange---------------------(medium)

sizetolerance--------------------(medium)

objectpositioncontrol----------(on)

learnscaleproportion----------(80)%

4、chipalignment

camerasensitivity---------------(standard)

derctillumination---------------(100)

indirectillumination------------(0)

learnchipsizeillum-------------(160)

optimizeindexstep----------------(square3)

learnstatus----------------------defined

chipsizex-------------------------1.72mm

chipsizey-------------------------2.42mm

opt.indexstepsizex---------------1.72mm

opt.indexstepsizey---------------2.46mm

(7)autolearn(8)guidedlearm(9)adjustlearn

5、cipverify

verifydiameter------------------(80)%

verifysearchgrid----------------(3)

verifychip-----------------------chip1

chipstatus------------------------notfound

(7)verifychip

6、wafercentresearch

centresearchmethod-----------(off)

7、waferoptimization

optimization---------------(off)

chipsizex------------------1.72mm

chipsizey-------------------2.42mm

(3)alignchip

8、productionsettings

tablespeed--------------------------(highspeed)

chipqualitylevel-------------------(low)

ifdienotfound---------------------(skip)

needleinspectiontmpl------------(off)

retrymode---------------------------(off)

showproductiondatas--------------(off)

cycletime-----------------------0ms

二、wafermapping

1、maploading

flat/notchlocation---------------(180)deg

barcode---------------------------()

mappingdirection---------------(ylefttoright)

usesetupbincode--------------(off)

processbincode----------------

(1)

proceesnullbincode-------------()

pickedbincode------------------(s)

no.ofprocessbincode----------0die

(5)restartmap(7)loadwafer(8)clearmap(9)loadmap

2、mapreferencing

ref.positionnumber---------------

(1)

ref.enabled--------------------------(on)

ref.searchmethod--------------(testdie/edge/manualmicrrordie/custom)

ref.positionx---------------------(-55)die

ref.positiony---------------------(-41)die

ref.alignmentmethod------------(onepoint)

ref.directillum.------------------(44)

ref.indirectillum.----------------(0)

ref.confirmation-----------------(off)

max.ref.xdeviation--------------(0.4)die

max.ref.ydeviation-------------(0.4)die

(1)wafermapdisplay(3)defaultwindow(4)alignchip(5)learnref.(7)prev.ref.(8)nextref.(9)movetoref.(10)alignref.(11)def.ref.pos.(12)searchref.

3、mapproductionbehaviour

ifinkdeddiefound----------------------(skip/stop)

ifcornormissing-------------------------(---------)

ifdienotfound---------------------------(---------)

ifmapstartfailed-------------------------(--------)

ifnodiebetweenref.----------------------(--------)

ifgriddiefailed----------------------------(skip/stop)

confirmmapstartpos.-----------------(off)

searchmapstartinprod.----------------(allowed)

pickref.die-------------------------------(pick)

bincodechangeonevent-----------------(off)

4、mapsttingsandverity

searchgridprod.Method-----------------(manual/auto)

searchgridprod.X-----------------------(5)die

searchgridprod.Y-----------------------(5)die

ref.searchradius--------------------------(3)die

E;

currentmapdiex-pos.-------------------0die

currentmapdiey-pos.--------------------0die

chipsizex----------------------------------1.31mm

chipsizey----------------------------------1.31mm

(4)alignchip

5、mapfunction

confirmFNLOC----------------------------(off)

pickedbincheck----------------------------(off)

barcodeconfirmation------------------------(off)

ref.positioncheck----------------------------(on)

pos.adjustforrecovery-----------------------(on)

rotatedbindies----------------------------------(off)

checkmapsizechange---------

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