SMD专业术语中英文对照电子类知识宝典.docx
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SMD专业术语中英文对照电子类知识宝典
SMD专业术语中英文对
照电子类知识宝典
RevisedbyBLUEontheafternoonofDecember12,2020.
SMD常用术语
微组装技术:
MPT/MicroelectronicPackagingechnology
混装技术:
MixedComponentMountingTechnology
封装:
Package
贴片:
PickandPlace
拆焊:
Desoldering
再流:
Reflow
浸焊:
DipSoldering
拖焊:
Dragsoldering
印制电路:
PrintedCircuit
E卩制线路:
PrintedWiring
印制电路板:
printedcircuitboard
卬制线路板:
printedwiringboard
层压板:
laminate
覆铜薄层压板:
copper-cladlaminate
基材.:
basematerial
成品板:
productionboard
印刷:
printing
导电图形:
conductivepattern
印制组件:
printedcomponent单而印制板:
single-sidedprintedboard双而印制板:
double-sidedprintedboard多层印制板:
multilayerprintedboard电烙铁:
Iron
热风嘴:
hotairreflowingnoozle
吸锡带:
solderingwick吸锡器:
tinextractor焊后检验:
post-solderinginspection目视检验:
visualinspection机器检验:
machineinspection焊点质量:
solderingjointquality焊电缺陷:
solderingjontdefect错焊:
solderwrong漏焊:
solderskips虚焊:
pseudosoldering冷焊:
coldsoldering桥焊:
solderbridge脱焊:
opensoldering焊点剥离:
solderoff不润湿焊点:
solderingnonwetting锡珠:
solderball
拉尖:
icicle;solderprojection孔洞:
void
过热焊点:
overheatedsolderconnection
不饱和焊点:
insufficientsolderconnection
过量焊点:
excesssolderconnection
微组装技术:
NIPT/MicroelectronicPackagingechnology
混装技术:
MixedComponentMountingTechnology
封装:
Package
贴片:
PickandPlace
拆焊:
Desoldering
再流:
Reflow
浸焊:
DipSoldering
拖焊:
Dragsoldering
卬制电路:
PrintedCircuit
印制线路:
PrintedWiring
E卩制电路板:
printedcircuitboard
卬制线路板:
printedwiringboard
层压板:
laminate
覆铜薄层压板:
copper-cladlaminate
基材•:
basematerial
成品板:
productionboard
卬刷:
printing
导电图形:
conductivepattern
卬制组件:
printedcomponent单而印制板:
single-sidedprintedboard
双而印制板:
double-sidedprintedboard多层印制板:
multilayerprintedboard电烙铁:
Iron
热风嘴:
hotairreflowingnoozle
吸锡带:
solderingwick吸锡器:
tinextractor焊后检验:
post-solderinginspection目视检验:
visualinspection机器检验:
machineinspection焊点质量:
solderingjointquality焊电缺陷:
solderingjontdefect错焊:
solderwrong漏焊:
solderskips虚焊:
pseudosoldering冷焊:
coldsoldering桥焊:
solderbridge脱焊:
opensoldering焊点剥离:
solderoff不润湿焊点:
solderingnonwetting锡珠:
solderball
拉尖:
icicle;solderprojection孔洞:
void
过热焊点:
overheatedsolderconnection
不饱和焊点:
insufficientsolderconnection
过量焊点:
excesssolderconnection
助焊剂剩余:
fluxresidue
焊料裂纹:
soldercrazeing
焊角翘起:
fillet-lifting:
lift-off
Al:
Auto-Insertion自动插件
AQL:
acceptablequalitylevel允收水平
ATE:
automatictestequipment自动测试
ATM:
atmosphere气压
BG;\:
ba11gridarray球形矩阵
CCD:
chargecoupleddevice监视连接组件(摄彫机)
CLCC:
Ceramicleadlesschipcarrier陶瓷引脚载具
COB:
chip-on-board芯片直接贴附在电路板上
cps:
centipoises(黏度单位)百分之一
CSB:
chipscaleballgridarray芯片尺寸BGA
CSP:
chipscalepackage芯片尺寸构装
CTE:
coefficientofthermalexpansion热膨胀系数
DIP:
dualin-1inepackage双内线包装(泛指乎插组件)
FPT:
finepitchtechnology微间距技术
FR-4:
flame-retardantsubstrate玻璃纤维胶片(用来制作PCB材质)
IC:
integratecircuit集成电路
IR:
infra-red红外线
Kpa:
kilopascals(压力单位)
LCC:
leadlesschipcarrier引脚式芯片承载器
MCH:
multi-chipmodule多层芯片模块
MELF:
metalelectrodeface二极管
MQFP:
metalizedQFP金属四方扁平封装
NEPC0N:
NationalElectronicPackageand
ProductionConference国际电子包装及生产会议
ppm:
partspermiIlion指每百万PAD(点)有多少个不良PAD(点)
psi:
pounds/inch2磅/英寸2
PWB:
printedwiringboard电路板
QFP:
quadflatpackage四边平坦封装
SIP:
singlein-linepackage
SIR:
surfaceinsulationresistance绝缘阻抗
SMC:
SurfaceMountComponent表而黏着组件
SMD:
SurfaceMountDevice表而黏着组件
SMEMA:
SurfaceMountEquipment
ManufacturersAssociation表而黏着设备制适协会
SMT:
surfacemounttechnology表而黏着技术
SOIC:
smalloutlineintegratedcircuit
SOJ:
smallout-linej-leadedpackage
SOP:
smallout-1inepackage小外型封装
SOT:
smalloutlinetransistor晶体管
SPC:
statisticalprocesscontrol统汁过程控制
SSOP:
shrinksmalloutlinepackage收缩型小外形封装
TAB:
tapeautomaticedbonding带状自动结合
TCE:
thermalcoefficientofexpansion膨胀(因热)系数
Tg:
glasstransitiontemperature玻璃转换温度
THD:
Throughholedevice须穿过洞Z组件(贯穿孔)
TQFP:
tapequadflatpackage带状四方平坦封装
UVT:
ultraviolet紫外线
uBGAmicroBGA微小球型矩阵
cBGA:
ceramicBGA陶瓷球型矩阵
PTHlatedThruHole导通孔
IAInformationAppliance信息家电产品
MESH网目
OXIDE氧化物
FLUX助焊剂
LGA(LandGridArry)封装技术LGA封装不需植球,适合轻薄短小产品应用。
TCP(TapeCarrierPackage)
ACFAnisotropicConductiveF订m异方性导电胶膜制程
Soldermask防焊漆
Solderinglron烙铁
Solderballs锡球
SolderSplash锡渣
SolderSkips漏焊
Throughhole贯穿孔
Touchup补焊
Briding穡接(短路)
SolderWires焊锡线
SolderBars锡棒
GreenStrength未固化强度(红胶)
TransterPressure转印压力(E卩刷)
ScreenPrinting刮刀式印刷
SolderPowder锡颗粒
Wettengability润湿能力
Viscosity黏度
Solderability焊锡性
Applicability使用性
Flipchip覆晶
DepanelingMachine组装电路板切割机
So1derRecoverySystem锡料回收再使用系统
WireWelder主机板补线机
X-RayMulti-layerlnspectionSystemX-Ray孔偏检査机
BGxAOpen/ShortX-RaylnspectionMachineBGAX-Ray检测机
PrepregCopperFoilSheeterP.P.铜箔裁切机
FlexCircuitConnections软性排线焊接机
LCDReworkStation液晶就示器修护机BatteryElectroWelder电池电极焊接机PCMCIACardWelderPCMCIA卡连接器焊接LaserDiode半导体雷射
IonLasers离子雷射
Nd:
YAGLaser石溜石雷射
DPSSLasers半导体激发固态雷射
UltrafastLaserSystem超快雷射系统
MLCCEquipment枳层组件生产设备GreenTapeCaster,Coater薄帯成型机ISOStaticLaminator积层组件均压机GreenTapeCutter组件切割机ChipTerminator枳层组件端银机NfLCCTester积层电容测试机
ComponentsVisionlnspectionSystem芯片组件外观检查机