W25Q64中文资料.docx
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W25Q64中文资料
W25Q64中文资料
出版日期：
2022年7月8日-1-版本E64M位与串行闪存双路和四路SPIW25Q64BV-2-目录
1，一般DESCRIPTION...............................................................................................................52。
FEATURES.......................................................................................................................................53引脚配置SOIC208-MIL............................................................................................64，焊垫配置WSON8某6-MM........................................................................................65，焊垫配置PDIP300-MIL...........................................................................................76引脚说明SOIC208密耳，PDIP300密耳和WSON8某6-MM................................7......7引脚配置SOIC300mil的............................................................................................8
8引脚SOIC封装说明300-MIL..................................................................................................88.1包装Type.....................................................................................................................98.2片选（/CS）..................................................................................................................9
8.3串行数据输入，输出和IO（DI，DO和IO0，IO1，IO2，IO3）.............................9.......8.4写保护（/WP）...............................................................................................................98.5控股（/HOLD）.....................................................................................................................98.6串行时钟（CLK）................................................................................................................99座DIAGRAM..........................................................................................................................1010功能DESCRIPTION.......................................................................................................1110.1SPIOPERATIONS.............................................................................................................1110.1.1标准SPIIntruction...................................................................................................1110.1.2双SPIIntruction..........................................................................................................1110.1.3四路SPIIntruction.........................................................................................................1110.1.4保持功能.....................................................................................................................1110.2写保护.......................................................................................................12
10.2.1写保护Feature........................................................................................................1211，控制和状态寄存器........................................................................................13
11.1状态REGISTER..........................................................................................................1311.1.1BUSY..................................................................................................................................1311.1.2写使能锁存（WEL）..................................................................................................1311.1.3块保护位（BP2，BP1，BP0）....................................................................................1311.1.4顶/底块保护（TB）...........................................................................................1311.1.5部门/块保护（SEC）................................................................................................1311.1.6状态寄存器保护（SRP，SRP0）...............................................................................1411.1.7四路启用（QE）..............................................................................................................1411.1.8状态寄存器内存保护....................................................................................16
11.2INSTRUCTIONS.................................................................................................................17
11.2.1制造商和设备标识..............................................................................17
11.2.2指令集表1........................................................................................................18W25Q64BV
11.2.3指令表2（阅读说明书）........................................................................19出版日期：
2022年7月8日-3-修订版E
11.2.4写使能（06h）..............................................................................................................2011.2.5写禁止（04h）.............................................................................................................2011.2.6读状态寄存器1（05H）和读状态寄存器2（35H）.......................................21
11.2.7写状态寄存器（01H）................................................................................................2211.2.8读取数据（03h）.................................................................................................................2311.2.9快速阅读（0Bh）.................................................................................................................2411.2.10快速读双输出（3BH）..........................................................................................0.2511.2.11快速读四路输出（6BH）..........................................................................................2611.2.12快速读双I/O（BBh）.................................................................................................2711.2.13快速读取四I/O（EBh）...............................................................................................2911.2.14八进制字读取四I/O（E3H）.....................................................................................3111.2.15页编程（02h）.........................................................................................................3311.2.16四路输入页编程（32H）......................................................................................34
11.2.17扇区擦除（20H）...........................................................................................................3511.2.1832KB的块擦除（52H）...................................................................................................3611.2.1964KB的块擦除（D8h）...................................................................................................3720年2月11日芯片擦除（C7H/60h）.....................................................................................................3821年2月11日擦除挂起（75h）........................................................................................................3922年2月11日擦除恢复（7Ah）........................................................................................................40
23年11月2日掉电（B9h）............................................................................................................4124年2月11日高性能模式（A3H）.........................................................................................4225年2月11日发布掉电或高性能模式/设备ID（ABH）...............................42
26年2月11日读制造商/设备ID（90H）...............................................................................4427年2月11日阅读唯一的ID号（4BH）.........................................................................................4528年2月11日读JEDEC的ID（9Fh）......................................................................................................4629年2月11日连续读取模式复位（FFH或FFFFH）................................................................4712，电气特性..............................................................................................48
12.1绝对最大Rating................................................................................................4812.2操作范围..............................................................................................................4812.3上电时序和写抑制阈值....................................................................49
12.4直流电气Characteritic..............................................................................................5012.5AC测量条件.............................................................................................51
12.6AC电气Characteritic..............................................................................................52
12.7AC电气特性（续）.................................................................................53
12.8串行输出Timing...........................................................................................................5412.9输入Timing........................................................................................................................5412.10持有Timing.......................................................................................................................5413包装SPECIFICATION..........................................................................................................55W25Q64BV
13.18引脚SOIC208密耳（包装代号SS）...........................................................................55-4-
13.28引脚PDIP300密耳（封装代码DA）............................................................................5613.38触点WSON8某6毫米（封装代码ZE）..................................................................5713.416引脚SOIC300密耳（封装代码SF）..........................................................................5814订货INFORMATION..........................................................................................................5914.1有效的部件号和顶端标记........................................................................60
15版本HISTORY......................................................................................................................61W25Q64BV
出版日期：
2022年7月8日-5-修订版E1概述
该W25Q64BV（64M位）串行Flah存储器提供了有限的系统存储解决方案空间，引脚和电源。
该25Q系列提供了灵活性和性能远远超过普通的串行
闪存器件。
他们是理想的阴影到RAM中的代码，直接从双路/四路SPI执行代码（某IP）和存储的语音，文本和数据。
该器件在2.7V至3.6V单电源工作电流消耗低至4毫安主动和1μA的关机。
所有器件均提供节省空间保存包。
该W25Q64BV阵列是由每256字节可编程32,768页。
最多256个字节
可以在一个时间被编程。
网页可以在16（扇区擦除）组，128组（32KB被删除块擦除），256（64KB块擦除组）或整个芯片（芯片擦除）。
该W25Q64BV有2,048可擦除扇区和128可擦除块分别。
小4KB扇区允许更大的灵活性在需要的数据和参数的存储的应用程序。
（见图2）
该W25Q64BV支持标准串行外设接口（SPI）和一个高性能
双核/四输出以及双/四I/OSPI：
串行时钟，片选，串行数据I/O0（DI），I/O1（
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