光器件封装详解Word格式文档下载.docx

光器件封装详解Word格式文档下载.docx

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构.......................................................................................................6

同轴型光发送器件的封装结

构......................................................................................7

蝶形光发送器件的封装结

构..........................................................................................7

同轴型光接收器件的封装结

构......................................................................................8

蝶形光接收器件的封装结

构..........................................................................................9

1×

9和2×

9大封装光收发一体模

块.................................................................................9

GBIC（GigabitInterfaceConverter）光收发一体模块..............................................

10

SFF（SmallFormFactor）小封装光收发一体模块...................................................

11

SFP（SmallFormFactorPluggable）小型可插拔式光收发一体模块.......................

12光收发模块的子部

件...................................................................................................122.1.12.1.22.2

2.2.12.2.22.32.3.12.3.22.3.32.3.42.3.5

3.1

3.2

3.3光接收器件的封装结

构.......................................................................................................8光收发一体模

块的封装结构................................................................................................93有源

光器件的外

壳..................................................................................................................14机械

及环境保护................................................................................................................14热传

递...............................................................................................................................14

电通

路...............................................................................................................................15

玻璃密封引脚..............................................................................................................15

单层陶瓷.....................................................................................................................15

多层陶瓷.....................................................................................................................16同轴连接

器..................................................................................................................163.3.13.3.23.3.33.3.4

3.4

3.5光通

路...............................................................................................................................17

几种封装外壳的制作工艺和电特性实

例............................................................................18

小型双列直插封装（MiniDIL）...................................................................................18

多层陶瓷蝶形封装（Multilayerceramicbutterflytypepackages）............................

19射频连接器型封

装.......................................................................................................203.5.13.5.23.5.3

4.14有源光器件的耦合和对

准........................................................................................................20耦合方

式...........................................................................................................................20

直接耦合.....................................................................................................................21

透镜耦合.....................................................................................................................22

同轴型器件的对

准.......................................................................................................22

双透镜系统的对

准.......................................................................................................23直接耦合的

对准..........................................................................................................234.1.14.1.24.24.2.14.2.24.2.3

5.1

5.2

5.3对准技

术...........................................................................................................................225有源光器件的其它组件/子装配...............................................................................................23透镜..................................................................................................................................23热电制冷器

（TEC）.........................................................................................................24底座..................................................................................................................................25

5.4

6.1

6.2

6.3

6.4激光器管芯和背光管组

件.................................................................................