SMT高级工程师教案测试.docx
《SMT高级工程师教案测试.docx》由会员分享,可在线阅读,更多相关《SMT高级工程师教案测试.docx(26页珍藏版)》请在冰豆网上搜索。
SMT高级工程师教案测试
SMT高级工程师教案
6
SMT测试
ATE工程师应注意及准备事项:
1.当拿到R/DCADFILES时,请在A-TEST导入时分析该被测试之TESTABILITY
2.在B-TEST导入ATE测试时,应注意版本变更之零件,规格;并分析下列资料:
名称数量
A.PCBCADFILES(NEWVER)1
B.BOM1
C.ARTWORK1
D.CIRCUIT1
E.BEARBOARD1-2
F.FUNCTIONM/B2-3
3.B-TEST后提出TESTABILITY报告.
A.列出A-TEST&B-TEST之异差
B.列出那些零件须加测试点及注意事项
C.列出治具要求之注意事项
D.列出LAYOUTTESTPAD及测试针之规格及注意事项
E.其它R/D设计须附合治具程控之要求
ATE工程师应注意及准备事项:
1.R/D在LAYOUT时之节点至少要有一测试点(TESTPAD)
2.线路途的每一测试点(TESTPAD),间距至少75MIL以上
3.手插零件不需加测试点,但如果是CONNECTOR很密之零件视需要加测试点.
4.CHIP除了空脚外,其余各脚均需加测试点.
5.如果是单面之被测试时,测试点要均匀分布于测试板.
6.如果是双面之被测试时,测试点尽量LAYOUT在焊锡面.
7.测试点附近之零件高度应小于0.255IN(视产品而定)
8.测试点周围0.018IN内不可有测试或零件
9.PCB边缘0.125IN内不可有测试点
10.测试点到另一测试点不可小于0.083IN
.125°
.125°
.125°
PCBDEIGES
.125°
0.0827
2.1mm
(82.7mil)
MINIMUNDESIRABLETESTPADPOSITIONONG
.035”
(0.83MM)
11.所有导通孔及气孔必须请PCB厂做MASK以防测试时漏气
12.定位孔之定位针之尺寸误差在+-.002IN
13.定位孔直径大于0.012IN
14.定位孔之内壁不可吃锡
15.治具之定位孔要用CNC钻孔
**測試零件CHIP,CONNECTOR為設計重點**
16.测试点不可被被绿漆盖住(测试前用放大镜检查)
17.板边至测试点约0.125IN不可有测试点.
HOLE
18.测试点直径不小于0.35/0.50in(35mil),(目前约30mil)
Solderpad
(.09mm)
.035’
SOLDERRESIST
PROBETIP
19.导通孔之中心间距要150mil以上
20.各测试点必须吃锡,但边缘不可被绿漆MASK
21.如考虑功能测试时,要在CONNECTOR最进处加测试点
22.VCC点至少5点,GND点至少10点
以上为治具部份
23.对IC或CHIP之控制地址线(如RESET,ENABLE…)不可直接接到VCC或GROUND上
4.7K
NEORCL
24.测试荡器须先除频或加JUMPER控制
10pf
VCC
25.对POWER-ONRESET在设计,要有隔离之设计
4.7K
RESET
0.1UF
VCC
VCC
4
1
4.7K
OUT
2
3
OSC
RESET
26.对振荡器如有控制ENABLE.DISABLE之产品测试会更稳,否则须加除频电路或善用JUMP亦是一
个好方法
27.对IC或CHIP之OPTION空脚要LAYOUT测试点
28.BGA零件背面之PCB不可LAYOUT零件
■元件值
ICT■短路開路
-ICBoundarySocan
-ICPattern
ICT■IC元件功能
■自動調整
ATE■組裝板功能測試
測試設備的功能及區隔
■IC保護二極體
■靜態測試
■動態測試
-ICT:
In-CircuitTester
-ATE:
AutomaticTestEquipment
-MDA:
ManufactureingDefectAnalyzer
测试步骤
完成
動態
靜態
產品
自動調整
組裝板功能測試
-ICBoundaryScan
-ICPattern
IC保護二極體
IC元件功能
元件值
短路開路
制造不良分布
高
中
低
空板不良
元件反插
元件不良
功能不良
漏件/錯件
短路/開路
測試成本
不良百分比
高
中
低
空板不良
元件反插
元件不良
功能不良
漏件/錯件
短路/開路
制造不良分布及测试成本
OKANON
TR-518
TESCON
50K美金以上
IC保護二極體
元件值
短路開路
50K美金以上
TR-518F
自動調整
組裝板功能
HP
TERADYNE
-BoundartScan
-Pattern
100K美金以上
GenRad
IC元件能
價格
產品
測試功能
测试设备的市场
测试治具
In-Line測試治具
壓合式測試治具
真空測試治具
雙面測試治具
單面測試治具
加裝”導板”(GuidingPlate)
正確選擇測試點
正確選擇測試針頭
高品質的測試針
治具制作的考虑因素
SMT制造不良问题未来趋势
開路
短路
漏件/錯件
功能不良
元件不良
元件反插
高
中
低
低
ICPattern
IC保護二極體
元件值
短路
組裝板功能
中
開路
高
SMT产品测试未来趋势
AOIEQUIPMENT
(AUTOOPTICALINSPECTION)
PerformancestandardsinSM
manpower
inspection
·Drivetoreduce
monitoringand
·Focusonprocess
Scheduledemands
Qualityand
·Lncreasedcost,
Electricalininspection
Process
shipment
assemblyor
System
Manufacturingkeeprisi
Single-sideSMTassemblyprocess
andfinerpitchpackag
·Lncreasingboarddens
accesshardertoattail
makein-circuitfixture
·Requirementtoinspec
control
coverageinspection
testableelectrically
defectclassesnot
5500-SeriesAOIsystemsfromTeradyneprovide
processmonitoringatanyprocessstep
SMTboardassembly
Lntegration/
Board
Electrical
Thru-
Pick/
Screen
Wave
Packaging
Test
Functional
Test
Process
load
hole
Reflow
Place
Print
Pre-waveinspection
·5515Bsystem
·Bottm-sidesolderjointquality
·Componentinsertion
·Solderjointquality,includingJ-leadsandliftedleads
Single-sideSMTassemblyprocess
·Componentorientation
·Componentpresenceandalignment
·5529system
Postplacementinspection
Thetypicalpost-reflowSMTprocess
Defectspectrum
AOIandICTareoftenemployedtogetheras
Complementarytools
ICT
AOI
Misorienteddevice(cap,
Tombstoned
Lifteleads
Unwettedpins
Deviceprogranmming(flash
Missingdevices
devices
Missingbypasscaps
Skewed/misplaced
Lowsolder
ROM)
MisorientedICs
Billboardeddevices
Devices(stillconnected)
diode)
Devicedefects(e.g.
cracked,IC
Wrongdevices
Shorts
Connectorpins
pins
Openpowerorparallel
Basicdevicefunction
BGAandotherhiddenpins
+Dosenotrequireafixture
Builtboards
+Easilyusedonpartially
Possiblyboardfunction
+Testscomponentfunction,and
+Directsoldering-process
+Cantesthiddenfeatures
+Appliesboardpower
feedback
AOIandICTareoftenemplpyedtogetheras
*不須測試治具
*基本零件之功能裝置
之零件
*BGA零件及其它穩藏腳位
*電氣功能測試(有LIBRARY)
*製程不良之問題
*錯件
ICT
*缺件
*墓碑效應
*零件翹腳
*短路
*LAYOUT設計不良
*零件偏移
*bypass電容
*零件外觀異常
*錫少&錫多
AOI測試之問題:
*不須上電及測試針
*靜態各種外觀材料
AOI
Complementarytools
*須製作治具及加電源
*能夠測試基板內部及穩藏之問題
*能測試零件之功能特性
容易修改
*試產機種或機種少量變更時
*迅速且即時的反應製程問題
The5539-Seriesfivecameraheaddesugn*
Structuredlightrevealsthecontoursoftheobject
Lightintensity
Measuringaverage
lnspection
Solderjoint
Good
Componentbody
underinspection
·Verticalcamera
Lnthesystem:
Inthewindowareaifthe
Comerareadslowlight
·Toplighting
Solderjointisgood
5500-Seriessystemarchitecture
VGA
HighaccuracyX-Ytable(0.001”
accuracyover18”x20”boardarea)
3/4HPDCmotors
(29in./smax.tablespeed)
Warp
Strobe
Laser*
(0.6”,0.7”or1.0”FOV)
1or5high-speedcameras
LEDstructuredlightingdome*
Boardunderinspection
Boardstops
*Patentedtechnology
Conveyors(SMEMAinterface)
Windowtypes
detectionwithsubpizellization
Locatesthebrightspotwithinthewindow(peak
Search
intensityacrossthewindow
Measurestheaverage
Presence/AbsenceAverage
Presence/AbsenceVariance
Measurestheaverage
intensityacrossthewindow
100%Variance
0%Variance
Looksforacontinuousbrighstripacrossthe
Bridge
Window,eitherverticallyorhorizontally
Thedefectdetectioncapabilityrequired
OutlineICSOIC
Passives
(0603,0402)
J-leaddevice
Dependsonthedevicepackagingemployed
Board
ComprehensivevisualorAOIsolderjoint
Inspectionrequiresviewingfromanangle
Partial
coverage
defect
Fulldefect
1.J-leaddevice
coverage
2.LiftedleadonaQFP
The5539D+AOI(automatedopticalinspection)
SystemsfromTeradyne
5539D+theoryofoperation
Lmageofacircuitboard
·Compleximagetoprocess
·Hardtoextractthekeydata
Windowapproach
·Structuredlightinghighlightsdefects
·Applysimplecriteriaatcriticalpoints
·Automaticallysimplifiesthranalysis
·Fastreliable
required
Inspectionexpamplesusingdifferentcombinations
ofwindowtypesandlighting
Lightingfromabove
Searchwindow
Componentlocation
Lightingbehindthecamera
Bridgewindows
Soldershortinspection
(圖二)
Sidelighting.(“Snakeeyes”)
Solderjointinspection
Presencewindowsmeasuringvariance
(圖一)
Lightingbehindthecamera
Presencewindow
Componentpresenceinspection
Anexampleofusingstructuredlighttoinspectfor
(圖三)
aboutthesolderjoints
·Difficulttomakeajudgement
·Usedfordefectingsolderbridges
Toplighting
·Solderjointdefectsdefected
(圖一)
(圖二)
·Lowvarianceinthewindow
·Badjoints
Sidelighting
·Highvarianceinthewindow
·Goodjoints
Sidelighting
defectsonfine-pitchQFP
Warpcompensation
Boardwarpagecausestheimagetomoveinthefield
ofviewofanangledcamers
Thebuilt-inwarpmeasurementsystemmeasuresthe
warpandautomaticallycompensatesforitduring
inspection
Warpagemeasurementtechnigue*
Boardwarpagebylookingat
2.thecamerasmeasurethe
thepositionoftheline
acrosstheboardsurface
shinesabrightline
1.angledstrobedlaser
warpage
themeasurementoftheboard
strobedonasrequiredtofreeze
boardsurfacewiththeline
camera/lightingheadoverthe
3.theXYtablemovesthe
ProgramminganAOIsystem
1.CADoutputforpickandplace
2.Creatprogramusing
packagestyle,orientation)
systems(X,Y,designator,
CDES(PCwindows3.1)
andprogramstability
verifydefectcoverage
4.PerformanceCurves
Components)
100%missing
reflowedboard(i.e.
Unpopulated,printed,
PerformanceCurvesareakeytoolforguaranteeing
programstabilityanddefectcoverage
thetargetinspectiontype(e.gforall0603passives)
1.lnspectaknowngoodboardandsavethemeasurementreadingsfor
2.lnspectaknownbad(e.gtheboardwith100%lowsolder)and
savethemeasurementreadingsforthetaretinspectiontype.
3.Plotahistogramofthegoodandbadreadings:
setautomatically
5.lfthisisnotthecase,theprogrammercanrefinetheinspection
(perhapsbymodifyingthelighting)toproduceamorestableinspection.
4.lfthetwocurvesareseparated,andthepasslevelisbetweenthetwo
curves,thenthesystemwillreliablypassgoodboardsandfailbadboards
6.Oncethelibraryisrefinedthisstepisnotalwaysrequired.
CDESlibraryfora64pinQFP
CDESLibraryDesigner-[DEMO.LEG]
FileEditViewDownloadWindowHelp
50X15
{-155.0}
Birdge
LG