半导体用语.docx

1、半导体用语Siliconingot 硅锭Wafer晶片Mirror wafer 镜面晶圆Patter 晶圆片FAB： fabrication 制造Fabrication Facility 制造wafer生产工厂Probe test 探针测试Probe card 探针板Contact 连接Probe Tip 探头端部ChipFunction 功能EPM： Electrical Parameter MonitoringSummary 总结R&D：Research and Development 研究和开发MCP：Multi Chip Package 多芯片封装POP：Package on Pack

2、agee-MMC：embedded Multi Media card 嵌入式多媒体卡WLP：Wafer Level Package 晶圆级封装SDP 一层DDP 两层QDP 四层ODP 八层Pad outBack Grind 背研磨Wafer Grind Back Grind 磨片Overview 概述TPM：Total Profit Management SKTPMOperation 操作Erase 消除Key Para. ：Key parameter 关键参数Cycling 写入次数、循环次数Retention 保留时间Non-Volatile memoryVolatile memoryR

3、ead 读Write 写Refresh 更新Speed 速度、速率、转速Restore 修复、恢复Electrical Signal 电信号WFBI：Wafer Burn-InPT1H：Probe Test 1 Hot TestPT1C：Probe Test 1 Cold TestL/Rep：Laser RepairPurpose 目的Substrate 基片Trend 趋势Small Size 小体积High Density 高集成High Speed 高速度Roadmap 路标TSOP：Thin small outline package 薄型小尺寸封装FBGA：（Fine Ball Gr

4、id Array）package 细间距球栅阵列（一种封装模式）Flip Chip Package： 在wafer的chip上形成bump直接在substrate或PCB基板上填充形态，使I/O最高密度化的填充方式。Stack 堆叠 stack packageB/G：Back Grind 背研磨W/S：Wafer Saw D/A：Die AttachW/B：Wire BondM/D：MoldM/K：MarkingSBM：Solder Ball MountS/G：SingulationEMS：Epoxy Molding Compound 环氧树脂Assembly 装配、集会、集合Pre Loar

5、dTDBI：Test During Burn InEarly failure 初期不良率Constant fail-rate 稳定的fail分布Wear-out 磨损PDA：Percentage Defect Allowance Burn-In后Device的可靠性check的基准Burn-In 高温加速老化试验MVP ：Marking Visual PackingM/S：Marking store 按speed分类Laser 激光Server 服务器FB-DIMM：Fully Buffered Dual In-line Memory Module 全缓存双线内存模组So-DIMM：Small

6、 outline DIMM 笔记本内存Application 应用程序Shipping 产品出口PCB：Print Circuit Board 印刷电路板MLCC：Multi Layer Ceramic Capacitor 多层陶瓷电容器A/R：Array Resister 数组电阻器Chip Resister 片状电阻器EEPROM：Electrically Erasable Programmable Read Only Memory 电可擦只读储存器Print PCB Pad上涂抹Solder PasteSolder 焊接Chip Mount 往PCB上Mount 附件Reflow 用Re

7、flow用产生的热来使附件和PCB进行连接Auto Optical Inspection 通过光学检查附件的Joint状态Label Attach 用Auto在Module上贴LabelRouter 分割连在一起的PCBAOQ：Average Outgoing Quality平均出货品质T/B：Test BankLOAD：LoadingU/L：UnloadingLIS：Lead Inspection SystemFVI：Final Visual Inspection 最后外观检查EFR：Early Failure RateQPE：QA Package ElectricalQPV： QA Pac

8、kage VisualIPK：Inner Box PackingQPP：QA Package PackingQFS：QA Finished Goods StoreFGS：Finished Goods StoreTAT：Turn Around Time Lithography 光刻Microlithography 显微光刻Expose 曝光Coat 涂层Bake 烘烤Develop 显影Thickness 层、浓度Temp 临时雇员、做临时工作Energy 精神、能量、活力focus 焦距、清晰illumination 景深overlay 覆盖物、镀lens 透镜、镜头、给摄影alignment

9、 队列、校准、结盟oxide 绝缘体、氧化物polymer 聚合物Wet Etching 湿法刻蚀Dry Etching 干法刻蚀chamber 房间、室、腔pump 用抽水机抽、泵、打气筒plasma 等离子体effect 产生、作用、效果inhibitor 抗化剂pattern 模仿、样品hole 穴、洞、孔content 内容、目录Deposit 存款、使沉积、沉淀物CVD：Chemical Vapor Deposition 化学气相沉积PVD：Physical Vapor Deposition 物理气相沉积PECVD：Plasma Enhanced CVD 等离子增强化学气象沉积HDP

10、CVD：High Density Plasma 高密度等离子化学气相沉积rare 速度、责骂temperature 温度Range 偏差、排、山脉Uniformity 均匀度Sigma 标准差DriverTorque WrenchWrenchLong Noseplier NipperSolderingFile Wire StripperMonkey Spanner Open spannerLevel MeterPipe WrenchSnap Ring PlireMirco MeterStep Coverage 台阶覆盖率Aspect Ratio 深宽比Metal 金属Particle 颗粒杂质

11、Stress应力Reflectance 反射系数Dielectric 介电质Refractive Index 折射系数Dopant 参杂浓度Tensile 拉应力Compressive 压应力Incident light 入射光Application 应用Conformity 共形性Overhang 悬突LPCVD：Low Pressure Chemical Vapor Deposition 低压化学气相沉积CMP：Chemical Mechanical Planarization 化学机械平坦化Analysis 分析Synthesis 综合Convergent 集中性Divergent 发散

12、性Vertical 垂直性Latercal 水平性Skills 技术Techniques 方法、技巧、技术Logic Tree 逻辑树Brainstorming 头脑风暴Visualization 形象化Solution 解决方案Thinking 思考SPC：Statistical Process Control CPK：Capability IndexIQC：Incoming Quality ControlCAR：corrective Action RequestClean RoomPurging 去除产生的微粒子Prohibiting 防止微粒子的产生Preventing 防止微粒子的侵入

13、Providing 维持必要的温度、湿度Supply unitReturn unitAir showerBond head Bonding timeCoding time MCP：Multi Chip PackageVacuum 真空吸尘器Ventury 喷嘴 Cassette 片匣TDBI：Test During Burn In 进行rest中，进行Burn In 的工程B/I：Burn InSORTER：向bib进行Load/Unload作业的device设备SYSTEM：进行B/I&test装载Device的BIB设备BIB：Burn In Board SYSREM设备中为了Device

14、 Test按Socket个别装载 Device的BoardBIN：按照Device Test结果值以Category来区分BS：Burn-in fail split 在SYSTEM设备Device Test结果中发生Fail的BIN用语O/S：Open/Short Device Test结果中发生Fail的BIN用语BC：B/I fail combine 1次BI fail combineBCC：B/I fail combine 2次BI fail combineINS/REM：Insent/Remove进行load/Unload作业 Device向BIB Socket Capa-UpAlig

15、n 排列Renaissance 复活、复兴、新生Wear a smock 穿防尘服Wear a mask 戴口罩Wear a smock cap 带防尘帽Put your shoes on/Finish 穿防尘鞋/完毕Clean mat 去出异物用垫ESD：Electro Static Discharge 静电Conductive 导电性Static Dissipative 消散性Insulator 绝缘体Antistatic 带电防止性EOS 电过载Electrostatic Shield 屏蔽静电Ground 接地Ionizer 防静电装置Neutralization 中和Triboele

16、ctric Charging 摩擦带电Induction Charging 引导带电Spray Charging 喷出带电4M：Man、 Machine、 Material、 Method EPA：ESD Protect Area ESD保护区域PCN：Process Change NotificationRAM：Returned Material Analysis/Authorization EOP： Equipment Engineer 设备、Operator工作者、Process Engineer工程EPSC：Equipment Process Standardization Commi

17、ttee 装置标准化横展开Frontline 一般用纸White board 粉板Filler填充剂MSDS：Material Safety Data Sheet 物质安全保健资料Line 生产作业现场Work-man-ship 基本技能UPH：Unit Per Hour 每小时生产量SW：Super WideW：wide N：normalCarrier=ContainerDost cover Magazine IndexPick upSensor 传感器KPT：Key Performance IndicatorLamination UV：ultraviolet 紫外线UV Irradiation 紫外照射Cushion 垫子Spindle 主轴Chuck Table 工作盘Polishing 抛光Adhesive 粘合剂Encapsulation 封纸Hardener 硬化剂Catalyst 催化剂Coupling Agent 界面粘合剂Frame Retardant 阻燃剂Lubricat 润滑剂Colorant 着色剂EVI：External Visual InspectionIVI：Internal Visual Inspection感谢下载!欢迎您的下载，资料仅供参考