电路板PCB工程师英文EQ.docx

1、电路板PCB工程师英文EQ1根本信息（1）问题：the board thickness(2.36+/-0.05mm) is too hard to control for us 对我们来说，板厚2.36+/-0.05mm太难管控 建议：Can we control the finished board thickness as 2.4+/-10%mm？Please comfirm! 请确认我们可否控制完成板厚为2.4+/-10%mm？（2）问题：As show in figure, manufacturing requirements specification, using 17 um (1

2、/2 oz) based copper, finished surface copper: 46 um (0.00181 ); it is different from what shows 1oz for stackup.如下列图所示，制作说明要求使用17um基铜，完成铜厚46um.这跟叠构中的1OZ铜厚不符.建议：Use 1 oz based copper, finished surface copper: 46 um (0.00181 ) 使用1oz基铜，完成铜厚46um.（3）问题：As show in the below figure, outer copper is 1 oz.We

3、 cant make sure whether the finished surface copper is 1 oz. 如下列图所示，外层铜厚为1OZ，我们不能确定完成铜厚是否为1OZ. 建议：Using Hoz base copper, finished surface 1 oz copper; 使用H oz基铜，成品铜厚为1oz.（4）问题：The stack-up your company provided did not conform the requirements of impedance, and the inner layers need to use 3 Pre-preg

4、.贵司提供的叠构不符合阻抗要求，且内层需要用3张pp建议：Adjust the thickness of the Pre-preg and the core。See below. 调整芯板和PP的厚度，见下列图（5）问题：The make-up like as the attachment 12PCS/PNL，in order to save the costing ,please confirm if can accept 3 X-OUT per panel? 如附件所示拼版12pcs/PNL，为了节约本钱，请确认可否承受每个拼版内有3个打叉板？ 建议：Accepted 3 X-OUT pe

5、r panel,but not exceed 5% of order quantity.And pack them separately when shipping. 承受每拼版出3个打叉板，但不超过总订单数的5%，且出货时把打叉板分开包装.（6）问题：As show in figure, Your company requirements according to level 3 standard controls, this requirement is too hard to control for us 如下列图所示，贵司要求按3级标准管控，我们较难管控. 建议：Controlled

6、by level 2 standard production. 按2级标准管控生产.（7）Please confirm the attached panel drawing.请确认附件拼幅员8 Above is our suggested stackup，please confirm. 上图为我司建议叠构，请确认.9问题：Your company have not provided the tolerance of board thickness，please confirm whether we could control it as 1.6mm+/-10%？贵司没有提供板厚公差，请确认我司

7、可否按1.6mm+/-10%来管控？10问题：We cant find the finish copper thickness and solder mask color in spec ,please provide. 我们在说明书中找不到完成铜厚和防焊颜色，请提供.建议：Finish copper thickness:1oz, SM color: matte green 完成铜厚1OZ 防焊颜色：哑光绿色11问题：Please see Fig1,the number in gerber is different from HIT-20-001200-001 in spec. 请看图一，ge

8、rber中的料号跟说明书中的HIT-20-001200-001不相符. 建议：We will ignore this difference and follow the gerber file to produce this board. 我们将忽略这个不同点，然后按照gerber来制作. 12问题：The customer requires use FR - 402 material, but we have not this kind of sheet material . 客户要求使用FR-402板材，但我们没有这种板材. 建议：We will use our common materi

9、al production，Please confirm！Like KB6160 or equivalent instead of FR-402. 我们将使用常用的板材生产，请确认.像KB6160或同等级的板材来代替FR-402. 13问题：In order to avoid the panel board scraped in process, we would like to change the sharp corner to round angle as R1.0mm. 为了防止板子在生产过程中刮花，我们将尖的角倒角为R1.0mm 的角. 14问题：See below figure，5

10、0 Ohm impedance is controlled in the gerber, butthe e-mail indicated that had no controlled impedance;Actually, the calculation also cannot reach 50 Ohm impedance values . 见下列图，gerber中要求做50ohm阻抗控制，但邮件中说明不用做阻抗控制。事实上也达不到50ohm阻抗值. 建议：Ignore the impedance control. 忽略阻抗控制. 15问题：There is no 60mil core on

11、our store，we will adjust the stackup as below fig. B show. 我们仓库没有60mil的芯板，我们将调整叠构，如图B所示. 16问题：It is too hard to keep conductor widths and spacing within 15% of data for us. 要将线宽距控制在+/-15%，对我们来说太难了 建议：We suggest to relax it as +/-20% to process . 我们建议放宽到+/-20% 17问题：You do not specify the incept stand

12、ard. We will follow IPC-A-600G Class2 and IPC-6012B Class2 to build this board. 贵司没有指明验收标准，我们将根据IPC2级标准来生产板子. 18问题：It doesnt specify thickness of Ni and Au. 没有说明镍和金的厚度. 建议：We will control as : Ni: 3-6um min and Au0.05um 我们将管控为：镍最少3-6um，金0.05um 19问题：We cant input the four filessee below fig. by our s

13、oftware 用我们的软件打不开下列图的4个文件. 建议：We will ignore the four files. 我们将忽略这4个文件. 20问题：We are not sure the surface finish of this board，because the requirement of two files are different.See below pictures. 我们不能确定这个板的外表处理，因为2个文件的要求不同.见下列图 建议：We will follow immersion gold to produce.( Au:0.05um(min),Ni:3-6um)

14、 我们将按沉金制作.金厚最少0.05um，镍厚3-6um 21问题：Please see below picture, the dimension between the gerber and the drawing is different. 请看下列图，图纸和gerber的尺寸不一样. 建议：We will follow gerber file to produce. 我们将依gerber制作. 22问题：We dont know the usage of these file ,and we think them have nothing to do for PCB manufactur

15、e. 我们不知道这些文件的用处，我们认为他们对PCB生产没有影响. 建议：We will ignore it. 我们将忽略他们. 23问题：We dont have the standard of the BS EN0249-2-12:1994 in hand. 我们没有 BS EN0249-2-12:1994的标准控制. 建议：We will ignore this standard and follow IPC-4101B standard to produce. 我们将忽略这个标准，然后按IPC-4101B标准来生产. 24问题：In the future, for the same s

16、eries, if we meet the same questions like as above, we will use the answer directly 后续问题中，如有类似以上问题，我们将直接使用这次的回复来生产.2文字（1）问题：Some fonts are close to pads, into holes or outside of the board outline.一些文字太靠近pad，进孔或到了板外.建议：We will move them if possible, otherwise well clip them, please confirm. 如果可能，我们将

17、文字移动，否那么我们会修剪文字，请确认.2 问题：We will add the UL,including our logo and date code(WWYY) at free area on the top silkscreen layer. 我们将在顶层文字的空旷位置添加UL，包括我们的标记和周期.3问题：In order to identify the board easily, we would like to add our internal part number on the breakaway rails.or near our company UL 为了更好地区分板子，我

18、们想要在工艺边上添加我司料号.或在我司UL附近4问题：We turn the logo to BLDT D-B on the bottom silkscreen or not?Please confirm. 请确认我们可否将底层文字的UL改为BLDT D-B？ 5问题：You request to add UL and date codeWWYYon the appointed position , but the drawing without appointed position 。We will add our company UL and date codeWWYY on bottom

19、 silkscreen layer as below fig. 贵司要求在指定位置添加UL和周期WWYY，但图纸上没有标出指定的位置.我们将在底层文字添加我司UL和周期(WWYY)，见下列图. 6问题：Some White oil block are printed on the pads, it will affect the solderability of the pads. 一些白油块在pad上，这会影响pad的焊接性能. 建议：We will modify the legend to avoid them exposing on the pads. 我们将修剪文字来防止他们上pad.

20、(7)问题：Some fonts are too close to the outline,it may cause the fonts to be incomplete after manufacturing. 一些文字太靠近外形线，这可能会导致加工后文字出现残缺. 建议： Reduce the font size to accommodate the tight space if possible，otherwise accept the incomplete fonts. 如果可能的话，缩小文字到一个小空间内，否那么就承受文字残缺.（8）问题：Tthere is no enough sp

21、ace for adding the UL and date code on the top silkscreen layer 顶层文字不够空间添加UL.和周期建议：A：We will add them on the bottom silkscreen layer. B：We will add them on the top soldermask layer. A：在底层文字添加 B：在顶层防焊添加（9）问题：Some legend are not mirrored on the bottom sides. 在底层中，有一些文字没有镜像. 建议：A：we will follow geber t

22、o produce and accept the legend are inverse.B:we will mirror it.A：我们将依gerber生产，要承受反字.B：我们将镜像制作.（10）问题：The legend is very close to dummy copper pads in the working gerber. 在工作稿中的文字太靠近焊盘. 建议：A:We will shave the dummy copper pads to avoid the illegible legend.B: Follow working gerber to build,and the i

23、llegible legend is acceptable A：我们将削铜粒来防止文字模糊. B：依工作稿制作，承受文字模糊. 11问题：In order to avoid the silkscreen is missing, we will add the check patterns on the breakaway rail. 为了防止漏印文字，我们将在工艺边添加测试图案.3防焊（1）问题：Spacing between IC pads are 6.7mil and 7.5mil. We need 7.8mil to keep the solde rmask dam.Becausethe

24、 solder mask ink are blue color which is out of our capability to build the blue solder mask dam. IC之间的距离是6.7和7.5mil，我们需要7.8mil的距离来做防焊桥.因为防焊颜色为蓝色，这样距离的蓝油桥超出我们的制程. 建议：We suggest canceling the solder mask dam where the IC spacing is less than 7.8mil and make gang relief. Please confirm is that accepta

25、ble. 我们建议在小于7.8mil的地方取消做防焊桥，然后按开通窗制作.请确认是否承受.（2）问题：Spacing between the BGA PAD and via hole is only 9.8mil, and theres solder mask dam. The spacing is too small to keep dam. BGA到过孔的距离只有9.8mil，而且要做防焊桥.这个距离太小，不能做桥. 建议：We will remove the vias (not the BGA pads) openings 我们将移除过孔的开窗不是BGA的开窗.（3）问题：The 29m

26、il component holes without solder mask openings on bottom sides,the solder mask ink will flow into holes 29mil的元件孔在底面没有开窗，油墨会进孔. 建议：A) We add solder mask openings for hole, Make sure the oil is not on the PAD and not flow into the hole.B) We follow the GERBER to do ,Please confirm the solder mask in

27、k will flow into holes are accepted. A：我们将为这些孔添加防焊开窗，确保油墨不上pad和油墨不进孔.B：我们根据gerber制作，请确认可承受油墨进孔. 4问题：See below figure,there is one pad on the bottom paste layer, but it without soldermask opening on the bottom solder layer. 见下列图.贴片层上有一个pad没有开窗. 建议：A：follow the gerber. B:Add soldermask opening that is

28、 8mil bigger than the pad. A：依gerber制作. B：加一个比pad大8mil的开窗. （5）问题：The 1.0mm holes with soldermask opening on the top soldermask layer ,but the bottom layer.Please comfirm our suggestion 1.0mm的孔在顶层有开窗，但底层没开窗。请确认我们的建议. 建议：A：Follow the gerber to process. 按gerber生产. B：Add the soldermask opening for the h

29、oles on the bottom layer，the size is the same as the top. 在底层添加开窗，大小跟顶层一样.（6）问题：The soldermask opening of dia.0.40mm holes is only 8mil bigger than the via holes. 直径0.40mm的孔防焊开窗只比过孔大8mil.建议：A：Cancel the soldermask opening of via holes，the via holes plugged with solder mask is accepted. 取消过孔的防焊开窗，承受过

30、孔塞油. B：follow the gerber，and accept solder mask into the hole but no plugging 依gerber制作，承受油墨入孔，但不塞孔.（7）问题：The two dia.3.2mm holes are specified as PTH in drill chart .But the soldermask opening is less than the pads on bottom soldermask layers.分孔表上直径3.2mm的孔是制作为PTH，但在底层防焊层里，开窗比pad小.建议：We will follow

31、gerber to produce，and allow the solder mask encroach onto these pads. 我们将根据GERBER生产，然后承受油墨上pad.（8）问题：Some solder mask opening for the fiducial mark is too big that it caused nearboring trace exposed in the working gerber. 一些光学点的开窗太大，导致工作稿中他们邻近的导线露铜. 建议：We will trim the solder mask opening to avoid the trace exposed. 我们将修改防焊开窗来防止铜线外露.（9）问题：There is no solder mask opening on one side for the via hole 16mil. 16mil的孔有一面防焊没开窗. 建议：A：Plug these via holes with solder mask ink. B：Add solder mask opening both sides for the via hole 16mil. A:塞孔制作. B：16mil的孔双面开窗.4线