专有名词解释LCD相关产业.docx
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专有名词解释LCD相关产业
LCD&LCM專有名詞list
“A”Start:
●ACF:
AnisotropicConductiveFilm(異方性導電膜)
●AOP:
AcfOnPcb
●AT:
ApprovalTest(承認驗證)
●ANSI:
AmericanNationalStandardInstitute(美國國家亮度標準協會)
●ASAP:
AsSoonAsPossible(愈快愈好)
●AGV:
AutoGuideVehicle(自動導引車)
●AMHS:
AutomatedMaterialHandlingSystem(材料自動處理系統)
●AVL:
ApprovalVendorList(合格供應商一覽表)
●APL:
ApprovalPartsList(合格部品材料一覽表)
●AQL:
AcceptiveQualityLimited(允收水準)
●Acetone:
丙酮
●AFS:
AccessFloorSystem(高架地板系統)
●AHS:
AirHandlingSystem(潔淨室的空調系統)
●APQP:
AdvancedProductQualityPlanning(先期產品品質規劃和管制計劃)
●ANOVA:
AnalysisofVariance(變異分析)
●ASV:
AdvancedSuper-View(高速動畫顯示技術)
●AJS:
AutoJudgmentSystem(自動判定系統)
●AHU:
recalculatingairhandlerunit(迴風單元)
AirHandingUnit(外氣空調箱)
●ALX:
AlkaliExhaust(鹼排氣)
●AEX:
AcidExhaust(酸排氣)
●AMC:
AirMathematicsContamination(空氣微分子污染)
●A/S:
AirShower
●ASV:
AdvanceSuper-V
●a-Si:
AmorphousSilicon
●AR:
Action/Request
●APR:
●ASI:
●
“B”Start:
●B/L:
BackLight(背光源)
●BM:
BlackMatrix(黑色矩陣)
●BRP:
BusinessReengineeringProcess(企業再造)
●BGA:
Ball-Gird-Array(球形封裝技術)
●BOM:
BillOfMaterial(物料清單)
●BCE:
BackChannelEtch
●BRM:
BasicRecordManagementSystem(基本情報管理)
“C”Start:
●CCD:
ChargeCoupledDevice
●COB:
ChipOnBoard
●COF:
ChipOnFilm
●COG:
ChipOnGlass
●CCFL:
ColdCathodeFluorescentLamp(冷陰極射管)
●CS:
CustomerSample(顧客樣品)
●CF:
ColorFilter(彩色濾光片)
●CR:
CommercialRelease(量產移管)
●CVD:
ChemicalVapourDeposition(化學氣相成長)
●CIP:
ContinuousImprovementProcess(工程持續改善)
●COA:
ColorfilterOnArray;
●CertificateOfAnalysis(供應商出貨檢驗報告)
●CLCA:
CloseLoopCorrectiveAction
●CCL:
CopperCladLaminat(銅箔基板)
●CP:
CapabilityofProcess(製程能力指數)
●CRM:
CustomerRelationnshipManage(客戶關係管理)
●CIM:
ComputerIntergratedManufacturing(電腦整合製造系統)
●CAR:
CorrectiveActionReport(查核改善跟催表)
●CFT:
CrossFunctionalTeam(跨功能小組)
●C/V:
Conveyer
●C/R:
CleanRoom
●CRT:
CathodeRayTube(陰極射線管)
●CGS:
CeilingGridSystems(天板)
●CDA:
CleanDryAir(高壓乾空氣)
●CAH:
ComputerRoomAirHandler(恆溫恆濕空調箱)
●CWS:
ChillingWaterSystem(冰水系統)
●CUB:
CentralUtilityBuilding(中央設施建築)
●CGS:
ContinuousGrainSilicon
●CDC:
●CAS:
“D”Start:
●DAT:
DesignApprovalTest(設計認定)
●DVI:
DigitalVideoInteractive(數位影像穿插)
●DISM:
DigitalInterfaceStandardsforMonitors
●DFP:
DigitalFlatPanelport
●DQAT:
DesignQualityApprovalTest(設計品質認定)
●DLP:
DigitalLightProcessing(數位光學處理技術)
●DCC:
DocumentControlCenter(文件管理中心)
DryCoolingCoil(乾盤管)
●DR:
DesignReview(產品設計審查)
●DPT:
DewPointTemp(露點溫度)
●DI-Water:
Delete-IonWater(去離子水)
●EAD:
●
“E”Start:
●EMS:
EquipmentManagementSystem(設備控管)
●E/S:
EngineerSample(工程樣本)
●EMI:
ElectroMagneticInterference(電磁波干擾)
●ESD:
ElectroStaticDischarge(靜電放電)
●ESC:
ElectroStaticCharge(靜電電荷)
●ESA:
ElectroStaticAttraction(靜電吸附)
●EMC:
ElectroMagneticContain(電磁相容性)
●ERP:
EnterpriseResourcePlanning(企業資源規劃)
●EL:
ElectroLuminescent(電激發光)
●EDID:
ExtendedDisplayIdentificationData(延伸顯示識別資料)
●ECN:
EngineeringChangeNotice(工程變更指示書)
●ECP:
EngineeringChangeProposal(工程變更依賴書)
●ERT:
EmergencyResponseTeam(緊急應變小組)
●EMS:
ESDMonitoringSystem(靜電氣監控系統)
●EDA:
EngineeringDataAnalysis(工程資料分析)
●
“F”Start:
●FPC:
FlexiblePrintedCircuit(軟性印刷電路)
●FET:
FieldEffectTransistor(場效電晶體)
●FI:
FinalInspection(最終檢查)
●FPD:
FlatPanelDisplay(平面顯示器)
●FIFO:
FirstInFirstOut(先進先出)
●FQC:
FinishedgoodsQualityControl
●FMEA:
FailureModeEffectAnalysis(失效模式與效應分析)
●FFU:
FanFilterUnits(濾網風車組)
●FFC:
FanFilterCasing
●FAI:
FirstArticleInspection(初物檢驗)
●FM:
FactoryMutual(工廠互助保險實驗室)
●FWS:
FineWaterSpraysystem(水霧噴水系統)
●FM:
FactoryMutual(工廠互助保險實驗室)
●FMCS:
FacilityMonitorControlSystem(廠務監控系統)
●FMS:
FacilityMonitoringSystem
●FCU:
FanCoilUnit(風車盤管機組)
●FIB:
FocusinganIonBeam(聚焦離子束顯微鏡)
●FFS:
FringeFieldSwitching
●FEA:
FiniteElementAnlysis
●FAE:
FactureApplication(產品應用)
“G”Start:
●G/A:
GateArray
●GVIF:
GigabitVideoInterFace
●GageR&R(GRR):
量具(Gage)再現性(Repeatability)與再生性
(Reproducibility)之變異總合
●GEX:
GeneralExhaust(一般排氣)
“H”Start:
●HTO:
HighTemperatureOperation(高溫動作測試)
●HAU:
HandingAssistantUnit
●HEPA:
HighEfficiencyParticulateAir(高效率濾網)
●HRM:
HumanResourceManagement(人力資源管理)
●HEX:
HeatExhaust(熱排氣)
●HVAC:
GeneralHeatingVentilationAirConditionSystem(一般空調系統)
●HP:
HomePosition
●HAR:
“I”Start:
●ITO:
IndiumTinOxide(氧化銦錫導電膜)
●I/F:
Inter-Face(界面)
●IT:
InformationTechnology(情報技術學)
●IPS:
In-Plane–Switching(橫向電場切換)
●ISO:
InternationalStandardsOrganization(國際標準組織)
●ILB:
InnerLeadBonding(內引腳接合)
●IC:
IntegratedCircuit(積體電路)
●IPQC:
In-ProcessQualityControl
●IQC:
IncomingQualityControl(進料品質管制)
●IPA:
Isopropanolalcohol(異丙醇)
●IMS:
IonMobilitySpectrometry(離子流動分析儀)
●ISP:
“J”Start:
●JIT:
JustInTime(即時管理)
●JDM:
JointDesignManagement(共同研發管理)
“K”Start:
●KPI:
KeyPerformanceIndex(關鍵績效指標)
“L”Start:
●LCM:
LiquidCrystalModule(液晶模組)
●LVDS:
LowVoltageDifferentialSignal(低電壓差動信號)
●LTO:
LowTemperatureOperation(低溫動作測試)
●LSI:
LargeScaleIntegration(超大型積體電路)
●LC:
LineController
●L/R:
LaserRepair(雷射修正)
●LP:
LeadPitch
●LCD:
LiquidCrystalDisplay(液晶顯示器)
●LTPS:
LowTemperaturePolySilica(低溫多晶矽)
●LGP:
LightGuidePanel(導光板)
●LUX:
ILLUMINATION(照明度之國際單位)
“M”Start:
●MA:
ModuleAssembly(模組組裝)
●MVA:
Multi-DomainVerticalAlignment(超級/多疇垂直排列)
●MIS:
ManagementInformationSystem(資訊管理系統)
●MOW:
ManganeseOxygenWolfram(氧化錳鎢)
●MTBF:
MeanTimeBetweenFailure(平均失效間隔時間)
●MGV:
ManualGuideVehicle(手動搬運車)
●MSA:
MeasurementSystemAnalysis(量測系統分析)
●MAU:
Make-upAirUnit(外氣空調箱)
●MSU:
MistSeparatorUnit(冷凝設備)
●MSDS:
MaterialSafetyDataSheet(物質安全資料表)
●MDL:
ManufacturingDepartmentL
●MRB:
MaterialReviewBoard
●MQC:
MonitoringQualityControl(監控品質管制)
●MCR:
MaterialConstructionResentment(原物料品質異常工程訴怨單)
●MPS:
MasterProductSchedule
●MES:
ManufacturingExecutionSystem(製造執行系統)
●MCS:
MaterialControlSystem(材料管理系統)
●MTD:
MonthToDailyvernier
●MO:
●
“N”Start:
●ND:
NeutralDensityfilter
●NB:
NoteBook
●NB:
NormallyBlack(常態黑)
●NW:
NormallyWhite(常態白)
●NTSC:
NationalTelevisionSystemCommittee(國家電視標準委員會)
●NC:
NoiseCriterion(噪音權衡基準法)
“O”Start:
●OLB:
OuterLeadBonding(外引腳接合)
●OD:
OpticalDensity(光學密度)
●ORT:
OutgoingReliabilityTest(出貨信賴性測試)
●OEM:
OriginalEquipmentManufacturer(委託代工)
●ODM:
OriginalDesignManufacture(委託設計與製造)
●OLED:
ORGANICLIGHTEMITTERDEVICE(有機電激發光二極體)
●OSD:
OnScreenDisplay(視控調整功能)
●OQC :
Out-goingQualityControl(出貨品質管制)
●OPI:
OnePieceInspection(片次檢驗)
●OPI:
Operationinterface(操作介面)
●OHS:
OverHeadSystem(高空搬運系統)
●ORP:
OxidationReductionPotential(氧化還原電位計)
●OCB:
OpticallyCompensatedBend
●ODF:
OneDropFill(液晶滴下方式)
●OM:
OpticalMicroscope(光學顯微鏡)
●OEX:
OrganicExhaust(有機排氣)
●OITS:
OperatorInterfaceTouchScreen(觸摸式操作屏)
●OCAP:
OutofControlActionPlan(異常反應計劃)
●OOC:
OutOfControl(管制外)
●OOS:
OutOfSpecification(規格外)
●OSS:
OneStopShopping(一次購足)
●OA:
OfficeAutomation(辦公室自動化)
●OP:
OppositePosition
●OHV:
●ORB:
●OI:
“P”Start:
●PCB:
PrintedCircuitBoard(印刷電路板)
●PWB:
PrintedWiringBoard(印刷電路板)
●PAT:
ProcessesApprovalTest(製程認定)
●PDAT:
ProcessDesignApprovalTest(製程設計認定)
●PDA:
PersonalDigitalAssistant(個人數位秘書)
●PEP:
PhotoEngravingProcess(寫真蝕刻工程)
●PECVD:
PhotoEngravingChemicalVapourDeposition(化學氣相沉積)
●PPM:
PartsPerMillion(百萬分之…)
●PZ:
Polarizer(偏光板)
●PE:
ProcessEngineer(製程工程師)
●PMLCD:
PassiveMatrixLCD
●PDP:
PlasmaDisplayPanel(電漿顯示器)
●PLC:
ProgrammableLogicController(可程式化邏輯控制系統)
●PNP:
Play&Plug(即插即用)
●PDCA:
Plan-Do-Check-Action(PDCA管理循環)
●PSS:
ProductSpecificationSheet(產品規格一覽表)
●PI:
Polyamide(配向膜,聚亞醘氨)
●PVA:
PatternedVerticalAlignment
●PMS:
ParticleMonitoringSystem(微粒子監控系統)
●PM:
ProjectManagement(專案管理)
●PV:
ProcessVacuumSystem(製程真空系統)
●PLV:
ProcessLowVacuumSystem(製程低真空系統)
●PAH:
PackagedAirHandingUnit(箱型空調箱)
●PHA:
PreliminaryHazardAnalysis(初步危害分析)
●PVA:
PatternedVerticalAlignment(垂直配向)
●PLM:
ProductLifeManagement(產品生命週期管理)
●PDCR:
PigmentDispersedColorResist(顏料分散型彩色光阻)
●PDM:
PigmentDispersedMethod(顏料分散法)
●PPI:
PixelPitchInch
“Q”Start:
●QAT:
QualityApprovalTest(品質認定)
●QCC:
QualityControlCircle(品管圈)
●QOS:
QualityOfService(服務品質)
●QRM:
QualityReviewMeeting(服務品質)
●QIT:
QualityImprovementTeam﹝品質改善團隊﹞
●QFD:
QualityFunctionDeployment(品質機能展開)
●QA:
QualityAssurance(品質保證)
●QC:
QualityControl(品質管制)
●QCS:
QualityControlStandard(品質管制標準)
●QE:
QualityEngineering(品質工程)
●QMP:
QualityManagementPlan(品質管制計畫)
●QNR:
QualityNon-conformanceReport(原物料品質不合格報告)
●QIS:
●QSM:
“R”Start:
●RTO:
RoomTemperatureOperation(常溫動作測試)
●RMA:
ReturnMaterialAuthorization(退貨驗收)
●RWK:
ReWorK(重工)
●RSDS:
ReducedSwingDifferentialSignaling
●RGV:
RailGuideVehicle(自動軌道導引車)
●RTM:
RotateTransferMachine(OHS~~stock)
●RM:
RiskManagement(風險管理)
●RAS:
ReturnAirSystem(迴風系統)
●RH:
RelativeHumidity(相對濕度)
“S”Start:
●SVGA:
SuperVideoGraphicsArray(800*600)
●SXGA:
SuperXtendedVideoGraphicsArray(1280*1024)
●SXGA+:
SuperXtendedVideoGraphicsArrayPLUS(1400*1050)
●Solder:
焊接(製程)
●Shock:
衝擊測試
●STN:
SuperTwistedNematic
●SPWG:
StandardPanelsWorkingGroup
●SOP:
StandardOperatingProcedure(標準作業程序)
SystemOnPanel
●SS:
SuperSpacer(間隙材)
●SD:
Sales&Distribution(銷售管理)
●SCM:
SUPPLYCHAINMANAGEMENT(供應鍊