DellReliabilityQualification.docx

DellReliabilityQualification.docx

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DellReliabilityQualification

DellReliabilityEngineering

QualificationProgramRequirements

For

NotebookCircuitBoards

Author:

CliffWhite

1.Purpose

ThisspecificationdefinesthereliabilityrequirementstoqualifyacircuitboardforshipmentinaDellportable/notebook/laptopcomputer.

Thisspecificationaddress:

∙Productreliabilityrequirements

∙Reliabilityrelatedengineeringanalysis&tasks

∙Productqualificationtests

∙Roles&responsibilitiesforeachanalysis,taskandqualificationtest

∙DeliverablestoDellreliabilityengineeringforverificationandapproval

2.Scope

QualificationprogramstodemonstratecompliancewiththisspecificationwillbeimplementedasaJointReliabilityQualificationProgram（JRQP）betweenDellreliabilityengineeringandtheOEM/ODM/TP’sdesignatedteamofengineeringandtestpersonnel.

Forthepurposeofthisdocument,theterm“supplier”willdefinetheappropriateDelldevelopmentpartnerteaminlieuofthephrasesOEM,ODMorTP.

Dellreliabilityengineeringreservestherighttoperiodicallyauditthesupplier’stasksanddeliverablestogainconfidenceintheproductdesignandtheexecutionofthedefinedtasks.

Sustainingandpost-RTSreliabilityauditprojectswillfollowthisprocessorasubsetthereof,basedonthechangestotheoriginalproject.

Additionalengineeringtasksandqualificationtestsmaybedefinedandassignedtomeetanyidentifieduniquereliabilityneedsofaparticularperipheral.

3.ImplementationProcess

Thenormalimplementationprocessforthesequalificationprogramsis:

1.Kickoffmeeting

∙Scheduledimmediately（withintwoweeks）aftercontractaward

∙Providesopportunityfordetaileddiscussionsofrequirements

∙IdentifiesteammembersresponsibletoimplementtheJRQP

∙Establishesthescheduleconstraints

∙Identifyopportunitiestouseexistingtestdataorreliabilitiesanalysestoreducescopeofprogram

∙Thedesigndocumentationdeliverablesdefinedinsection4.1isaprerequisiteforthismeeting

∙Mayrequiremorethanonemeetingtofullyimplementalltheexpectedtasks

2.ReliabilityProgramPlanReview

∙Scheduledwithintwo-threeweeksafterKickoffMeeting

∙SupplierteampresentstheirPeripheralReliabilityQualificationPlan（PRQP）toimplementthisqualificationprogramwhich

∙IncludesadequatedetailsofeachtaskandtestforreviewandeventualapprovalbyDellreliabilityengineering

∙Providesspecificproceduresorreferencesexistingsupplier’sproceduresforeachtaskortest.

∙Providesascheduleforeachtaskandtest

∙OnceapprovedbyDellreliabilityengineering,theapprovedPRQP:

∙Becomestheroadmapforprogramimplementation

∙IssubmittedtotheDellprogrammanagerforincorporationintotheoverallprogramplansandschedules

2.Statusreviews

∙Thequalificationprogramstatusisreportedintheregularscheduledprogramreviewsandnotinreliabilityspecificstatusmeetingsunlessrequiredbyprogramuniquecircumstances

∙Reports（deliverables）aresubmittedtoDellreliabilityengineeringaseachanalysis,taskandtestiscompleted.

∙Thesereports（deliverables）willincludeadequatecontentforavalidreviewandeventualapproval

3.FinalReviewandReport

∙AfinalreviewofthePQRPisconductedonceeachandeverydeliverablehasbeensubmittedtoDellreliabilityengineering

∙DellreliabilityengineeringwillsubmitafinalreporttotheDellprogrammanagerafterthisreview

4.ReliabilityEngineeringRequirements可靠性工程需求

4.1DesignDocumentation設計文檔

Thesupplier’sinitialtaskistoprovidecopiesofthefollowingdesigndocumentationtoDellreliabilityengineer:

∙Schematic

∙BOM

∙Drawingpackagewhichshowsphysicallocationofeachcomponentwithreferencedesignator

∙Componentspecificationsfor:

uniquesemiconductors,connectors,fansandaluminumelectrolyticcapacitors

∙Productspecificationswhichdefine:

∙Operationalandstorageenvironmentalenvironments

∙Maximumspecifiedcriticalcomponentsurfacetemperaturesforguaranteedfullperformance

∙Typicalandmaximumpowerdissipation

∙IdentificationofeachtargetedDellcomputerplatformforthisproduct

∙Photographs（softcopies）ofbothsidesoftheproductwithandwithouttheheatsinks

ThedesigndocumentationpackageisadeliverabletoDellreliabilityengineeringwhichisduebeforethefinalKickoffmeeting.

4.2PeripheralReliabilityQualificationPlan（PRQP）

周邊可靠性鑑定計劃（PRQP）

Thesupplier’staskistogenerateaperipheralreliabilityqualificationplan（PRQP）specifictothisproduct.ThisplanisakeydeliverableandaperquisitefortheReliabilityProgramReview.

ThispurposeofthisplanistodemonstratetoDellreliabilityengineeringthat:

∙TheselectedOEM/ODMteamunderstandstherequirements

∙TheOEM/ODMhasthecapability-resourcestoimplementthequalificationprogram

∙Providesthebasisforthefinalqualificationplanuponapproval

Thisscheduleforthisplan:

∙IsgeneratedbytheOEM/ODMteamaftertheKickoffmeeting

∙DeliveredtoDellreliabilityengineeringpriortotheReliabilityProgramReview

∙BecomestheplanofrecordonceapprovedbyDellreliabilityengineering

Thecontentofthisplanshall:

∙BewrittenintheOEM/ODM’sselectedformattofacilitateefficientimplementation,statusreportsandtestreports

∙Shallbestructuredtomatchtheallocation-distributionofdefinedanalyses,tasksandteststhroughouttheOEM/ODM’sresources

∙Definetheteammembersandresourcesresponsibleforimplementationofeachanalyses,taskandtest

∙Definestheprocess-procedureforeachreliabilityengineeringanalysestask

∙IdentifyeachtargetedDellcomputerplatformforthisproduct

SpecificPRQPrequirementsaredefinedinthefollowingsectionsforeachreliabilityengineeringanalyses,taskandqualificationtest.

4.3ThermalProfileTest

散熱剖面測試

Thepurposeofthistestisto:

∙Measurethesurfacetemperatureforeachcriticalcomponent

∙Measure–estimatetheambienttemperatureforeveryothercomponent

Datafromthistestisusedto:

∙Calculatecomponentfailurerates（StressBasedReliabilityPrediction（MTBF））

∙Calculatecomponentthermalstresslevels（ThermalandElectricalStressAnalysis）

∙Calculateexpectedusefullifeforlimitedlifeitems（LimitedLifeComponentIdentification&Analysis）

Thistaskisimplementedusingthefollowingsequence:

1.Thermal-couplesareattachedtothesurfaceofeachcriticalcomponent

2.TheidentityofeachcriticalcomponentisdocumentedinthePRQPandreviewedintheReliabilityProgramPlanReview

3.Thecircuitboardisthen

∙Partitionedoffintosectors（bothsidesifcomponentsareinstalledonthereverseside）

∙Andinstrumentedwiththermal-couplestomeasureambientairtemperaturesfortheremainingcomponents

4.TheinstrumentedcircuitboardisinstalledinaTestEnclosure

∙ThisTestEnclosureservestominimizeanycoolingeffectofthetestchamber’scirculationaircurrentsandartificiallycoolthetestsample

∙Thetestsampleisconnectedtotestequipmentviacablesoutside

5.Thermalmeasurementsarerecordedwhilethetestsamples（installedintheTestEnclosure）arerunningtestsoftwareforbothnominalexpecteduseandreasonableworstcasepowerdissipation

6.ThetestsoftwareusedinthistestwillbedocumentedinthePQRPandreviewedintheReliabilityProgramPlanReview

Thegeneralrequirementsforthistestare:

∙Threesamplesboardswillbeinstrumentedandtested

∙Oneofthesampleswillincludereworkedcomponents

∙ThecomponentstobereworkedwillbeselectedintheKickoffmeeting

∙Testreportswillincludephotographsofthetestsampleswiththermocouplesattached

∙Thesephotographsofthetestsamples（withthermocouplesattached）andofthetestsamplesinstalledintheTestEnclosurewillbesuppliedtoDellreliabilityengineeringpriortostartofthistestprogram

∙Testsamplesaretestedanddatacollectedformultiplevaluesofchamberairtemperature:

30°C,35°C,40°C,45°C,50°C,55°C

∙Thetestsoftwareandtestroutinesusedinthesetestsshallbe:

∙IdentifiedanddocumentedinthePRQPandreviewedintheReliabilityProgramPlanReview

∙Selectedtoloadthetestsamplestorepresentbothnormalextendeduseandexpectedreasonableworstcaseusethermalstresses

∙ThesesampleswillbeusedlaterintheThermalDesignMarginTest

ThethermaltestdatafromthistaskisaprogramdeliverableandshallbedocumentedinareportsubmittedtoDellreliabilityengineeringforreviewandapproval.

4.4Thermal&ElectricalStressAnalysis

散熱和電氣應力分析

Thepurposeofthistaskistodetermineanddocumentthethermalandelectricalstresslevelsappliedtoeachcomponent.Thisisanengineeringanalysiswhichisperformedusingsomecombinationofthefollowing:

∙Analysisofschematicsandlogicdiagramsandintendeduse

∙Measurementsofappliedelectricalstresslevels

∙Measurementsofcomponentsurfacetemperatures

∙DatafromtheThermalProfileTest

∙Analysisofcomponentspecifications

Thisstressanalysisshallestimatecomponentstresslevelsforthefollowinguseconditions:

∙Reasonableworstcasestresscondition（combinationofoperationalenvironment,computercoolingairflowandapplicationsoftware）

∙ThisstressdatawillbeusedtoverifycompliancewithDell’sderatingrequirements

∙Nominalextendeduseenvironment

∙Thisdatawillbeusedtosupporttheassumptionsinthe（StressBasedReliabilityPrediction（MTBF））

ThePRQPshallidentifytheteammemberorcontractorselectedtoperformthisreliabilityanalyses.

ThisanalysisisaprogramdeliverableandshallbedocumentedinareportsubmittedtoDellreliab