封装专用英语词汇.docx

1、封装专用英语词汇常见封装形式简介DIP=DualInlinePackage=双列直插封装HDIP=DualInlinePackagewithHeatSink=带散热片的双列直插封装SDIP=ShrinkDualInlinePackage=紧缩型双列直插封装SIP=SingleInlinePackage=单列直插封装HSIP=SingleInlinePackagewithHeatSink=带散热片的单列直插封装SOP=SmallOutlinePackage=小外形封装HSOP=SmallOutlinePackagewithHeatSink=带散热片的小外形封装eSOP=SmallOutlineP

2、ackagewithexposedthermalpad=载体外露于塑封体的小外形封装SSOP=ShrinkSmallOutlinePackage=紧缩型小外形封装TSSOP=ThinShrinkSmallOutlinePackage=薄体紧缩型小外形封装TQPF=ThinProfileQuadFlatPackage=薄型四边引脚扁平封装PQFP=PlasticQuadFlatPackage=方形扁平封装LQPF=LowProfileQuadPackage=薄型方形扁平封装eLQPF=LowProfileQuadFlatPackagewithexposedthermalpad=载体外露于塑封体的

3、薄型方形扁平封装DFN=DualFlatNon-leadedPackage=双面无引脚扁平封装QFN=QuadFlatNon-leadedPackage=双面无引脚扁平封装TO=Transistorpackage=晶体管封装SOT=SmallOutlineofTransistor=小外形晶体管BGA=BallGridArray=球栅阵列封装BQFP=QuadFlatPackageWithBumper=带缓冲垫的四边引脚扁平封装CAD=ComputerAidedDesign=计算机辅助设计CBGA=CeramicBallGridArray=陶瓷焊球阵列CCGA=CeramicColumnGrid

4、Array=陶瓷焊柱阵列CSP=ChipSizePackage=芯片尺寸封装DFP=DualFlatPackage=双侧引脚扁平封装DSO=DualSmallOutline=双侧引脚小外形封装3D=Three-Dimensional=三维2D=Two-Dimensional=二维FCB=FlipChipBonding=倒装焊IC=IntegratedCircuit=集成电路I/O=Input/Output=输入/输出LSI=LargeScaleIntegratedCircuit=大规模集成电路MBGA=MetalBGA=金属基板BGAMCM=MultichipModule=多芯片组件MCP=M

5、ultichipPackage=多芯片封装MEMS=MicroelectroMechanicalSystem=微电子机械系统MFP=MiniFlatPackage=微型扁平封装MSI=MediumScaleIntegration=中规模集成电路OLB=OuterLeadBonding=外引脚焊接PBGA=PlasticBGA=塑封BGAPC=PersonalComputer=个人计算机PGA=PinGridArray=针栅阵列SIP=SystemInaPackage=系统级封装SOIC=SmallOutlineIntegratedCircuit=小外形封装集成电路SOJ=SmallOutlin

6、eJ-LeadPackage=小外形J形引脚封装SOP=SmallOutlinePackage=小外形封装SOP=SystemOnaPackage=系统级封装WB=WireBonding=引线健合WLP=WaferLevelPackage=晶圆片级封装常用文件、表单、报表中英文名称清除通知单Purgenotice工程变更申请ECR(EngineeringChangeRequest)持续改善计划CIP(continuousimprovementplan)戴尔专案DellProject收据Receipt数据表Datasheet核对表Checklist文件清单Documentationcheckli

7、st设备清单Equipmentchecklist调查表，问卷Questionnaire报名表Entryform追踪记录表Trackinglog日报表Dailyreport周报表Weeklyreport月报表Monthlyreport年报表Yearlyreport年度报表Annualreport财务报表Financialreport品质报表Qualityreport生产报表Productionreport不良分析报表FAR(Failureanalysisreport)首件检查报告Firstarticleinspectionreport初步报告（或预备报告）Preliminaryreport一份更

8、新报告Anundatedreport一份总结报告Afinalreport纠正与改善措施报告(异常报告单)CAR(CorrectiveActionReport)出货检验报告OutgoingInspectionReport符合性报告（材质一致性证明）COC(CertificateofCompliance)稽核报告Auditreport品质稽核报告Qualityauditreport制程稽核报告Processauditreport5S稽核报告5Sauditreport客户稽核报告Customerauditreport供应商稽核报告Supplierauditreport年度稽核报告Annualaudi

9、treport内部稽核报告Internalauditreport外部稽核报告ExternalauditreportSPC报表(统计制程管制)Statisticalprocesscontrol工序能力指数(Cpk)Processcapabilityindex（规格)上限Upperlimit（规格）下限Lowerlimit规格上限UpperSpecificationLimit(USL)规格下限LowerSpecificationLimit(LSL)上控制限（或管制上限）UpperControlLimit(UCL)下控制限（或管制下限）LowerControlLimit(LCL)最大值Maximum

10、value平均值Averagevalue最小值Minimumvalue临界值Thresholdvalue/criticalvalueMRB单(生产异常通知报告)MaterialReviewBoardReport工艺流程图ProcessFlowDiagram物料清单（产品结构表/用料结构表）BOM(BillofMaterials)合格供应商名录AVL(ApprovedVendorList)异常报告单CAR工程规范报告通知单（工程变更通知）ECNTECN自主点检表SelfCheckList随件单（流程卡）TravelingCard(RunCard)压焊图Bondingdiagram晶圆管制卡Waf

11、erinspectioncard晶圆进料品质异常反馈单FeedbackReportforWaferIncomingQualityProblems订购单PO(PurchaseOrder)出货通知单AdvancedShipNotice送货单/交货单DO(DeliveryOrder)询价单RFQ(Requestforquotation)可靠性实验报告ReliabilityMonitorReport产品报废单PSB特采控制表CRB返工单PRB异常处理行动措施OCAP减薄：Wafer?weif?n.威化饼干、电子晶片（晶圆薄片）Grind?raind?vt.&vi.磨碎;嚼碎n.磨,碾Crack?kr?

12、k?vt.&vi.?(使)开裂,破裂n.?裂缝,缝隙Ink?i?k?n.?墨水,油墨Diedai?vt.&vi.?死亡（芯片）Dot?d?t?n.?点,小圆点Mounting?maunti?n.?装备,衬托纸Tape?teip?n.?带子；录音磁带;录像带Size?saiz?n.?大小,尺寸，尺码Thick?ik?adj.厚的，厚重的Thickness?iknis?n.?厚(度),深(度)宽(度)Position?p?zi?n?n.?方位，位置Rough?r?f?adj.?粗糙的;不平的Fine?fain?adj.?美好的,优秀的,优良的,杰出的Speedspi:d?n.?速度,速率Spark

13、sp:k?n.?火花;火星Out?aut?adv.离开某地,不在里面；(火或灯)熄灭Grindstone?raindst?un?n.?磨石、砂轮Mountmaunt?vt.&vi.?装上、配有Mounter?装配工;安装工;镶嵌工Mounting?maunti?n.?装备,衬托纸Magazine?,m?zi:n?n.?杂志,期刊，弹药库（传递料盒）Cassette?k?setn.盒式录音带；盒式录像带Inspect?inspekt?vt.检查，检验，视察Inspection?inspek?n?n.?检查，视察Card?k:d?n.?卡,卡片,名片划片：Saw?s?:?n.?锯vt.&vi.?锯

14、，往复运动Sawing?s?:i?n.?锯,锯切,锯开Film?film?n.?影片,电影（薄膜，蓝膜）Framefreim?n.?框架，骨架，构架Clean?kli:n?adj.?清洁的,干净的；纯净的Cleaner?kli:n?n.?作清洁工作的人或物Oven?v?n?n.?烤箱,炉Cassette?k?setn.?盒式录音带；盒式录像带Handlerh?ndl?n.(物品、商品)的操作者Scribe?skraib?n.抄写员,抄书吏Street?n.?大街,街道Blade?bleid?n.?刀口,刀刃,刀片Cut?k?t?vt.&vi.?切,剪,割,削Speedspi:dn.?速度,速率

15、Spindle?spindl?n.?主轴，(机器的)轴Size?saiz?n.?大小,尺寸?,尺码Cooling?ku:li?adj.?冷却(的)Kerf?k?:f?n.?锯痕,截口,切口Width?wid?n.?宽度,阔度,广度Chip?t?ip?n.?碎片、缺口Chippingt?ipi?n.?碎屑,破片Crackkr?kvt.(使)开裂,破裂n.裂缝,缝隙Missing?misi?adj.失掉的,失踪的,找不到的Diedai?vt.&vi.?死亡（芯片）Saw?s?:?n.?锯vt.&vi.?锯，往复运动Street?stri:tn.?大街,街道Film?film?n.?影片,电影（薄膜

16、，蓝膜）Framefreim?n.?框架，骨架，构架Tape?teip?n.?带子；录音磁带;录像带Bubble?b?bln.?泡,水泡,气泡mount-贴wafer-晶圆?frame-框架blade-刀片tape-膜cassette-盒子completion-完成loader-上料un-loader-出料initial-初始化open-打开air-空气pressure-压力failure-失败vacuum-真空alignment-校准ink-黑点die-芯片error-错误limit-限制cover-盖子device-产品data-数据saw-切割water-水elevator-升降机spi

17、ndle-主轴sensor-感应器wheel-轮子setup-测高rotary-旋转check-检查feed-进给?cutter-切割speed-速度height-高度new-新shift-轮班pause-暂停clean-清洗?center-中心chip-崩边?change-变换enter-确认Offcenter-偏离中心broken-破的alarm-报警上芯：Attach?t?t?vt.&vi.?贴上;系;附上Bond?b?nd?n.?连接,接合,结合vt.?使粘结,使结合Bonder?b?nd?n.联接器,接合器,粘合器Dieattachmaterialepoxy粘片胶Epoxy?ep?k

18、si?n.环氧树脂（导电胶）Material?m?ti?ri?l?n.?材料,原料Non-conductiveepoxy绝缘胶Conductive?k?nd?ktiv?adj.传导的Dispenser?dispens?n.?配药师,药剂师Nozzle?n?zl?n.?管嘴,喷嘴Rubber?r?b?n.?(合成)橡胶，橡皮Tip?tip?n.?尖端,末端Diepick-uptool吸嘴Tool?tu:l?n.?工具,用具Collect?k?lekt?vt.?收集,采集（吸嘴）Ejector?id?ekt?n.?驱逐者,放出器,排出器Pin?pin?n.针,大头针,别针LeadFrame引线框架

19、Lead?li:d?vt.&vi.?带路,领路,指引Framefreim?n.?框架，骨架，构架Magazine?,m?zi:n?n.杂志,期刊（料盒）Curing?kju?ri?n.?塑化,固化,硫化,硬化Oven?v?nn.?烤箱,炉Scrap?skr?p?n.?小片,碎片,碎屑Dent?dent?n.?凹痕,凹坑DieLift-off晶粒脱落（芯片脱落，掉芯）Skew?skju:?adj.?歪,偏,斜Misorientation?mis,?:rientei?n?n.?定向误差,取向误差Presqueezedel写胶前气压延时Postsqueezedel写胶后气压延时Squeeze?skw

20、i:z?vt.榨取,挤出n.?挤,榨,捏Eject?id?ekt?vt.&vi.?弹出,喷出,排出Delay?dilei?n.?延迟Height?hait?n.?高度,身高Level?levl?n.?水平线,水平面;水平高度Head?hed?n.?头部，领导,首脑Ejectupdelay顶针延迟Ejectupheight顶针高度Bondlevel粘片高度PickLevel捡拾芯片高度Headpickdelay粘接头拾取延迟Headbonddelay粘接头粘接延时Pickdelay捡拾芯片延时Bonddelay粘接芯片延时Index?indeks?n.?索引;标志,象征;量度Clamp?kl?m

21、p?vt.&vi.?夹紧;夹住n.?夹具Indexclampdelay步进夹转换延时Indexdelay框架步进延时Shear?i?vt.?剪羊毛,剪n.?大剪刀Test?test?n.?测验,化验,试验,检验Diesheartest推晶试验Thickness?iknis?n.?厚(度),粗Coverage?k?v?rid?n.?覆盖范围Epoxythickness&coverage导电胶厚度和覆盖率Orientation,?:rientei?n?n.?方向,目标DieOrientation芯片方向Void?v?idadj.?空的,空虚的n.?太空,宇宙空间;空隙,空处;?空虚感,失落感Epo

22、xyvoid导电胶空洞Chip?t?ip?n.?碎片Damaged?mid?vt.&vi.?损害,毁坏,加害于n.损失,损害,损毁Chipdamage芯片损伤Backside?b?ksaid?n.?臀部,屁股，背面Chipbacksidedamage芯片背面损伤Tilt?tilt?vt.&vi.?(使)倾斜Tilteddie芯片歪斜Epoxyondie芯片粘胶Crack?kr?k?vt.&vi.?(使)开裂,破裂n.?裂缝,缝隙Crackdie芯片裂缝/芯片裂痕Lift?lift?vt.&vi.?举起,抬起n.?抬,举Lifteddie翘芯片Misplace?,mispleis?vt.?把放错

23、位置Misplaceddie设置芯片NOdieonL/F空粘Insufficient?,?ns?fi?nt?adj.?不足的,不够的Insufficientepoxy导电胶不足Epoxycrack导电胶多胶Epoxycuring银浆烘烤Edge?ed?n.?边,棱,边缘Partial?p:?l?adj.?部分的,不完全的Mirror?mir?n.?镜子Missing?misi?adj.?失掉的,失踪的,找不到的Edgedie/partialdie边缘片/边沿芯片Mirrordie光片/镜子芯片Missingdie掉芯/漏芯/掉片Splashspl?vt.使(液体)溅起vi.(液体)溅落Spla

24、tter?spl?t?vt.&vi.?(使某物)溅泼Diagramdai?r?m?n.?图解,简图,图表Inksplash/inksplatter墨溅Diebondingdiagram上芯图Dieshesrtest推片实验/推晶试验Diesheartester推片试验机Dieshesrtool推片头Metalcorrosion晶粒腐蚀/芯片腐蚀Wafermappingsystem芯片分级系统System?sist?m?n.?系统;体系wafer-晶圆?die-芯片attach-粘贴glue-银胶substrate-基板?magazine-盒子inspection-检查parameter-参数m

25、anual-操作手册reset-重设enter-确定error-错误input-输入speed-速度stop-停止pressure-压力vacuum-真空sensor-传感器backside-背面pin-针statistics-统计calibration-校正bond-贴片conversion-改机thickness-厚度tilt-倾斜度shape-形状adjust-调整contact-接触cover-覆盖device-产品chip-崩边pause-暂停elevator-升降机initial-初始化alignment-校准cassette-盒子tape-膜frame-框架ring-铁圈temp

26、erature-温度rubbertip-吸嘴frametype-框架型号nozzle-点胶头writer-划胶头压焊：Wire?wai?n.?金属丝,金属线;电线,导线Bond?b?nd?n.?接合,结合vt.?使粘结,使结合Wirebond/Wiringbonding压焊/焊丝/球焊Goldwire金丝Pad?p?d?vt.?给装衬垫,加垫子n.垫,护垫Bondpad焊点、铝垫1stbond第一焊点Padsize焊点尺寸/铝垫尺寸Capillary?k?pil?ri?n.毛细管;毛细血管（劈刀）Pitch?pit?程度;强度;高度Padpitch铝垫间距/焊点间距Elongation?i:l

27、?ei?nn.延长;延长线;延伸率Breaking?breiki?n.?破坏,阻断Loadl?ud?n.?负荷;负担;工作量,负荷量BreakingLoad破断力Pull?pul?vt.&vi.拉,扯,拔Shear?i?vt.?剪羊毛,剪n.?大剪刀Wirepull/ballpull（焊丝）拉力Wireshear/ballshear（焊丝）推力Ultrasonic?,?ltr?s?nik?adj.?(声波)超声的Power?pau?n.?功力,动力,功率Force?f?:s?n.?力;力量;力气Ultrasonicpower超声功率Bondingforce压力Bondingtime时间Temp

28、erature?temp?rit?n.?温度,气温Bondingtemperature温度Ultrasonicwirebonding超声波压焊EFO打火烧球loop?lu:p?n.?圈,环,环状物Loopheight孤高Wirepulltest拉力试验Ballsheartest金球推力试验PIN1第一脚Ballheight球高Balldiameter球径Cratering?kreit?ri?n.?缩孔;陷穴（弹坑）KOHetchingtestKOH腐蚀试验BondCrateringtest压焊腐蚀试验(弹坑试验)Thermal?:m?l?adj.热的，热量的Compression?k?mpre?n?n.?挤压,压缩TCB（ThermalCompressionBond）热压焊BondingDiagram压焊图/布线图WrongBonding布线错误Incomplete,?nk?mpli:tadj.不完全的,未完成的Incompletebond焊不牢Nobonding无焊N2BOX氮气柜RTPC实时过程监控Tray?trei?n.?盘子,托盘HandingTray产品盘FBI压焊后目检FBIinsp-M/C压焊检验机Microscope?maikr?sk?up?n.?显微镜LowPowerMicros