PCB行业缩略语.docx
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PCB行业缩略语
AA
AntennaArray
AA
AutomaticAcknowledge
ABS
Acrylonitrile-Butadiene-Styrene（Plastic）
AC
AllCall
AC
AlternatingCurrent
ACA
AnisotropicallyConductiveAdhesive
ACC
AdvancedConceptConstructionActiveControlChannel
ACCU
AlternatingCurrentConnectionUnit
AEC
Architecture,EngineeringAndConstruction
Agc
AutomaticGainControl
AGR
AnnualAverageGrowthRate
AGV
AutomatedGuidedVehicle
AI
ArtificialIntelligence
AIS
AdhesiveInterconnectSystem
ANOVA
AnalysisOfVariance
ANSI
AmericanNationalStandardsInstitute
AOI
AutomatedOpticalInspection
AOQ
AverageOutgoingQuality
APT
AutomaticallyProgrammedTools
AQL
AcceptableQualityLevel
ARINC
AeronauticalRadioIncorporated
ASCII
AmericanStandardCodeForInformationInterchange
ASIC
ApplicationSpecificIntegratedCircuit
ASME
AmericanSocietyOfMechanicalEngineers
ASPaRC
AbilityOfSolderPasteToRetainComponents
ASQ
AmericanSocietyForQuality
ASTM
AmericanSocietyForTestingAndMaterials
ATE
AutomaticTestEquipment
ATG
AutomaticTestGeneration
ATR
AirTransportRack
AVT
AcceleratedVesicationTest
AWG
AmericanWireGauge
AXI
AutomatedX-RayInspection
BC
BuriedCapacitance
BDMA
Benzyldimethylamine
BGA
BallGridArray
BITE
Built-InTestEquipment
BOD
BiochemicalOxygenDemand
BOM
BillOfMaterial
BOT
BuildToOrder
BT
BismaleimideTriazine
BTAB
BumpedTape-AutomatedBonding
C&E
CauseAndEffect
C3
Command,ControlAndCommunicate
C4
ControlledCollapseComponentConnection
CAD
Computer-AidedDesign
CAE
Computer-AidedEngineering
CAF
CathoticAnionicFilaments
CAFM
Computer-AidedFacilitiesManagement
CAGE
CommercialAndGovernmentEntity
CALS
Computer-AidedAcquisitionAndLogisticSupport（DOD）
CAM
Computer-AidedManufacturing
CAPP
Computer-AidedProcessPlanning
CAR
Computer-AidedRepair
CASE
Computer-AidedSoftwareEngineering
CAT
Computer-AidedTesting
CBGA
CeramicBallGridArray
CCAPS
CircuitCardAssemblyAndProcessingSystem
CDA
CopperDevelopmentAssociation
CEPM
CertifiedEmsProgramManagers
CET
CertifiedElectronicTechnician
CFM
ContinuousFlowManufacturing
CFM
CubicFeetPerMinute
CIM
Computer-IntegratedManufacturing
CISC
ComplexInstructionSetComputing
CITIS
ContractorIntegratedTechnicalInformationServices
CM
ContractManufacturer
CMC
CopperMolyCopper
CMOS
ComplimentaryMetal-OxideSemiconductor
CNC
ComputerNumericalControl
COB
Chip-On-Board
COD
ConsumedOxygenDemand
COT
ConfigureToOrder
Cp
CapabilityPerformance
CPL
CapabilityPerformance,Lower
CPLD
ComplexProgrammableLogicDevice
CPU
CapabilityPerformance,Upper
CPU
CentralProcessingUnit（Computer）
CRC
CyclicRedundancyCheck
CRT
Cathode-RayTube
CSA
CanadianStandardsAgency
CSG
ConstructiveSolidsGeometry
CSP
ChipScalePackage
CTE
CoefficientOfThermalExpansion
CVS
CyclicVoltammetryStripping
DAB
DesignatedAuditBody
DATC
DesignAutomationTechnicalCommittee（Ieee）
DBMS
DatabaseManagementSystem
DC
DirectCurrent
DCAS
DefenseContractAdministrationService
DCMA
DefenseContractManagementAgency
DCMC
DefenseContractManagementCommand
DESC
DefenseElectronicsSupplyCenter
DFM
DesignForManufacture
DIM
Data-InformationRecord
DIN
DeutschesInstituteForNormung
DIP
Dual-InlinePackage
Dk
DielectricConstant
DLA
DefenseLogisticsAgency（Dod）
DMA
DirectMemoryAccess
DMS
DynamicMechanicalSpectroscopy
DMSA
DefenseManufacturersAndSuppliersAssociation
DNC
Distributed（OrDirect）NumericalControl
DOD
DepartmentOfDefense
DOD
DissolvedOxygenDemand
DOE
DesignOfExperiments
DOS
DiscOperatingSystem
DRC
DesignRuleCheck
DRM
DrawingRequirementsManual
DS
Double-Sided
DSC
DifferentialScanningCalorimetry
DSP
DigitalSignalProcessor
DTP
DiameterTruePosition
DTS
DockToStock
DVM
DigitalVoltmeter
DXF
DataExchangeFormat
ECAD
ElectronicComputer-AidedDesign
ECC
ErrorCorrectionCode
ECCB
ElectronicComponentsCertificationBoard
ECL
Emitter-CoupledLogic
ECM
ElectronicCountermeasures
ECN
EngineeringChangeNotice
ECO
EngineeringChangeOrder
ECR
EngineeringChangeRequest
ED
Electrodeposited
EDA
ElectronicDesignAutomation
EDI
ElectronicDataInterchange
EDIF
ElectronicDesignInterchangeFormat
EDM
Electro-DischargeMachining
EDO
ExtendedDataOut
EIA
ElectronicsIndustryAssociation
EIS
EngineeringInformationSystem
ELD
Electro-LuminescentDiode
EMC
ElectromagneticCompatibility
EMF
Electro-MotiveForce
EMI
ElectromagneticInterference
EMP
ElectromagneticPulse
EMPF
ElectronicsManufacturingProductivityFacility
EMS
ElectricalManufacturingServices
ENEPIG
ElectrolessNickelElectrolessPalladiumImmersionGold
ENIG
ElectrolessNickelImmersionGold
ENIPIG
ElectrolessNickelImmersionPalladiumImmersionGold
EPA
EnvironmentalProtectionAgency
EPR
Ethylene-Propylene（Copolymer）Resin
EPT
Ethylene-PropyleneTerepolymer
ESD
ElectrostaticDischarge
ESI
EarlySupplierInvolvement
ESR
EquivalentSeriesResistance
ETPC
ElectrolyticTough-PitchCopper
FAA
FederalAviationAdministration
FAR
FailureAnalysisReport
FCC
FederalCommunicationsCommission
FCC
Flat-ConductorCable
FC-CBGA
FlipChipCeramicBallGridArray
FC-PBGA
FlipChipPlaticBallGridArray
FCT
FunctionalCircuitTest
FEA
Finite-ElementAnalysis
FEM
Finite-ElementModeling
FEP
FluorinatedEthylene-Propylene（Teflon）
FET
Field-EffectTransistor
FFT
FastFourierTransform
FMEA
FaultModeAndEffectAnalysis
FPGA
FieldProgrammableGateArray
FPT
Fine-PitchTechnology
FSCM
FederalStockCodeForManufacturers
FTP
FileTransferProtocol
GaAs
GalliumArsenide
GBIB
GeneralPurposeInterfaceBus
GMA
GasMetalArc（Welding）
GTA
GasTungstenArc（Welding）
GTPBGA
GlobTopPlasticBallGridArray
HASL
HotAirSolderLevel
HPGL
HewlettPackardGraphicLanguage
HTE
HighTemperatureElongation
HTML
HypertextMarkupLanguage
HTTP
HypertextTransferProtocol
I/O
Input/Output（Terminations）
IC
IntegratedCircuit
ICA
IsotropicallyConductiveAdhesive
ICAM
IntegratedComputer-AidedManufacturing
ICT
InnerCircuitTest
IDC
Insulation-DisplacementConnection
IEC
InternationalElectrotechnicalCommission
IECQ
InternationalElectronicComponentQualificationSystem
IEDR
InitialEngineeringDesignReview
IEEE
InstituteOfElectricalAndElectronicEngineers
IEPS
InternationalElectronicPackagingSociety
IGES
IntegratedGraphicsExchangeSystem
ILB
Inner-LeadBonding（Tab）
IP
InternetProtocol
IPM
InchesPerMinute
IR
Infrared
ISCET
InternationalSocietyOfCertifiedElectronicsTechnician
ISHM
InternationalSocietyForHybridMicroelectronics
ISO
InternationalOrganizationForStandardization
ITT
Inter-TestTime
JEDEC
SolidStateTechnologyAssociation（FormerlyTheJointElectronicDeviceEngineeringCouncil）
JIT
Just-In-Time（Manufacturing）
KGB
KnownGoodBoard
KGD
KnownGoodDie
LAN
LocalAreaNetwork
LBA
LogicalBlockAddress
LCCC
LeadlessCeramicChipCarrier
LCD
LiquidCrystalDisplay
LDA
LogicDesignAutomation
LED
Light-EmittingDiode
LGA
LangGridArray
LIF
LowInsertionForce
LMC
LeastMaterialCondition
LPISM
LiquidPhoto-ImageableSolderMask
LRU
LowestReplaceableUnit
LSI
LargeScaleIntegration（IntegratedCircuit）
LTCC
LowTemperatureCo-FiredCeramic
MA
MechanicalAdvantage
MAC
MaximumAllowableConcentration
MAC
MediaAccessControl
MAP
ManufacturingAutomationProtocol
MATS
MaterialTransportSegment
MCAD
MechanicalComputerAidedDesign
MCAE
MechanicalComputer-AidedEngineering
MCM
MultichipModule
MDA
Methylenedianiline
MEK
Methyl-EthylKetone
MELF
MetalElectrodeFace（DiscreteLeadlessComponent）
MIBK
Methyl-IsobutylKetone
MIR
MoistureInsulationResistance
MITI
MinistryOfInternationalTradeAndIndustry（Japan）
MLB
MultilayerBoard
MLPWB
MultilayerPrintedWiringBoard
MMC
MaximumMaterialCondition
MMIC
MonolithicMicrowaveIntegratedCircuit
MOS
Metal-OxideSemiconductor
MRP
MaterialRequirementPlanning
MRPII
ManufacturingResourcePlanning
MSDS
MaterialSafetyDataSheets
MSI
MediumScaleIntegration（IntegratedCircuit）
MTBF
MeanTimeBetweenFailures
MTTR
MeanTimeToRepair
NADCAP
NationalAerospaceAndDefenseContractorsAccreditationProcedures
NASA
NationalAeronauticsAndSpaceAdministration
NBR
NitrileButadiene-AcrylonitrileRubber
NBS
NationalBureauOfStandards
NC
NumericalControl
NDT
Non-DestructiveTesting
NECQ
NationalElectronicsComponentQualificationSystem
NEMA
NationalElectricalManufacturersAssociation
NIST
NationalInstituteForScienceAndTechnology
NMR
Normal-ModeRejection
NPI
NewProductIntroduction
NSA
NationalSecurityAgency
OA
OrganicAcid（Flux）
ODR
OscillatingDiskRheometer
OEM
OriginalEquipmentManufacturer
OFHC
Oxygen-FreeHigh-ConductivityCopper
OLB
Outer-LeadBonding（Tab）
OSHA
OccupationalSafetyHazardsAct
OSI
OpenSystemsInterconnection
OSP
OrganicSolderPreservative
P&IA
PackagingAndInterconnectingAssembly
P&IS
PackagingAndInterconnectingStructure
PBGA
PlasticBallGridArray
PB
PrintedBoard
PBX
PrivateBranchExchange
PC
PersonalComputer
PCA
PrintedCircuitAssembly
PCB
PrintedCircuitBoard
PCMCIA
PersonalComputerMemoryCardInternationalAssoc
PDES
ProductDataExchangeSpecification
PDL
PageDescriptionLanguage
PEM
PlasticElectronicModule
PGA
PinGridArray（LeadedComponentPackage）
PHIGS
Programmer'sHierarchicalInterfaceGraphicsStandard
PID
Photo-ImageableDielectric
PIP
Pin-In-PasteTechnology
PLCC
PlasticLeadedChipCarrier
PLD
ProgrammableLogicDevice
Pp
ProcessPerformance（SeeAlsoCp）
PPM
PartsPerMillion
PPO
Polypheny
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