AgC.docx

AgC.docx

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AgC

银石墨2-5%的银石墨触头最主要的特性是抗熔焊高可靠性，低的接触电阻，温升小，作为滑动触头使用时有自润滑性能等，典型使用在低压断路等、电抗保护开关、线路保护开关、漏电保护开关和滑环转换器等

采用烧结挤压工艺制造的银石墨触头材料，不仅致密化程度高，而且由于石墨质点呈纤维取向，更有利于在电弧作用下烧损率减少与Cu、AgNi配对使用。

途：

作为弧触最大的应用领域是低压断路器，线路保护开关，故障电流保护开关，滑动电刷以及铁道信号继电，对许多应用场合，３％重量的石墨含量即可，在苛刻通断条件下，含量可到５％量比例．

特性：

导电性能好，接触电阻低，抗熔焊性高，在短路电流下也不会熔焊，滑动性能好，但电损蚀大，灭弧能力较差，在电弧的较长时间作用下，烧损剧烈，使灭弧罩积碳，脆弱和较难焊接．

AgC触头材料性能特点及应用

材料名称

性能特点

主要应用领域

供货形式

银石墨（AgC）

用挤压法制造的AgC材料中C成纤维状分布。

由于C的脆性，使AgC成为所有触头材料中抗动熔焊性最好的材料。

而且AgC的接触电阻较低

广泛应用于保护断路器中，通常与细晶银、银镍或铜非对称配对使用

片材

AgC触头产品机械物理性能

工艺

方法

产品

形状

状态

抗拉强度

MPa

延伸率

%

密度

g/cm3

电阻率

μΩ·cm

硬度

（HV）

AgC4/Ag-MSE-T

挤压

片材

退火

/

/

8.95

2.09

43-50

AgC3/Ag-SS-T

模压

片材

退火

/

/

9.40

2.32

46-56

金相图片

AgC4/Ag-MSE-T  200X

AgC3/Ag-SS-T  100X

石墨粉镀银新工艺研究

【英文篇名】

STUDYONPROCESSOFSILVERELECTROPLATINGONGRAPHITEPOWDERS

【作者中文名】

丁国芸;夏金童;肖勇;李闯;高守磊;

【作者英文名】

DINGGuo-yun;XIAJin-tong;XIAOYong;LIChuang;GAOShou-lei（CollegeofmaterialsScienceandEngineering;Hunanuniversity;Changsha410082;China）;

【作者单位】

湖南大学材料科学与工程学院;湖南大学材料科学与工程学院湖南长沙;湖南长沙;

【文献出处】

炭素技术,CarbonTechniques,编辑部邮箱2007年05期  

期刊荣誉：

ASPT来源刊  CJFD收录刊

【关键词】

石墨粉;惰性阳极;无氧镀银;含银量;

【英文关键词】

Graphitepowders;inertiaanode;cyanide-freesilverplating;silvercontent;

【摘要】

研究了镀液中硝酸银浓度、石墨粉加入量和阴极电流密度等工艺条件对镀银石墨粉含银量和电镀效果的影响。

用扫描电镜对镀银石墨粉的微观形貌和镀覆效果进行分析,通过X射线衍射仪对镀银石墨粉高温灼烧后的剩余物进行分析测试并计算镀银石墨粉的含银量。

研究结果表明:

采用惰性电极作为电镀阳极,在化学镀预处理过的石墨粉表面可成功镀覆一层银,其含银量达76%。

【英文摘要】

TheeffectsofAgNO3concentration,theamountofgraphitepowdersandcathodeefficiencyonsilvercontentandelectroplatingeffectofthesilverelectroplatinggraphitepowderswereanalyzedindetail.Themicrostructureofsilver-platedgraphitepowderswascharacterizedandanalyzedbySEM.Theremainsofsilver-platedgraphitepowderssinteredathightemperaturewereanalyzedthroughX-raydiffractionandthesilvercontentwasobtained.Theresultsshowthatbyusinginertanodeaspositivepole,afine...

【DOI】

另外，银对石墨的润湿性不好，导致烧结后的银-石墨复合材料界面结合强度低，材料承受载荷时往往造成银和石墨之间的剥离。

制备性能优良的银-石墨复合材料的关键是改善石墨与银的润湿性，有效方法之一是在石墨粉表面镀银，然后压制烧结成银-石墨复合材料。

.

Electrolessplatingofsilverongraphitepowdersandthestudyofitsconductiveadhesive

Tongxiang,Liang（InstituteofNuclearandNewEnergyTechnology,TsinghuaUniversity）;Wenli,Guo;Yinghui,Yan;Chunhe,TangSource:

InternationalJournalofAdhesionandAdhesives,v28,n1-2,January,2008,p55-58

ISSN:

0143-7496CODEN:

IJAADK

Publisher:

ElsevierLtd

Abstract:

Inthispaper,silverplatinggraphitepowdersweredevelopedbyelectrolessplatingmethod.Thedensityofsilverplatinggraphitepowderswas2.61g/cm3andtheratioofsilverforthepowderswas25wt%.Afterbeingmixedwithepoxyresinandcuringagent,silverplatinggraphitepowdersconductiveadhesivewasobtained,withthepercolationconcentrationof28vol%.ComparedtopureAgconductiveadhesive,thenewconductiveadhesivehastheadvantageoflowcost.AdhesivesbasedonthegraphiteorAgplatinggraphitepowdersexhibitedhighertensilestrengthandlargerfailureelongationsthanpureAgconductiveadhesive.©2007ElsevierLtd.Allrightsreserved.（7refs.）

Eicontrolledterms:

  Silverplating - Adhesives - Electrolessplating - Epoxyresins - Failureanalysis - Graphite - Tensilestrength

Uncontrolledterms:

  Graphitepowders - Conductiveadhesive

ClassificationCode:

  421StrengthofBuildingMaterials;MechanicalProperties - 482.2Minerals - 539.3MetalPlating - 539.3.2ElectrolessPlating - 547.1PreciousMetals - 804.1OrganicCompounds - 815.1.1OrganicPolymers

Database:

Compendex

Developmentofnewsilverplatedgraphitepowdersusedasconductivefillers

moreoptions

Author（s）:

QuZhan-min

Source:

Electroplating&FinishingVolume:

26  Issue:

9  Pages:

14-17  Published:

September2007  

Abstract:

Afteroxidationtreatment,theflakegraphitepowderswereelectrolesslycopperplatedfollowedbyelectrolesssilverplating.Theprocessspecificationswerepresented,theinfluentialfactorswereanalyzedandthedepositperformancesweretested.Theresultsshowthatthesiliconerubberwiththeadditionofsilverplatedgraphitepowdershasthevolumeresistivityof2.0*10-4Omegaldrcmandshieldingeffectivenessof75dBinthelow-frequencyregion,anditisakindofgoodconductivefillerforelectromagneticshielding.

AccessionNumber:

9793928

DocumentType:

JournalPaper

Language:

Chinese

Treatment:

Experimental

ControlledIndexing:

electrolessdeposition;electromagneticshielding;electroplatedcoatings;graphite;oxidation;powders;silver

UncontrolledIndexing:

silverplatedgraphitepowders;conductivefillers;oxidationtreatment;flakegraphitepowders;electrolesssilverplating;siliconerubber;electromagneticshielding;resistivity0.0002ohmcm;Ag-C;C

ClassificationCodes:

A6140GStructureofpowdersandporousmaterials;A8160Corrosion,oxidation,etching,andothersurfacetreatments;A8115LDepositionfromliquidphases（meltsandsolutions）

NumericalDataIndexing:

resistivity2.0E-06ohmm

ChemicalIndexing:

AgC/ssAg/ssC/ssAgC/binAg/binC/bin;C/surC/el

AuthorAddress:

QuZhan-min;MeiwuPaperInd.Co.Ltd.,Xi'an,China

Publisher:

EditorialDepartmentofElectroplatingandFinishing,China

NumberofReferences:

4

CODEN:

DYTUEM

Electrolessplatingofsilverongraphitepowdersandthestudyofitsconductiveadhesive

LiangTongxiang

a,

GuoWenlia,YanYinghuiaandTangChunhea

aInstituteofNuclearandNewEnergyTechnology,TsinghuaUniversity,Beijing100084,China

Accepted14March2007. 

Availableonline31March2007.

Abstract

Inthispaper,silverplatinggraphitepowdersweredevelopedbyelectrolessplatingmethod.Thedensityofsilverplatinggraphitepowderswas2.61 g/cm3andtheratioofsilverforthepowderswas25 wt%.Afterbeingmixedwithepoxyresinandcuringagent,silverplatinggraphitepowdersconductiveadhesivewasobtained,withthepercolationconcentrationof28 vol%.ComparedtopureAgconductiveadhesive,thenewconductiveadhesivehastheadvantageoflowcost.AdhesivesbasedonthegraphiteorAgplatinggraphitepowdersexhibitedhighertensilestrengthandlargerfailureelongationsthanpureAgconductiveadhesive.

Keywords:

Silverplating;Graphitepowders;Conductiveadhesive

ArticleOutline

1.Introduction

2.Experimental

2.1.Sliverplating

2.2.Conductiveadhesives

3.Resultsanddiscussion

4.Summary

References

1.Introduction

Electricallyconductiveadhesivesofferanewprospectivewaytoelectricalconnectionofsurfacemountdevicecomponentstoprintedcircuitboards,becauseoftheirlowerpossiblecuringtemperature,higherflexibility,finepitchcapabilitythanthin-leadsolders[1],[2]and[3].Normally,high-performanceconductiveadhesivesweredesignedbycombiningthethermosettingresinandtheefficientelectricallyconductivefillers.Silverisusedasthemostpopularelectricallyconductivefillerduetoitssuperiorconductivity.Thesilverfillerhasonedisadvantageofhighercostthanthatofcopperandcarbonblack.Graphiteorcarbonpowderscanbeusedasconductivefillers,buttheconductivityofthiskindofadhesivesisnotsatisfactoryenough.

Now,silver-coatedflakecopper,inorganicparticlesorpolymermicro-spheresusingasthefillerforconductiveadhesiveshavebeenstudied[4],[5]and[6].Consideringvariouselectricallyconductivefillers,silver-coatedinorganicparticlesorpolymermicro-spheresaresuperiortographiteparticlesregardingtheelectricalconductivityoftheadhesives,sincetheelectricalconductivityofsilverismuchhigherthanthatofinorganicparticles.Inadditiontothehighelectricalconductivityofsilver,theapplicationofsilver-platedparticlesleadsalsototheadhesiveswithlowweightandlowcost.

Inthispaper,silverplatinggraphitepowdersweredevelopedandaconductiveadhesivewasobtainedusingthissilverplatinggraphitepowdersasthefiller.

2.Experimental

2.1.Sliverplating

Fivegramnaturalgraphitepowderswiththeaveragesizeof17 μmwereusedasrawmaterials.Thegraphitepowdersweredegreasedinovenat600 °Cfor20 min,andthenweresensitizedin20%SnCl2solutionfor5 min.Afterbeingrinsedwithdistilledwater,thepowderswereactivatedin2%AgNO3solutionfor5 min.

Thetreatedgraphitepowderswereimmersedinthereducingagentsolutionofwater,inwhichthepolyglycol,ethanolandglucose（C6H12O6）werecontained,andthenstirredfor10 min.

AgNO3（99.8%）andaqueousammonia（28–30%）wereusedforpreparationofAgsolution.TransparentAgsolutionwasfirstpreparedbydissolvingtheAgNO3（3.3 g）inthewater（180 ml）withadditionofseveraldropsoftheaqueousammonia,thenNaOH（0.6 g）wasaddedtothesolution,finallyseveraldropsofaqueousammoniawereaddeduntiltheAg（NH3）+solutionbecametransparentagain.

ThemixtureofgraphitepowdersandreducingagentsolutionwereimmersedintheAgsolutionandstirredfor30 minatroomtemperature,thepHisabout11duringcoatingprocess.Afterwashinganddrying,thesilverplatinggraphitepowderswereobtained.

ThesurfacemorphologyoftheAgplatinggraphitepowderswereobservedbyusingascanningelectronmicroscope（HitchS-3000N）,andthestructurewasanalyzedbyXRD（D/MAX-III）.

2.2.Conductiveadhesives

Inthisstudy,threekindsofconductiveadhesivesweredevelopedwithdifferentfillersinasimilaraveragesize,pureAgparticles,graphitepowdersandAgplatinggraphitefillers.Theconductiveadhesivescomprisedoffillers,epoxyresinandhardeners.Theepoxyresinusedwasadiglycidyletherofbisphenol-A,E51,fromtheChenguangResearchInstituteofChe