PCB工艺术语.docx

1、PCB工艺术语. : * Process Module 说明 A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) B. 钻孔 (Drilling) a-2 原物料发料 (Panel)(Shear material to Size) (Inner Layer Drilling ) b-1 内钻 (Outer Layer Drilling ) b-2 一次孔 b-3 二次孔 (2nd Drilling) (Laser Drilling )(Laser Ablation ) b-4 雷射钻孔 ( Photo 乾膜制程 (Blind & Buried Ho

2、le Drilling) C. b-5 盲(埋)孔钻孔 Process(D/F) (Pretreatment) c-1 前处理 c-2 压膜 (Dry Film Lamination) 曝 光 (Exposure) c-3 影 (Developing) c-4 显 蚀铜 (Etching) c-5 (Stripping) c-6 去膜 ( Touch-up) 初检 c-7 化学前处理c-8 ,化学研磨 ( Chemical Milling ) (Selective Gold Dry Film Lamination) c-9 选择性浸金压膜 (Developing ) 影 c-10 显 (Str

3、ipping ) c-11 去膜 D. 压 合 Lamination (Black Oxide Treatment) 黑 d-1 化 d-2 微蚀(Microetching) ;. . (eyelet ) d-3 铆钉组合 (Lay up) d-4 叠板 (Lamination) d-5 压 合 (Post Treatment) d-6 后处理 ( Black Oxide Removal ) d-7 黑氧化 (spot face) d-8 铣靶 (resin flush removal) d-9 去溢胶 减铜 (Copper Reduction) E. 薄化铜(Copper Reduction

4、) e-1 (Horizontal Electrolytic Plating) F. 电镀 (Horizontal Electro-Plating) (Panel Plating) f-1 水平电镀 ( Tin-Lead Plating ) (Pattern Plating) 锡铅电镀 f-2 1 mil ( Less than 1 mil Thickness ) f-3 低於 1 mil ( More than 1 mil Thickness) 高於 f-4 砂带研磨 (Belt Sanding) f-5 ( Tin-Lead Stripping) 剥锡铅 f-6 ( Microsectio

5、n) f-7 微切片 (Plug Hole) G. 塞孔 印刷( Ink Print ) g-1 (Precure) g-2 预烤 (Scrub) g-3 表面刷磨 (Postcure) 后烘烤 g-4 ): (Solder Mask) (H. 防焊绿漆 ;. . (Printing Top Side) h-1 C面印刷 (Printing Bottom Side) h-2 S面印刷 (Spray Coating) h-3 静电喷涂 (Pretreatment) h-4 前处理 (Precure) h-5 预烤 (Exposure) h-6 曝光 (Develop) 显影 h-7 (Postc

6、ure) 后烘烤 h-8 (UV Cure) UV烘烤 h-9 文字印刷 ( Printing of Legend ) h-10 ( Pumice)(Wet Blasting) h-11 喷砂(Peelable Solder Mask) h-12 印可剥离防焊 I . 镀金 Gold plating i-1 金手指镀镍金 ( Gold Finger ) 电镀软金(Soft Ni/Au Plating) i-2 i-3 浸镍金 ( Immersion Ni/Au) (Electroless Ni/Au) (Hot Air Solder Leveling) J. 喷锡 (Horizontal Ho

7、t Air Solder Leveling) j-1 水平喷锡 Solder Leveling) 垂直喷锡 ( Vertical Hot Air j-2 超级焊锡 (Super Solder ) j-3 (Solder Bump) j-4. 印焊锡突点 (Profile)(Form) K. 成型 (N/C Routing ) (Milling) k-1 捞型 (Punch) 模具冲k-2 ;. . 板面清洗烘烤 (Cleaning & Backing) k-3 ( V-Cut)(V-Scoring) k-4 V型槽 ( Beveling of G/F) k-5 金手指斜边 L. 短断路测试 (

8、Electrical Testing) (Continuity & Insulation Testing) AOI 光学检查 ( AOI Inspection) l-1 目检 (Verified & Repaired) l-2 VRS 泛用型治具测试 (Universal Tester) l-3 (Dedicated Tester) l-4 专用治具测试 l-5 飞针测试(Flying Probe) M. 终检 ( Final Visual Inspection) ( Warpage Remove) m-1 压板翘 X-OUT 印刷 (X-Out Marking) m-2 (Packing &

9、 shipping) 包装 及出货 m-3 ;. . . Abietic Acid松脂酸. Abrasion Resistance耐磨性. ,刷材Abrasives磨料. 树脂ABS). 吸收入(Absorption. 交流阻抗Ac Impedance). 试验加速老化(Accelerated Test(Aging). 速化反应Acceleration. ,速化剂Accelerator 加速剂. 允收,Acceptability,Acceptance 允收性. ,露出孔穿露孔Access Hole. Accuracy准确度. Acid Number (Acid Value)酸值. Acoust

10、ic Microscope (AM)感音成像显微镜). 聚丙烯酸树脂(Acrylic压克力. 有效光Actinic Light (or Intensity, or Radiation). Activation活化. Activator活化剂. Active Carbon活性炭. Active Parts(Devices)主动零件. Acutance解像锐利度. Addition Agent添加剂. Additive Process加成法. Adhesion附着力. 附着力促进剂Adhesion Promotor. Adhesive胶类或接着剂). (Admittance导纳阻抗的倒数. 气悬体

11、,气熔胶,喷雾剂Aerosol. 老化Aging. Air Inclusion气泡夹杂. Air Knife风刀. Algorithm算法. Aliphatic Solvent脂肪族溶剂. 氮化铝Aluminium Nitride(AlN). 环境温度Ambient Tamp. ,非晶形无定形Amorphous. Amp-Hour安培小时;. . . 模拟电路Analog Circuit/Analog Signal/模拟讯号. Anchoring Spurs着力爪. Angle of Contack接触角. 攻角Angle of Attack. 阴离子Anion. ,Anisotropic异向

12、性单向的). Anneal 韧化(退火. Annular Ring孔环. Anode阳极. Anode Sludge阳极泥. 阳极化Anodizing. 美国标准协会ANSI. 消泡剂Anti-Foaming Agent. Anti-pit Agent抗凹剂. AOI自动光学检验. 开口Apertures,钢版开口. AQL品质允收水准. AQL(Acceptable Quality Level)允收品质水准. 聚醯胺纤维Aramid Fiber. 耐电弧性Arc Resistance. Array排列. Artwork底片. ASIC特定用途绩体电路器. 纵横比Aspect Ratio. 组

13、装装配Assembly. 阶段A-stage A. 自动电测设备ATE. 讯号衰减Attenuation. Autoclave压力锅. 轴心引脚Axial-lead. 共沸混合液Azeotrope*B* . Back Light (Back Lighting)背光法. Back Taper反锥斜角. 支撑板Backpanels, Backplanes. Back-up 垫板. Balanced Transmission Lines平衡式传输线;. . ). (封装Ball Grid Array球脚数组. Bandability弯曲性. Banking Agent护岸剂. Bare Chip A

14、ssembly裸体芯片组装. ,孔壁滚镀Barrel. 基材Base Material. 基本方格Basic Grid. 批BatchSp.Gr) Be=145-(145Baume波美度(凡液体比重比水重则(Sp.Gr-130) Be=140凡液体比重比水轻则). g/cm的比值*Sp.Gr 为比重即同体绩物质对纯水. Beam lead光芒式的平行密集引脚. Bed-of-Nail Testing针床测试. Bellows Conact弹片式接触. 贝他射线反弹散射Beta Ray Backscatter. 切斜边Bevelling. ,斜纤法Bias斜张纲布. Bi-Level Stenc

15、il双阶式钢板. Binder粘结剂(Drill Bits). Bits头. Black Oxide黑氧化层. 冲空断开Blanking. 漂洗Bleack . 溢流Bleeding. Blind Via Hole肓通孔. Blister局部性分层或起泡 . Block Diagram电路系统块图. 封纲Blockout. 干印Blotting. 吸水纸Blotting Paper. 吹孔Blow Hole). (锡面钝化层蓝纹Blue Plaque). (圈Blur Edge (Circle)模糊边带. Bomb Sight弹标. 结合强度Bond Strength. Bondability

16、结合性. Bonding Layer结合层接着层;. . . Bonding Sheet(Layer)接合片. Bonding Wire结合线. Bow, Bowing板弯. 编线Braid). Brazing硬焊(用含银的铜锌合金焊条). 870下进行熔接的方式在425. Break Point显像点. Break-away Panel可断开板. Breakdown Voltage崩溃电压. Break-out破出. 搭桥Bridging. 光泽浸渍处理Bright Dip. 光泽剂Brightener. Brown Oxide棕氧化. Brush Plating刷镀. B-stageB阶段

17、. Build Up Process增层法制程. Build-up堆积. 鼓起Bulge. 突块Bump . Bumping Process凸块制程. Buoyancy浮力. Buried Via Hole埋导孔. 高温加速老化试验Burn-in. 烧焦Burning. 毛头Burr. 汇电杆Bus Bar. 外表树脂层Butter Coat *C* . C4 Chip JointC4芯片焊接. Cable电缆. CAD计算机辅助设计. Calendered Fabric轧平式纲布. Cap Lamination帽式压合法. 电容Capacitance. Capacitive Coupling

18、电容耦合. Capillary Action毛细作用;. . . 碳化物Carbide. 碳弧灯Carbon Arc Lamp. 活化炭处理Carbon Treatment, Active. 卡板Card. Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍. 载体Carrier. 滤心Cartridge. Castallation堡型绩体电路器. Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化. 阴极Cathode. , 阳离子Cation阴向离子. Caul Plate隔板. Cavita

19、tion空泡化半真空. 中心间距Center-to-Center Spacing. 陶瓷Ceramics. 陶金粉Cermet. 证明书Certificate. CFC氟氢碳化物. Chamfer倒角. 特性阻抗Characteristic Impedance. 纲框Chase. 检查清单Check List. Chelate螯合. Chemical Milling化学研磨. 抗化性Chemical Resistance. 化学吸附Chemisorption). 粒芯片(Chip. Chip Interconnection芯片互连. Chip on Board芯片粘着板(COG). 晶玻接装C

20、hip On Glass. 钻针的尖部Chisel. ,Chlorinated Solvent含氯溶剂氯化溶剂. 环状断孔Circumferential Separation. Clad/Cladding披覆. Clean Room无尘室;. . . 清洁度Cleanliness. Clearance余地,余环. Clinched Lead Terminal紧箝式引脚 . 通孔弯线连接法Clinched-wire Through Connection. 绕线端接Clip Terminal. 皮膜表层Coat, Coating. Coaxial Cable同轴缆线. 热膨胀系数Coefficie

21、nt of Thermal Expansion. 共绕Co-Firing. 冷流Cold Flow. 冷焊点Cold Solder Joint. Collimated Light平行光. Colloid胶体. Columnar Structure柱状组织. 梳型电路Comb Pattern. 错离子Complex Ion. Component Hole零件孔. Component Orientation零件方向. Component Side组件面. 复合板材Composites,(CEM-1,CEM-3). ,液化放热焊接Condensation Soldering凝热焊接. 整孔Condi

22、tioning. 导电Conductance. 导电盐Conductive Salt. Conductivity导电度. 导体间距Conductor Spacing. 贴护层Conformal Coating. 服贴性Conformity吻合性, . 连接器Connector. Contact Angle接触角. Contact Area接触区. 接触电阻Contact Resistance. 连通性Continuity. ,Contract Service协力厂分包厂. 定深钻孔Controlled Depth Drilling. Conversion Coating 转化皮膜. Copla

23、narity共面性;. . . 共聚物Copolymer. 铜皮Copper Foil. 铜镜试验Copper Mirror Test. 铜膏Copper Paste. Copper-Invar-Copper (CIC)综合夹心板. ,内层板材Core Material核材. 通孔断角Corner Crack . 板角标记Corner Mark. Counterboring方型扩孔. Countersinking锥型扩孔. Coupling Agent 偶合剂. Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层. Crack裂痕. Crazing白斑

24、. Crease皱折. Creep潜变. Crossection Area截面积. Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. ,架桥Crosslinking, Crosslinkage交联. 搭交越交Crossover,. 串讯Crosstalk噪声, . 晶体熔点Crystalline Melting Point. C-Stage C阶段. 熟化硬化Cure,. 电流密度Current Density. 载流能力Current-Carrying Capability. 濂涂法Curtain Coating*D* . Daisy Chained

25、 Design菊瓣设计. Datum Reference基准参考. Daughter Board子板. ,残材Debris碎屑. 去毛头Deburring. Declination Angle斜射角. Definition边缘逼真度;. . . 劣化Degradation . 脱脂Degrasing. 去离子水Deionized Water. 分离Delamination. Dendritic Growth 枝状生长, 是编织纺织所用各种纱类直径单位Denier丹尼尔(). 9000定义米纱束所具有的重量(以克米计. 透光度计Densitomer. 凹陷Dent. 皮膜处理Deposition

26、 . 干燥器Desiccator. Desmearing去胶渣. 解焊Desoldering. 显像机Developer显像液, . Developing显像. 偏差Deviation. 电子组件Device. 缩锡Dewetting. 玻璃D-glassD. 偶氮棕片Diaze Film. 酸盐Dichromate重铬 . Dicing芯片分割. Dicyandiamide(Dicy)双氰胺. 冲模Die . 晶粒安装Die Attach. 晶粒接着Die Bonding. 冲压Die Stamping. 介质Dielectric . Dielectric Breakdown Voltage

27、介质崩溃电压. Dielectric Constant介质常数. Dielectric Strength介质强度. Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层. Digitizing数字化. 双反斜角Dihedral Angle. Dimensional Stability尺度安定性. Diode二极管;. . . 浸涂法Dip Coating. Dip Soldering浸焊法. DIP(Dual Inline Package)双排脚封装体. 双极Dipole偶极,. /Direct / Indire

28、ct Stencil直接间接版膜. Direct Emulsion直接乳胶. 直接电镀Direct Plating. 散装零件Discrete Compenent. ,复线板Discrete Wiring Board散线电路板. Dish Down碟型下陷. Dispersant分散剂. Dissipation Factor散失因素. Disspation Factor散逸因子. Disturbed Joint受扰焊点. 刮平刀Doctor Blade修平刀,. 狗耳Dog Ear. Doping掺杂. Double Layer双电层. 双面处理铜箔Double Treated Foil. /

29、Drag In / Drag Out带带出进. 拖焊Drag Soldering. Drawbridging吊桥效应. Drift漂移. 钻尖切削面Drill Facet. 钻针重磨机Drill Pointer. 已钻孔的裸板Drilled Blank. 浮渣Dross. 铜箔光面Drum Side. 干膜Dry Film. Dual Wave Soldering 双波焊接. Ductility展性. Dummy Land假焊垫). 片(Dummy, Dummying假镀. 橡胶硬度计Durometer. 电浆蚀孔增层法DYCOstrate. 动态软板Dynamic Flex(FPC)*E*

30、;. . . E-Beam (Electron Beam)电子束. Eddy Current涡电流. Edge Spacing板边空地. )(Edge-Board Connector板边金手指承接器. Edge-Board Contact板边金手指. 板边焊锡性测试Edge-Dip Solderability Test. EDTA乙二胺四乙酸. Effluent排放物. E-glass电子级玻璃. Elastomer弹性体. )电性强度Electric Strength(耐. Electrodeposition电镀. , 电泳光阻Electro-deposition Photoresist电着

31、光阻. Electroforming电铸. 无电镀Electroless-Deposition. 电解铜Electrolytic Tough Pitch. Electrolytic-Cleaning电解清洗. Electro-migration电迁移. , 电泳动Electro-phoresis电渗. Electro-tinning镀锡. Electro-Winning电解冶炼. 延伸率Elongation 延伸性, . 凸出性压花Embossing. 电动势EMF(Electromotive Force). EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化. 药膜面Emulsion Side. 胶囊Encapsulatin