P12异常报错处理下.docx

1、P12异常报错处理下A2353WAFER SHOULD BE ON CASSETTE SLOTMEASUREAfter moving the arm to its home position, try again.3.Message 3.消息3.1Stage Message 3.1阶段的信息3.1.1Stage Message 3.1.1Stage消息M0001STAGE INITIALIZATION NOT EXECUTED M0001STAGE初始化不执行M0002XY STAGE TRANSFER DESTINATION EXCEEDS SOFTWARE LIMIT M0002XY阶段转

2、移目的地超过软件限制M0003Z STAGE TRANSFER DESTINATION EXCEEDS SOFTWARE LIMIT M0003Z阶段转移目的地超过软件限制M0004 STAGE TRANSFER DESTINATION EXCEEDS SOFTWARE LIMIT M0004阶段转移目的地超过软件限制M0005UNABLE TO FIND SEARCH PATTERN M0005UNABLE找到搜索模式M0006PROCEED POINT IS NOT CORRECT M0006PROCEED观点是不正确的M0007ARITHMETIC ERROR M0007ARITHMET

3、IC错误M0008MARKER NOT CONNECTED M0008MARKER没有连接M0009BRIDGE WILL INTERFERE WITH TARGET MOVEMENT M0009BRIDGE将干扰目标运动M0010COMMAND PARAMETERS EXCEED LIMIT M0010COMMAND参数超过限制M0011NO FILE NAME IS SPECIFIED M0011NO指定文件名M0012BRIDGE MOVEMENT NOT POSSIBLE BECAUSE OF 3 PIN IS UP M0012BRIDGE运动不可能因为3针M0013BRIDGE WI

4、LL INTERFERE WITH CHUCK TOP M0013BRIDGE将干扰卡盘M0014BRIDGE WILL INTERFERE WITH TARGET M0014BRIDGE将干扰目标M0015BRIDGE WILL INTERFERE WITH PROBE POLISHER M0015BRIDGE将干扰探测器抛光机M0016PROBE POLISHER WILL INTERFERE WITH BRIDGE M0016PROBE抛光机将干扰桥M0017PROBE POLISHER WILL INTERFERE WITH PROBE CARD M0017PROBE抛光机将干扰探针卡

5、M0018BRIDGE WILL INTERFERE WITH CHUCK TOP DURING Z MOVEMENT M0018BRIDGE将在Z运动干扰卡盘上M0019BRIDGE WILL INTERFERE WITH TARGET DURING Z MOVEMENT 在Z运动M0019BRIDGE将干扰目标M0020POLISHER WILL INTERFERE WITH BRIDGE DURING Z MOVEMENT M0020POLISHER将在Z运动干扰桥M0021PROBE CARD WILL INTERFERE WITH WAFER DURING Z MOVEMENT M0

6、021PROBE卡将在Z运动干扰晶片M0022PROBE CARD WILL INTERFERE WITH POLISHER DURING Z MOVEMENT M0022PROBE卡将在Z运动干扰抛光机M0023CHUCK WILL INTERFERE WITH UPPER ARM DURING Z MOVEMENT M0023CHUCK将在Z运动干扰上臂M0024CHUCK WILL INTERFERE WITH LOWER ARM DURING Z MOVEMENT M0024CHUCK将在Z运动干扰下臂M0025SURFACE MAP NOT COMPLETED M0025SURFAC

7、E地图没有完成M0026WAFER MACRO-ALIGNMENT NOT COMPLETED M0026WAFER MACRO-ALIGNMENT没有完成M0027WAFER MICRO-ALIGNMENT NOT COMPLETED M0027WAFER MICRO-ALIGNMENT没有完成M0028PAD REGISTRATION OVER LIMIT M0028PAD登记超过限制M0029INSPECTION PAD REGISTRATION OVER LIMIT M0029INSPECTION垫登记超过限制M0030THIS PAD NAME HAS ALREADY BEEN US

8、ED M0030THIS垫名称已被使用M0031STANDARD PROBE SETTING NOT COMPLETED M0031STANDARD探头设置未完成M0032PROBE SETTINGS OVER LIMIT M0032PROBE设置了限制M0033PROBE MACRO-ALIGNMENT NOT COMPLETED M0033PROBE MACRO-ALIGNMENT没有完成M0034PROBE MICRO-ALIGNMENT NOT COMPLETED M0034PROBE MICRO-ALIGNMENT没有完成M0035PROBE MICRO-ALIGNMENT NOT

9、COMPLETED M0035PROBE MICRO-ALIGNMENT没有完成M0036PROBE ALIGNMENT NOT POSSIBLE WHILE 3 PIN IS UP 而3销M0036PROBE对齐不可能的M0037NO PROBE CARD DATA SAVED M0037NO探针卡数据保存M0038NOT AN OPTION OR NOT SET M0038NOT或没有设置一个选项M0039SACC OR INKERS ARM ARE INTERFERING M0039SACC或墨棒的手臂是干扰M0040THE MARKING COUNT IS NOT SET M0040T

10、HE标记数没有设置M0041THE MARKING PARAMETERS ARE ABNORMAL M0041THE标记参数异常M0042THE CONNECTOR PARAMETERS ARE ABNORMAL M0042THE连接器参数异常M0043SACC HOME TRANSFER WILL OCCUR M0043SACC家里会发生转移M0044PERFORMING AUTO HF OPERATION M0044PERFORMING汽车高频操作M0045AUTO HF STATUS ERROR M0045AUTO高频状态错误M0046THIS WILL INTERFERE WITH M

11、ARKER ARM M0046THIS将干扰标记的手臂M0047There is no wafer loaded M0047There没有晶片加载M0048The angle of the wafer on the chuck is abnormal M0048The卡盘上的晶片角是不正常的M0049The position of the wafer on the chuck is abnormal M0049The卡盘上的晶片的位置是不正常的M0050Cannot execute because the needle mark execution size is too large M005

12、0Cannot马克执行执行,因为针尺寸太大M0053MACRO VISUAL FIELD Z POSITION OF THE MARKER IS OUT OF RANGE M0053MACRO视野Z位置标记的范围M0054MICRO VISUAL FIELD Z POSITION OF THE MARKER IS OUT OF RANGE M0054MICRO视野Z位置标记的范围M0055THERE IS NO PATTERN DATA FOR ALIGNMENT M0055THERE没有模式数据对齐M0056Transfer amount at offset is too large M00

13、56Transfer在抵消量太大M0057The same probe is designated M0057The相同的探针被指定M0058A wafer is already loaded M0058A晶圆已经加载M0059The file count is excessive M0059The文件数过多M0060There is no Delete File at the Copy Source M0060There不删除源文件副本M0061The Transfer Amount at XY Position Offset is too large M0061The转移金额在XY位置偏移

14、量太大M0064PROBE CONTACT OFFSET AMOUNT ERROR M0064PROBE接触抵消金额错误M0065CONTACT POSITION OFFSET AMOUNT ERROR M0065CONTACT位置偏移误差M0070THE SACC COVER IS OPEN M0070THE、覆盖是开放的M0071PRESS OK AFTER OPENING THE SACC COVER M0071PRESS好后打开、封面M0072THE SACC COVER IS CLOSED M0072THE、关闭M0073MOVE TO THE TRAY HAND-OVER POSI

15、TION M0073MOVE托盘交接位置M0080CHECK THAT THERE IS NO WAFER ON THE CHUCK 查克M0080CHECK没有晶片M0081CHECK AGAIN THAT THERE IS NO WAFER ON THE CHUCK M0081CHECK又没有晶片在卡盘上M0084Perpendicular cumulative coefficient value was incorrect in the wafer alignment results. M0084Perpendicular累积系数值是不正确的在晶片对齐结果。M0086Z PTPA Cor

16、rection reached maximum overdrive value. M0086Z PTPA校正达到最大超速值。M0087Z PTPA Correction reached Z Down Amount. M0087Z PTPA校正达到Z数量。M0094Cannot execute needle polish due to set limit of XY stage. M0094Cannot执行针波兰由于XY限量阶段。M0095The surface of the needle polish wafer is used up. M0095The针表面抛光晶片用完了。M0098Sect

17、ioned polishing WAPP setting error. M0098Sectioned抛光WAPP设置错误。M0125TEST HEAD OPEN ERROR M0125TEST头打开错误M0151Cannot section-polished as Polish Pattern is not Up/Down. M0151Cannot section-polished作为波兰模式不是“上/下”。M0270CANNOT DOWNLOAD INK MARK TRAINING DATA M0270CANNOT下载墨水标记训练数据M0271CANNOT DOWNLOAD INK COUN

18、T TRAINING DATA M0271CANNOT下载墨水计算训练数据M0272CANNOT DOWNLOAD PAD TRAINING DATA M0272CANNOT下载垫训练数据M0273CANNOT LIGHT INK INSPECTION LIGHT. M0273CANNOT光油墨检验光。M0274CANNOT LIGHT INK COUNT CHECK LIGHT. M0274CANNOT光油墨计数检查。M0275CANNOT LIGHT PROBE MARK INSPECTION LIGHT M0275CANNOT光探针标记检查光M0276INK MARK INSPECTIO

19、N TIME OUT M0276INK马克检查时间M0277INK COUNT CHECK TIME OUT M0277INK计数检查时间M0278PROBE MARK INSPECTION TIME OUT M0278PROBE马克检查时间M0279NO INK MARK TRAINING DATA M0279NO墨水标记训练数据M0280NO INK COUNT TRAINING DATA M0280NO墨水计算训练数据M0281NO PAD TRAINING DATA M0281NO垫训练数据M0282The PMI Class in the Pad Coordinates is not

20、 set. 垫M0282The PMI类坐标没有设置。M0900REMOVE THE WAFER ON THE CHUCK M0900REMOVE卡盘上的晶片M0901PUT THE WAFER ON THE CHUCK M0901PUT卡盘上的晶片M0902POSITION THE MACRO PATTERN ON THE CROSSHAIRS M0902POSITION瞄准器上的宏观模式M0903POSITION THE MICRO PATTERN ON THE CROSSHAIRS 克罗斯M0903POSITION微观模式M0904POSITION THE REFERENCE DIE O

21、N THE CROSSHAIRS M0904POSITION参考死在这网站3.2Loader Message 3.2加载程序信息3.2.1Undefined Loader Message 3.2.1Undefined装载机的信息M2001UNDEFINED LOADER ERROR M2001UNDEFINED加载程序错误M2005A WAFER SIZE VALUE OTHER THAN 200mm OR 300mm HAS BEEN SET. M2005A晶片大小价值以外的200毫米或300毫米。3.2.2Upper Arm Message 3.2.2Upper部门消息M2010UPC M

22、OTOR DRIVER BOARD DEFECTIVE M2010UPC电机驱动板有缺陷M2020UPPER ARM MOTOR DRIVER BOARD DEFECTIVE M2020UPPER臂电机驱动板有缺陷M2021UPPER ARM MOTOR DRIVER BOARD DEFECTIVE M2021UPPER臂电机驱动板有缺陷M2022LOADER Z NOT ON TABLE POSITION (ARM DRIVE) M2022LOADER Z不是表位置(臂驱动)M2023UPPER ARM ENCODER DEFECTIVE (CHECK THE WAFER). M2023UP

23、PER手臂编码器缺陷(检查晶片)。M2024WAFER TABLE DOOR IS OPEN (ARM DRIVE) M2024WAFER表门是开放的(驱动)M2025UPPER ARM DOWN LIMIT CHECK ERROR M2025UPPER手臂下极限检查错误M2026UPPER ARM UP LIMIT CHECK ERROR M2026UPPER手臂极限检查错误M2027LOAD PORT 1 DOOR IS OPEN (ARM DRIVE) M2027LOAD端口1门是开放的(驱动)M2028LOAD PORT 2 DOOR IS OPEN (ARM DRIVE) M2028

24、LOAD端口2门是开放的(驱动)3.2.3Lower Arm Message 3.2.3Lower部门消息M2029LOWER ARM MOTOR DRIVER BOARD DEFECTIVE M2029LOWER臂电机驱动板有缺陷M2030LOWER ARM MOTOR DRIVER BOARD DEFECTIVE M2030LOWER臂电机驱动板有缺陷M2031LOWER ARM MOTOR DRIVER BOARD DEFECTIVE M2031LOWER臂电机驱动板有缺陷M2033LOWER ARM ENCODER DEFECT (CHECK THE WAFER). M2033LOWE

25、R手臂编码器缺陷(检查晶片)。M2035LOWER ARM DOWN LIMIT CHECK ERROR M2035LOWER手臂下极限检查错误M2036LOWER ARM UP LIMIT CHECK ERROR M2036LOWER手臂极限检查错误3.2.4Loader Message 3.2.4Loader消息M2037LOADER MOTOR DRIVER BOARD DEFECTIVE (ORIGIN DRIVER DATA) M2037LOADER电机驱动板有缺陷(起源司机数据)M2038LOADER MOTOR DRIVER BOARD DEFECTIVE M2038LOADER

26、电机驱动板有缺陷M2039LOADER MOTOR DRIVER BOARD DEFECTIVE (AT INITIALIZATION) M2039LOADER电机驱动板有缺陷(初始化)M2040LOADER ENCODER DEFECTIVE (CHECK THE WAFER). M2040LOADER编码器缺陷(检查晶片)。M2041LOADER DOWN LIMIT CHECK ERROR M2041LOADER下极限检查错误M2042LOADER UP LIMIT CHECK ERROR M2042LOADER极限检查错误M2043UPPER ARM IS NOT AT HOME PO

27、SITION (LOADER DRIVE) M2043UPPER手臂不在家位置(装载机驱动器)M2044LOWER ARM IS NOT AT HOME POSITION (LOADER DRIVE) M2044LOWER手臂不在家位置(装载机驱动器)M2045LOAD PORT 1 DOOR IS OPEN (LOADER DRIVE) M2045LOAD端口1门是开放的(装载机驱动器)M2046LOAD PORT 2 DOOR IS OPEN (LOADER DRIVE) M2046LOAD端口2门是开放的(装载机驱动器)M2047WAFER TABLE DOOR IS OPEN (LOA

28、DER DRIVE) M2047WAFER表门是开放的(装载机驱动器)3.2.5Subchuck Message 3.2.5Subchuck消息M2049SUBCHUCK MOTOR DRIVER BOARD DEFECTIVE M2049SUBCHUCK电机驱动板有缺陷M2050SUBCHUCK MOTOR DRIVER BOARD DEFECTIVE M2050SUBCHUCK电机驱动板有缺陷M2051SUBCHUCK MOTOR DRIVER BOARD DEFECTIVE M2051SUBCHUCK电机驱动板有缺陷M2053SUBCHUCK ENCODER DEFECTIVE (CHE

29、CK THE WAFER). M2053SUBCHUCK编码器缺陷(检查晶片)。M2054SUBCHUCK DOWN LIMIT CHECK ERROR M2054SUBCHUCK下极限检查错误M2055SUBCHUCK UP LIMIT CHECK ERROR M2055SUBCHUCK极限检查错误M2056NO WAFER SHOULD BE ON SUBCHUCK SUBCHUCK M2056NO晶片应该M2057WAFER SHOULD BE ON SUBCHUCK M2057WAFER SUBCHUCK应该M2058SUBCHUCK IS AT ITS LOWEST POINT BU

30、T THERE IS A WAFER PRESENT M2058SUBCHUCK在最低点,但有一个晶片(CANNOT TRANSFER) (不能转移)3.2.6Loader Z Message 3.2.6Loader Z的信息M2059LOADER Z MOTOR DRIVER BOARD DEFECTIVE M2059LOADER Z电机驱动板有缺陷M2060LOADER Z MOTOR DRIVER BOARD DEFECTIVE M2060LOADER Z电机驱动板有缺陷M2061LOADER Z MOTOR DRIVER BOARD DEFECTIVE M2061LOADER Z电机驱

31、动板有缺陷M2063LOADER Z ENCODER DEFECTIVE (CHECK THE WAFER) M2063LOADER Z编码器缺陷(检查晶片)M2064LOADER Z SOFTWARE INTERLOCK ERROR M2064LOADER Z联锁软件错误M2065LOADER Z DOWN LIMIT CHECK ERROR M2065LOADER Z极限检查错误M2066LOADER Z UP LIMIT CHECK ERROR M2066LOADER Z极限检查错误M2067NO TRAY ON WAFER TABLE IN LOADER Z 表在装载机Z M2067NO托盘在晶片M2068LOA