PCB术语总整理共80页文档Word格式文档下载.docx
《PCB术语总整理共80页文档Word格式文档下载.docx》由会员分享，可在线阅读，更多相关《PCB术语总整理共80页文档Word格式文档下载.docx（63页珍藏版）》请在冰豆网上搜索。
AdditionAgent添加剂.
AdditiveProcess加成法.
Adhesion附着力.
AdhesionPromotor附着力促进剂.
Adhesive胶类或接着剂.
Admittance导纳（阻抗的倒数）.
Aerosol喷雾剂,气熔胶,气悬体.
Aging老化.
AirInclusion气泡夹杂.
AirKnife风刀.
Algorithm算法.
AliphaticSolvent脂肪族溶剂.
AluminiumNitride（AlN）氮化铝.
AmbientTamp环境温度.
Amorphous无定形,非晶形.
Amp-Hour安培小时.
AnalogCircuit/AnalogSignal模拟电路/模拟讯号.
AnchoringSpurs着力爪.
AngleofContack接触角.
AngleofAttack攻角.
Anion阴离子.
Anisotropic异向性,单向的.
Anneal韧化（退火）.
AnnularRing孔环.
Anode阳极.
AnodeSludge阳极泥.
Anodizing阳极化.
ANSI美国标准协会.
Anti-FoamingAgent消泡剂.
Anti-pitAgent抗凹剂.
AOI自动光学检验.
Apertures开口,钢版开口.
AQL品质允收水准.
AQL（AcceptableQualityLevel）允收品质水准.
AramidFiber聚醯胺纤维.
ArcResistance耐电弧性.
Array排列.
Artwork底片.
ASIC特定用途绩体电路器.
AspectRatio纵横比.
Assembly组装装配.
A-stageA阶段.
ATE自动电测设备.
Attenuation讯号衰减.
Autoclave压力锅.
Axial-lead轴心引脚.
Azeotrope共沸混合液.
*****B*****
BackLight（BackLighting）背光法.
BackTaper反锥斜角.
Backpanels,Backplanes支撑板.
Back-up垫板.
BalancedTransmissionLines平衡式传输线.
BallGridArray球脚数组（封装）.
Bandability弯曲性.
BankingAgent护岸剂.
BareChipAssembly裸体芯片组装.
Barrel孔壁,滚镀.
BaseMaterial基材.
BasicGrid基本方格.
Batch批.
Baume波美度（凡液体比重比水重则Be=145-（145÷
Sp.Gr）
凡液体比重比水轻则Be=140÷
（Sp.Gr-130）
*Sp.Gr为比重即同体绩物质对"
纯水"
1g/cm的比值）.
Beamlead光芒式的平行密集引脚.
Bed-of-NailTesting针床测试.
BellowsConact弹片式接触.
BetaRayBackscatter贝他射线反弹散射.
Bevelling切斜边.
Bias斜张纲布,斜纤法.
Bi-LevelStencil]双阶式钢板.
Binder粘结剂.
Bits头（DrillBits）.
BlackOxide黑氧化层.
Blanking冲空断开.
Bleack漂洗.
Bleeding溢流.
BlindViaHole肓通孔.
Blister局部性分层或起泡.
BlockDiagram电路系统块图.
Blockout封纲.
Blotting干印.
BlottingPaper吸水纸.
BlowHole吹孔.
BluePlaque蓝纹（锡面钝化层）.
BlurEdge（Circle）模糊边带（圈）.
BombSight弹标.
BondStrength结合强度.
Bondability结合性.
BondingLayer结合层接着层.
BondingSheet（Layer）接合片.
BondingWire结合线.
Bow,Bowing板弯.
Braid编线.
Brazing硬焊（用含银的铜锌合金焊条）.
在425℃~870℃下进行熔接的方式）.
BreakPoint显像点.
Break-awayPanel可断开板.
BreakdownVoltage崩溃电压.
Break-out破出.
Bridging搭桥.
BrightDip光泽浸渍处理.
Brightener光泽剂.
BrownOxide棕氧化.
BrushPlating刷镀.
B-stageB阶段.
BuildUpProcess增层法制程.
Build-up堆积.
Bulge鼓起.
Bump突块.
BumpingProcess凸块制程.
Buoyancy浮力.
BuriedViaHole埋导孔.
Burn-in高温加速老化试验.
Burning烧焦.
Burr毛头.
BusBar汇电杆.
ButterCoat外表树脂层.
*****C*****
C4ChipJointC4芯片焊接.
Cable电缆.
CAD计算机辅助设计.
CalenderedFabric轧平式纲布.
CapLamination帽式压合法.
Capacitance电容.
CapacitiveCoupling电容耦合.
CapillaryAction毛细作用.
Carbide碳化物.
CarbonArcLamp碳弧灯.
CarbonTreatment,Active活化炭处理.
Card卡板.
CardCages/CardRacks电路板构装箱.
CarlsonPin卡氏定位稍.
Carrier载体.
Cartridge滤心.
Castallation堡型绩体电路器.
CatalyzedBoard,CatalyzedSubstrate催化板材.
Catalyzing催化.
Cathode阴极.
Cation阴向离子,阳离子.
CaulPlate隔板.
Cavitation空泡化半真空.
Center-to-CenterSpacing中心间距.
Ceramics陶瓷.
Cermet陶金粉.
Certificate证明书.
CFC氟氢碳化物.
Chamfer倒角.
CharacteristicImpedance特性阻抗.
Chase纲框.
CheckList检查清单.
Chelate螯合.
ChemicalMilling化学研磨.
ChemicalResistance抗化性.
Chemisorption化学吸附.
Chip芯片（粒）.
ChipInterconnection芯片互连.
ChiponBoard芯片粘着板.
ChipOnGlass晶玻接装（COG）.
Chisel钻针的尖部.
ChlorinatedSolvent含氯溶剂,氯化溶剂.
CircumferentialSeparation环状断孔.
Clad/Cladding披覆.
CleanRoom无尘室.
Cleanliness清洁度.
Clearance余地,余环.
ClinchedLeadTerminal紧箝式引脚.
Clinched-wireThroughConnection通孔弯线连接法.
ClipTerminal绕线端接.
Coat,Coating皮膜表层.
CoaxialCable同轴缆线.
CoefficientofThermalExpansion热膨胀系数.
Co-Firing共绕.
ColdFlow冷流.
ColdSolderJoint冷焊点.
CollimatedLight平行光.
Colloid胶体.
ColumnarStructure柱状组织.
CombPattern梳型电路.
ComplexIon错离子.
ComponentHole零件孔.
ComponentOrientation零件方向.
ComponentSide组件面.
Composites,（CEM-1,CEM-3）复合板材.
CondensationSoldering凝热焊接,液化放热焊接.
Conditioning整孔.
Conductance导电.
ConductiveSalt导电盐.
Conductivity导电度.
ConductorSpacing导体间距.
ConformalCoating贴护层.
Conformity吻合性,服贴性.
Connector连接器.
ContactAngle接触角.
ContactArea接触区.
ContactResistance接触电阻.
Continuity连通性.
ContractService协力厂,分包厂.
ControlledDepthDrilling定深钻孔.
ConversionCoating转化皮膜.
Coplanarity共面性.
Copolymer共聚物.
CopperFoil铜皮.
CopperMirrorTest铜镜试验.
CopperPaste铜膏.
Copper-Invar-Copper（CIC）综合夹心板.
CoreMaterial内层板材,核材.
CornerCrack通孔断角.
CornerMark板角标记.
Counterboring方型扩孔.
Countersinking锥型扩孔.
CouplingAgent偶合剂.
Coupon,TestCoupon板边试样.
Coverlay/Covercoat表护层.
Crack裂痕.
Crazing白斑.
Crease皱折.
Creep潜变.
CrossectionArea截面积.
CrosshatchTesting十字割痕试验.
Crosshatching十字交叉区.
Crosslinking,Crosslinkage交联,架桥.
Crossover越交,搭交.
Crosstalk噪声,串讯.
CrystallineMeltingPoint晶体熔点.
C-StageC阶段.
Cure硬化,熟化.
CurrentDensity电
升级会员 