天蝎20整机柜服务器技术规范Rev05final.docx

天蝎20整机柜服务器技术规范Rev05final.docx

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天蝎20整机柜服务器技术规范Rev05final

天蝎项目整机柜服务器解决方案

天蝎2.0整机柜服务器技术规范

Revision0.5

天蝎项目组

2013/11/8

天蝎2.0整机柜服务器技术规范Revision0.5

文档版本记录

“天蝎2.0技术规格”修订记录

版本修订人时间变更内容简述

draft

阿里巴巴、XX、腾讯、中

国电信、英特尔

2012.12.30汇总原始需求

Rev0.3

阿里巴巴、XX、腾讯、中

国电信、英特尔

2013.06.28

和vendor讨论需求与部分

实现

Rev0.5

阿里巴巴、XX、腾讯、中

国电信、英特尔

2013.11.08

完善各模块定义，及硬件

相关的技术细节

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天蝎2.0整机柜服务器技术规范Revision0.5

目录................................................................................................................................................................3

一、概述........................................................................................................................................................5

二、机柜系统（RackSubsystem）...............................................................................................................6

2.1尺寸规格.........................................................................................................................................6

2.2功能分区.........................................................................................................................................6

2.3后部规格.........................................................................................................................................8

2.4顶部规格.........................................................................................................................................8

2.5底部规格.......................................................................................................................................10

2.6承重设计.......................................................................................................................................14

2.7并柜设计.......................................................................................................................................14

2.8接地方式.......................................................................................................................................16

2.9BusBar及结构位置........................................................................................................................16

2.10电源框机构设计.........................................................................................................................18

2.11RMC机构设计..............................................................................................................................23

2.12风扇机构设计.............................................................................................................................24

2.13机柜背板机构设计.....................................................................................................................25

2.14服务器节点机构设计.................................................................................................................26

2.14.1节点Tray背板机构..........................................................................................................26

2.14.2服务器定位设计..............................................................................................................28

2.14.3服务器止位设计..............................................................................................................30

2.14.4服务器固定设计..............................................................................................................32

三、网络系统（NetworkSubsystem）......................................................................................................34

四、供电系统（PowerSubsystem）..........................................................................................................34

4.1电源框（PowerShelf）......................................................................................................................34

4.2电源模块（PSU）.........................................................................................................................36

4.3主铜排（BusBar）........................................................................................................................38

4.4节点连接器（Clip）.....................................................................................................................39

五、散热系统（CoolingSubsystem）......................................................................................................40

5.1风扇窗（CoolingZone）..............................................................................................................40

5.2风扇模组（FanTray）..................................................................................................................40

5.3风扇盒（FANCage）....................................................................................................................40

5.4风扇（FAN）.................................................................................................................................41

5.5风扇背板（FB）...........................................................................................................................42

5.6控制策略.......................................................................................................................................43

六、机柜管理系统（RMCSubsystem）.....................................................................................................44

6.1系统组成.......................................................................................................................................44

6.2系统拓扑图...................................................................................................................................44

6.3管理系统功能...............................................................................................................................45

6.3.1节点监控............................................................................................................................45

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6.3.2电源监控............................................................................................................................45

6.3.3风扇监控............................................................................................................................46

6.3.4通讯接口............................................................................................................................46

6.3.5CLI规范................................................................................................................................46

6.4RMC单元........................................................................................................................................47

6.4.1尺寸....................................................................................................................................47

6.4.2配置....................................................................................................................................47

6.4.3散热....................................................................................................................................47

6.4.4与电源框连接....................................................................................................................47

6.4.5PIN功能定义.......................................................................................................................48

6.5机柜背板（RBP）..........................................................................................................................51

6.6Tray背板（TBP）...........................................................................................................................53

6.7节点信号转接板（NSTB）...........................................................................................................53

6.8电源框背板（PBP）.....................................................................................................................54

七、服务器节点（ServerNode）............................................................................................................55

7.1ServerTray（Chassis）尺寸...........................................................................................................55

7.2主板尺寸.......................................................................................................................................56

7.3Tray背板.........................................................................................................................................56

7.4面板规格.......................................................................................................................................56

7.5指示灯功能定义...........................................................................................................................57

八、环境要求..............................................................................................................................................57

8.1工作环境：

....................................................................................................................................57

8.2存储环境：

...................................................................................................................................57

九、电磁辐射..............................................................................................................................................58

十、附录......................................................................................................................................................58

10.1服务器节点配置参考.................................................................................................................58

10.2术语说明.....................................................................................................................................60

10.3RMC软件CLI规范.......................................................................................................................60

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