baseline.docx

1、baselineSPECIFICATION NAMEDEPTNAMEDEPTORIGINATORZhang XJBDAPPROVALZhu YKOPRPu JHDCCAPPROVALWu JZQRAREVIEWERCui SBDAPPROVALREVIEWERZhang DHA-PEAPPROVALREVIEWERFei RA-EEAPPROVALREVIEWERLi XFA-PDAPPROVAL REVIEWERLu ZFQS&QCAPPROVALREVIEWERAPPROVALEFFECTIVE DATE：CONTROLLED STAMPRELATED DOCUMENT UPDATED O

2、R MODIFIED? FMEA CONTROL PLAN OCAP POSITROL LOGDESCRIPTION OF WORKING INSTRUCTION CHANGE (FROM/TO)REV.EFFECTIVE DATEREVISION HISTORYPREPAREDAANew releaseZhagn XJCONTENTS 1 PURPOSE 目的 2 SCOPE 范围 3 REFERENCE DOCUMENTS 参考文件 4 DEFINITION 定义5 RESPONSIBILITY 职责和权限 6 APPLIED EQUIPMENT 适用设备7 PROCEDURE 程序内容8

3、 SAFETY AND ENVIRONMENT 安全与环保9 RECORD 记录10ATTACHMENT 附录1PURPOSE 目的To provide base-line flow for QFN package assembly and to define basic requirements for QFN package production in ANST.为ANST生产的QFN封装件加工提供基本流程图，定义QFN封装件加工生产的基本要求。2SCOPE 范围This specification shall be applied to ANST QFN products.本规范适用于A

4、NST封装的QFN封装件产品。3REFERENCE DOCUMENTS 参考文件3.1QFN Control Plan QFN 控制计划 S-CP-BD-0023.2Anst CONTROL PLAN FOR INCOMING INSPECTION MATERIALS 安盛来料检验的控制计划S-CP-IQA-0013.3ESD Control Procedure ESD控制标准 S-QAP-ESD-0403.4Environment Control Procedure 环境控制程序 S-QAP-ENV-0083.5Process Control Procedure 工艺控制程序 S-PEP-G

5、EN-0293.6Calibration Procedure校准程序 S-QAP-CAL-0173.7Corrective and Preventive Action Procedure纠正和预防措施程序 S-QAP-QS-0213.8Non-conforming Material Control Procedure 不合格材料控制程序 S-QAP-IQA-0233.9Record Control Procedure记录控制程序 S-QAP-QS-0023.10Customer Specification/Requirement Review Procedure客户规范要求评审规定 S-QAW

6、-QS-0043.11Nonconforming Product Control Procedure 不合格品管理程序 S-QAP-QC-0194DEFINITIONS 定义4.1BD(Bisiness Development dapartment) 业务发展部4.2QA (Quality Assurance department) : 质量部4.3PROD (Production department) : 生产部4.4PE（Process Engineering Department）: 工艺工程部4.5IQA (Incoming Quality Assurance) : 进料质量检验4.

7、6PC (Plan Control ) : 生产计划.4.7PDC (Product Distribution Center) : 产品发货中心 5RESPONSIBILITY 职责和权限5.1Production Department 生产部Production department is responsible for performing the production operation based on the documented procedure and ensure product safety during production.生产部负责根据文件规定的过程进行生产并保证产品

8、在生产中的安全。5.2Plan Department 企划部Kitting room clerk is responsible for receiving the wafers and checking the device, quantity, lot number with label in box and shipping information.圆片库人员负责接收原片, 并根据盒子上的标签和运输信息检查Device, 数量, 批量号.5.3PDC (Product Distribution Center) : 产品发货中心PDC department has responsibilit

9、y to assure the handling, storage and shipping and to maintain products quality by required manners for the finished products which is moved from manufacturing area.产品发货中心确保在管理, 储存及运输中保证产品数量与从生产部送来的产品数量一致.5.4Quality Assurance Department 质量部The QA department performs monitoring, inspection and test t

10、o ensure the conformity of the process and product according to the specified requirements. IQA performs incoming inspection of materials.质量部门负责监控, 检查和测试确保过程和产品符合所规定的要求. IQA 对材料进行进货检查.5.5Process Engineering Department 工艺工程部The Process Engineers responsibility to support R&D and update periodically.工

11、艺工程师负责支持研发并定时更新. Bisiness Development dapartment 业务发展部 BD has responsibility to constitute initial baseline about new Package in RD 业务发展部负责新开发封装形式baseline 的初步制定6APPLIED EQUIPMENT 适用设备 Refer to para, technical specifications. 参考 的技术规范7PROCEDURES 程序内容7.1Base-line process flow 基本工艺流程图Manufacturing step

12、Inspection/TestQA gateJudgementProcess flowRESPSpec NoRemarkDie AttachWafer MountingBack grindingWafer Sawing Wafer receiving Wafer IQCAccept2nd Optical QC gateReject2nd Optical inspectionPost Die Attach Cure Wire BondingAccept3RD Optical QC gateReject3RD Optical inspectionMoldingPost Mold CurePCIQA

13、PRODPRODPRODQAPRODPRODPRODPRODPRODQAPRODPRODPRODS-PLW-PC-001 S-QAW-IQA-001S-PES-BG-011S-PES-WS-008S-PES-WS-007S-QAW-WS-001S-PES-WS-003S-PES-DA-008S-PEW-DA-009 S-PES-WB-008S-QAW-WB-004S-PES-WB-001S-PES-MD-001S-PEW-MD-014Note#1Note#2Note#4Note#3Note#2Note#5Note#6Process flowRESPSpec NoRemarkMarkingYNT

14、estingEVI QC lots accept External Visual InspectionSingulation PRODPRODPRODQAPRODS-PES-MK-001S-PES-EVI-001S-QAW-EVI-001Note 7# Note 8# NOTE 1 If fail, IQA shall inform customer service dept. and customer service dept. should inform customer and wait for their disposition. 当检查失败, IQA应该通知客户服务部, 客户服务部必

15、须通知客户并等候处理. NOTE 2 100% inspection shall be processed when only QA gate inspection fail. 当QA gate 检查失败时，生产部必须进行100检查。 NOTE 3 Please cleaning it by PLASMA before wire bonding.在键合之前需要进行PLASMA清洗 NOTE 4 Please marking the differen No on every leadframe before die bonding,then record the strip No on the

16、paper attach after T-CARD,and do “X” at reject appeddix one.在装片时,每条引线框上标上不同的号码，并在随件单后面附的不良品记录纸上记录该条的号码，并在不良品位置上画“X”，见附录一.NOTE 5 All reject product need be done “X”according to reject recording paper,putting reject strip on topside. 全部不良品根据不良品记录单使用特制网格板对位打“X”，不良电路放在最上层。NOTE 6 Using pressure magazine

17、do PMC, put one slat seclude every 10 strips, and one magazine only can contain 30strips，and put 30kg weight slat on the top.塑封后固化采用施压弹匣，每隔10条放入一块铁板，一个弹匣只能放30条框架,最上层放置810kg的金属块。NOTE 7 Using tailor-made table tooling on manual laser marking MC, precision is very important. 打印使用专用的定位钉台面在手动激光打印机生产，控制精度

18、NOTE 8 Operator wipe off tape before Sawing，then input it to FOL magazine. 切割前作业员手动撕除LF上的贴膜,然后将产品插入前道料盒，放入机器生产.7.2TECHNICAL SPECIFICATIONS 技术规范7.2.1Available Raw material 原材料清单(1)工序原材料备品号/型号供应商PROCESSRAW MATLPART#/MODEL NAMESUPPLIERBack GrindingBack Grind TapeSB-205SI-R2MITSUIWafer MountMount TapeSP

19、V-224Nitto HAE-1503L日立化成Die SawingSaw BladeSD3500-N1-70AADISCOZH05-SD2000-N1-110-DDDISCO104F 27HDDDDISCOJ1440-Q300Kulicke&SoffaJ1030-Q300Kulicke&SoffaKH5-1635DISCO2030 27HCDCDISCO2030 27HCBBDISCOS1435Kulicke&SoffaDie AttachEpoxyQMI519/QMI168Henkel8290AblestikLead FrameQFN系列ASM/三星/QPL/三井Wire BondingG

20、old Wire 20um50um贺利氏，达博，康强 MoldingCompoundCEL9200M (16*HITACHICEL9220HF13(16*HITACHISingulation Blade58x40 三菱/DISCO/ ITI 7.2.2Available Process Equipment 现有加工设备(1)工序设备备品号/型号供应商PROCESSEQUIPMENTMODEL NAMEMANUFACTURERBack GrindingBack GrinderDFG-83H/6DISCODFG-850DISCOMULTI-NANO-3-300G&NTape LaminatorD-

21、304NEL SYSTEMATM-1100ETAKATIRITape RemoveH-304NEL SYSTEMATRM-2200TAKATIRIWafer MountWafer Mount M-265NITTOSAM-8TAKATIRIFM-114TechnovifionDTMWM1230DYNA TECHATM-8100TAKATORIDie SawingWafer SawA-WD-100ATSKA-WD-10ATSKDAD321DISCODFD640DISCODFD641DISCODFD651DISCODFD6340DISCODie AttachDie BonderAD828ASMPLA

22、SMACleanAP-1000MarchWire BondingWire BonderASM Eagle60/K&S/UTC1000/2000ASM/K&S/INKWAMoldingAuto mold systemTOWA Y-1TOWAMarkingManual marking systemManual marking system大族SingulationSaw machineSW5000SECRON Quality Specification产品外观检查规范NoQFN标准QFN Quality Specification1塑封体裂纹package crackREJ2塑封体微隙packag

23、e microgapREJ3塑封体缺损package chipout*4塑封体异物package stain正面,其他区域,沾污影响打印必须具备可识别top ,other area If the stain on package marking area,then vision shall be must can identify5塑封体弯曲package bend6刮痕scratch1*,影响打印必须具备可识别1*,if the scratch on package marking area,then vision shall be must can identify7塑封体尺寸packag

24、e size长和宽偏差 The long and wide windage is 8底部外露小岛粘污 bottom exposes the island to stain1/5小岛面积less than 1/5 island area9切割后引脚尺寸偏差lead size windage after cutting (左右或上下引脚长度之差) (Difference on left and right sides or upper and lower lead length)10引脚凹痕lead dent11连筋残留dambar remain REJ12切割毛刺cutting burr13引脚

25、松动断裂lead breakREJ14X,Y方向引脚突出lead extrude15引脚损坏lead damage引脚长度,引脚宽度less than lead length and less than lead width16引脚异物lead stain引脚焊接面不允许有There cant be stain on the lead surface17引脚切断面金属毛刺lead cutting surface of metal burr 引脚间距离的1/2 (QFN48(5*5) 引脚间距离的2/3)less than 1/2 of the distance between the lead

26、(QFN48(5*5) less than 2/3 of the distance between the lead)18切割Z方向毛刺cutting Z direction burrMAX 19模糊的打印标记 (Illegible Marking)在规定条件下,裸眼12英寸(30cm)无法辨认的打印标记为模糊的打印标记. Reject any marking not clearly visible at a distance of 12 inches (30cm) under specified condition with naked eyes.双重打印标记 (Double Marking

27、)由于双重打印标记导致的字迹模糊 或可能被误识 的都应REJECT（报废） .Reject any double marking which renders characters illegible or may be misjudged with another character.打印标记方向错误 (Incorrect Marking Orientation)任何方向错误的打印标记都应REJECT（报废） .Reject any marking with incorrect orientation.错误的打印标记 (Wrong Marking)打印的内容不符合打印指导书错误打印标记都应RE

28、JECT（报废） .Reject any marking not in accordance with marking instruction.打印标记错位或移位 (Marking Placement)打印内容落在注塑体外,字体压边不完整（报废） .Reject marking out of the package surface or touch the edge打印标记倾斜(Inclined Marking)打印内容倾斜超过10度应REJECT （报废）.Reject marking inclination more than 10 degree.打印标记破裂 (Broken Marking)打印的图标或者字符有断裂处超过其本来印记宽度的应该REJECT（报废）.Reject marking logo or character with broken area more than the original width of the mark.无打印标记 (No Marking)有遗漏打印标记的器件应