W25Q64中文资料精编版.docx

W25Q64中文资料精编版.docx

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W25Q64中文资料精编版

W25Q64BV

出版日期：

2010年7月8日

-1-版本E

64M位

与串行闪存

双路和四路SPI

W25Q64BV

-2-

1，一般DESCRIPTION...............................................................................................................5

2。

FEATURES.......................................................................................................................................5

3引脚配置SOIC208-MIL............................................................................................6

4，焊垫配置WSON8X6-MM........................................................................................6

5，焊垫配置PDIP300-MIL...........................................................................................7

6引脚说明SOIC208密耳，PDIP300密耳和WSON8X6-MM................................7......

7引脚配置SOIC300mil的............................................................................................8

8引脚SOIC封装说明300-MIL..................................................................................................8

8.1包装Types.....................................................................................................................9

8.2片选（/CS）..................................................................................................................9

8.3串行数据输入，输出和IO（DI，DO和IO0，IO1，IO2，IO3）.............................9.......

8.4写保护（/WP）...............................................................................................................9

8.5控股（/HOLD）.....................................................................................................................9

8.6串行时钟（CLK）................................................................................................................9

9座DIAGRAM..........................................................................................................................10

10功能DESCRIPTION.......................................................................................................11

10.1SPIOPERATIONS.............................................................................................................11

10.1.1标准SPIInstructions...................................................................................................11

10.1.2双SPIInstructions..........................................................................................................11

10.1.3四路SPIInstructions.........................................................................................................11

10.1.4保持功能.....................................................................................................................11

10.2写保护.......................................................................................................12

10.2.1写保护Features........................................................................................................12

11，控制和状态寄存器........................................................................................13

11.1状态REGISTER..........................................................................................................13

11.1.1BUSY..................................................................................................................................13

11.1.2写使能锁存（WEL）..................................................................................................13

11.1.3块保护位（BP2，BP1，BP0）....................................................................................13

11.1.4顶/底块保护（TB）...........................................................................................13

11.1.5部门/块保护（SEC）................................................................................................13

11.1.6状态寄存器保护（SRP，SRP0）...............................................................................14

11.1.7四路启用（QE）..............................................................................................................14

11.1.8状态寄存器内存保护....................................................................................16

11.2INSTRUCTIONS.................................................................................................................17

11.2.1制造商和设备标识..............................................................................17

11.2.2指令集表1........................................................................................................18

W25Q64BV

11.2.3指令表2（阅读说明书）........................................................................19

出版日期：

2010年7月8日

-3-修订版E

11.2.4写使能（06h）..............................................................................................................20

11.2.5写禁止（04h）.............................................................................................................20

11.2.6读状态寄存器1（05H）和读状态寄存器2（35H）.......................................21

11.2.7写状态寄存器（01H）................................................................................................22

11.2.8读取数据（03h）.................................................................................................................23

11.2.9快速阅读（0Bh）.................................................................................................................24

11.2.10快速读双输出（3BH）..........................................................................................0.25

11.2.11快速读四路输出（6BH）..........................................................................................26

11.2.12快速读双I/O（BBh）.................................................................................................27

11.2.13快速读取四I/O（EBh）...............................................................................................29

11.2.14八进制字读取四I/O（E3H）.....................................................................................31

11.2.15页编程（02h）.........................................................................................................33

11.2.16四路输入页编程（32H）......................................................................................34

11.2.17扇区擦除（20H）...........................................................................................................35

11.2.1832KB的块擦除（52H）...................................................................................................36

11.2.1964KB的块擦除（D8h）...................................................................................................37

20年2月11日芯片擦除（C7H/60h）.....................................................................................................38

21年2月11日擦除挂起（75h）........................................................................................................39

22年2月11日擦除恢复（7Ah）........................................................................................................40

23年11月2日掉电（B9h）............................................................................................................41

24年2月11日高性能模式（A3H）.........................................................................................42

25年2月11日发布掉电或高性能模式/设备ID（ABH）...............................42

26年2月11日读制造商/设备ID（90H）...............................................................................44

27年2月11日阅读唯一的ID号（4BH）.........................................................................................45

28年2月11日读JEDEC的ID（9Fh）......................................................................................................46

29年2月11日连续读取模式复位（FFH或FFFFH）................................................................47

12，电气特性..............................................................................................48

12.1绝对最大Ratings................................................................................................48

12.2操作范围..............................................................................................................48

12.3上电时序和写抑制阈值....................................................................49

12.4直流电气Characteristics..............................................................................................50

12.5AC测量条件.............................................................................................51

12.6AC电气Characteristics..............................................................................................52

12.7AC电气特性（续）.................................................................................53

12.8串行输出Timing...........................................................................................................54

12.9输入Timing........................................................................................................................54

12.10持有Timing.......................................................................................................................54

13包装SPECIFICATION..........................................................................................................55

W25Q64BV

13.18引脚SOIC208密耳（包装代号SS）...........................................................................55

-4-

13.28引脚PDIP300密耳（封装代码DA）............................................................................56

13.38触点WSON8x6毫米（封装代码ZE）..................................................................57

13.416引脚SOIC300密耳（封装代码SF）..........................................................................58

14订货INFORMATION..........................................................................................................59

14.1有效的部件号和顶端标记........................................................................60

15版本HISTORY......................................................................................................................61

W25Q64BV

出版日期：

2010年7月8日

-5-修订版E

1概述

该W25Q64BV（64M位）串行Flash存储器提供了有限的系统存储解决方案

空间，引脚和电源。

该25Q系列提供了灵活性和性能远远超过普通的串行