FPC专业词汇中英文对照.docx

FPC专业词汇中英文对照.docx

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FPC专业词汇中英文对照专业词汇中英文对照FPC名词中英对照1.目的通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化2.适用范围规范FPC相关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名词3.定义无类别一：

FPC不良项目名词工程类别不良名称中文英文导线VisualInspectionofConductors导线Conductors开路Open短路Short缺口Nicks针孔Pinholes额外铜刺ExtraneousCopperBetweenConductors毛刺Spurs结瘤Nodules蚀刻凹痕EtchedConcave导线分层ConductorDelamination专业.专注裂纹Cracks导线划痕ScratchesonConductor凹坑Dents变色Discoloration基底薄膜VisualInspectionofBaseFilm凹坑Dents划痕ScratchesonBaseFilm覆盖层和覆盖涂层VisualInspectionofCoverlayandCovercoat凹坑DentsonCoverlayandCovercoat划痕ScratchesonCoverlayandCovercoat空洞Void偏位CoverlayMisalign毛刺CoverlayBurrs外来物ForeignMatters导电性异物ConductiveForeignMatters非电性异物Non-conductiveForeignMatters起泡和分层BlisteringandDelamination覆盖层粘结剂挤出Squeeze-outofAdhesiveofCoverlay覆盖涂层渗出Ooze-outofCovercoat覆盖涂层跳漏SkippingofConvercoat电镀金属或焊锡的表面条件SurfaceConditionof镀金GoldPlating镀金层缺陷GoldPlatingDefectsPlatedMental镀锡TinPlating电镀金属或焊料的渗透PenetrationofPlatedMetalorSolder学习参考专业.专注andSolder变暗（变黑）DarkenedAppearance（BlackeningDiscoloration）镀铜孔内镀层空洞PlatingVoidsinPlated-thoughHole镀金粗糙RoughGold镀金白雾GoldDiscoloration镀金变色GoldDiscoloration镀金层龟裂GoldCrack镀金针孔GoldPinhole电镀露铜PlatedExposeWetting剥离PlatedPeeledOff电镀渗入PlatedWicking漏镀NoPlating表面伤痕PlatingScratch电镀粗糙RoughPlated药水渗入Wicking外形和孔边缘VisualInspectionofEdgesofOutlineandHoles撕裂和缺口TearsandNicks毛刺Burrs丝状毛刺ThreadyBurrs弯曲、变形Warpage微连筋不良PoorMicro-joint外形偏移OutlineMisalign外形漏冲NoOutline反折偏位BendingLineMisalign学习参考专业.专注增强板FPC与增强板之间的外来物ForeignMatterBetweenFlexiblePrintedBoardandStiffenerVisualFPC与增强板之间VoidsBetweenFlexiblePrintedBoardandImperfections的空洞StiffenerRelatedto裂纹CracksStiffener缺角Chip-offBonding划痕Scratches变形Deformation增强板贴偏移StiffenerMisalign热固胶ThermosettingAdhesive焊剂残渣FluxResidues表面附着物金属粉末残渣ResidueofMetalPowdersAffixed粘结剂残渣ResidueofAdhesiveSubstanceson突起ProtrusionstheSurface凹坑Dents弓曲Bow扭曲Twist尺寸检验DimensionalInspections尺寸测量MeasurementofDimensions标记Marking外部尺寸ExternalDimensions厚度Thickness孔Holes元件孔ComponentHoles学习参考专业.专注导通孔ViaHoles导通孔偏移ViaHoleMisalign安装孔MountingHoles导线宽度ConductorWidths导线之间的间距ClearancesBetweenConductors孔中心间距DistanceBetweenHoleCenters板边和导线之间的MinimumDistanceBetweenBoardEdgesand最小距离Conductors标记错误WrongMarking字符不清晰UnclearLetter定位精度PositionalAccuracy孔的定位精度PositionalAccuracyofHoles孔与焊盘的重合性RegistrationofHoletoLand覆盖层与焊盘的重合性RegistrationofCoverlay（orCovercoat）toLand孔的重合性RegistrationofHoles外形的重合性RegistrationofOutlines增强板与FPC的重合性RegistrationofStiffenertoFPC冲外形与导线图形的重合性RegistrationofPunchedOutlinetoConductorPatterns压敏胶或热固胶与FPC和增强板的重合性RegistrationofPressureSensitiveorHeatActivatedAdhesivestoFPCandStiffener镀通孔的镀铜层厚PlatingThicknessofCopperPanted-through度Holes学习参考专业.专注其它Other短装Shortage混装MixedStowage/Packing离型纸脱落ReleasedPaperPeeledoff材料错误WrongMaterial类别二：

PFC工程用语工程类别中文英文板BoardType单面板SingleSidedFlexCircuits单面双接触DoubleAccessorBack-baredFlexCircuits双面板DoubleSidedFlexCircuits软硬结合板Rigid-flexCircuits具e模D模具图纸DieDrawing量产模具MassProductionDie样品模具PrototypeDie钢模SteelDie刀模Die上模TopDie下模BottomDie线切割WireCut外形模具OutlineCut保护膜模具CoverlayDie胶纸模具PressureSensitiveAdhesiveDie补强模具StiffenerDie学习参考专业.专注银浆模具SilverDie导柱Post冲头Punch分割刀模CuttingSteelRuleDie销钉Pin治具Jig（Fixture）贴合治具LaminationJig电测治具ElectricalCheckJig假贴治具TackingJig曝光治具ExposureJig丝印网框ScreenPrintingFrame孔Hole曝光定位孔GuideHoleforExposure模具定位孔GuideHoleforDie假贴定位孔GuideHoleforTacking贴合定位孔GuideHoleforAdhesive电测定位孔GuideHoleforElectricalTest丝印定位孔GuideHoleforScreenPrinting孔环LiftedLand渗锡孔StannizeHole装配孔FittingHole制程Manufacture下料MaterialPreparation钻孔Drilling镀铜CopperPlating化学铜EleEletcrolessPlatingCopper学习参考专业.专注Procedure贴干膜SensitiveDryFilm丝印阻焊油墨LiquidPhotosensitiveSoldermask曝光Exposure显影Developing蚀刻Etching脱膜Stripping贴保护膜TackingCoverlay粗化Abrade层压Lamination固化（烘烤）Curing黑孔BlackHole表面处理SurfaceTreatment循环水洗CascadeRinse微蚀Micro-etch酸洗AcidCleaning水洗WaterCleaning防锈处理Anti-corrosionTreatment前处理Pre-treatment刷板Brushing干燥Dryup电镀（金、锡、镍）（Gold、Solder、Nickel）Plating闪镀（Gold）FlashPlating/StrikePlating学习参考专业.专注局部电镀PatternPlate化学镍金ImmersionGold有机保焊膜OrganicSolderabilityPreservatives（OSP）丝印字符PrintingofLegend贴补强板BackBoardLamination电性能测试ElectricalInspection贴胶纸DoubleFacedAdhesiveTape打孔Punching雷射切割LaserCut自动光学检验AutomaticOpticalInspection（AOI）表面贴装SurfaceMountingTechnology（SMT）外形冲切Punching冲孔Punching外观检查FinalInspection目视检查VisualInspection（FinalInspection）线路显微镜检验（镜检）ConductorMicroscopeInspection性能测试ReliabilityTest包装Packing原材料Material铜箔CopperFoil（CU）电解铜Electro-depositedCopperFoil（ED）压延铜RolledAnnealedCopperFoil（RA）保护膜Coverlay（CVL）学习参考专业.专注基材BaseMaterial挠性覆铜板FlexibleCopperCladLaminate（FCCL）无胶基材AdhesivelessFCCL粘接剂（胶）Adhesives（Ad）压克力Acrylic顶层补强TopStiffener底层补强BottomStiffener顶层银浆膜TopSilverPaste底层银浆膜BottomSilverPaste银浆油墨SliverInk顶层线路TopCircuits/Conductors底层线路BottomCircuits/Conductors半固化片BondingFilm（BOD）聚酰亚胺Polyimide（PI）聚酯PolyesterFilm（PET）钢片SheetSteel玻璃纤维布WovenGlassClothFR4补强板Fiberboard液态感光油墨LiquidPhotoimageableResistInk压敏胶PressureSensitiveAdhesive（PSA）离型膜ReleasePaper导电胶ConductingResin导电布ElectricFabric学习参考专业.专注泡棉Foam导向导电胶AnisotropicConductiveFilm（ACF）导电泡棉Conductive/ElectricFoam屏蔽膜ShieldFilm（金属）薄膜开关MetalDome（DOME）连接器Connector电容Capacitance（C）电阻Resistance（R）集成电路IntegratedCircuit（IC）二极管Diode（D）静电Electro-StaticDischarge（ESD）其它Others机械方向MachineDirection（MD）垂直方向TransverseDirection（TD）进刀Feed进刀量ChipLoad转速Speed焊接Soldering手工焊接HandSoldering波焊WaveSoldering品质允收标准AcceptableQualityLevel（AQL）菲林Film字符Legend学习参考专业.专注烘箱Oven温度Temperature湿度Humidity速度Speed压力Pressure喷淋压力SpoutingPressure浓度Concentration原理图纸SchematicDiagram线宽LineSpace线距LineWidth线路间距Pitch类别三：

FPC可靠性测试项目中文英文电气性能TestingofElectricalPerformance导线电阻ConductorResistance表面层绝缘电阻SurfaceInsulationResistance（SIR）表面介质层耐电压强度DielectricWithstandingVoltageofSurfaceLayers机械性能测试TestingofMechanicalProperty剥离强度PeelStrength孔和焊垫的拉脱强度Pull-outStrengthforPlainHolesandFootprints镀层附着力PlatingAdhesion可焊性Solderability学习参考专业.专注耐挠曲性FlexuralEndurance耐弯折性BendingResistance环境性能EnvironmentalPerformance温度循环TemperatureCycling湿度测试HumidityTest冷热冲击ThermalShock镀铜通孔的耐热冲击性ThermalShockResistanceofCopperPlated-throughHoles迁移性Migration耐化学性ChemicalResistance清洁度Cleanliness阻燃性FlameResistance推力测试ShearTest手机翻盖测试HandsetRenovateTest窗口弯折测试WindowBendTest手机滑盖测试SlidingTest焊点拉伸强度测试SolderPointPullStrengthTest盐雾测试SaltFogTest蚀刻因子EtchingFactor切片检测CrossSection镀层厚度PlatingThickness恒温恒湿ConstantTemperatureandHumidity翻折疲劳测试FoldFatigueTest安定性DimensionalStability学习参考专业.专注平展性Ductility引用标准：

IPC/JPCA-6202单、双面绕性印制板的性能手册学习参考