线路板PCB专业英语词汇制造测试缺陷名等.docx

1、线路板PCB专业英语词汇制造测试缺陷名等PCB英语词汇（一）1.综合词汇Prin ted circuit印制电路Pr in ted wir ing印制线路Prin ted circuit board印制电路板Pr in ted wir ing board印制线路板Prin ted comp onent印制元件Pr in ted con tact印制接点Sin gle-sided pri nted circuit board (SSB)单面印制电路板double-sided prin tedcircuit board (SSB)双面印制电路板Multilayer prin ted circuit

2、 board (MLB)多层印制电路板Rigid prin ted circuit board刚性印制电路板Flexible pri nted circuit board挠性印制电路板Flex-rigid prin ted circuit board挠性印制电路板Build-up pri nted board积层印制板Surface lam inar circuit (SLC)表面层合电路板B2it printd board埋入凸块互连印制板ALIVH Multilayerprintd board层间全内导通多层印制板Chip on board (COB)载心片板Backpla ne背板Bar

3、e board裸板Break-away board可断拼板n terc onn ecti on互连Con ductor race line导线Substrate基底Real estate基板面Con ductor side导线面Comp onent side元件面Solder side焊接面Pri nting印制grid网格pattern图形Con ductive patter n导电图形Non- con ductive patter n非导电图形Legend字符Mark标志2.基材2.1基材的种类和结构Base material基材Lam in ate层压板Copper-clad lami

4、nate (CCL)覆铜箔层压板Prepreg预浸材料Bonding sheet/bonding layer粘结片Epoxy glass substrate环氧玻璃基板Copper-clad surface铜箔面Foil removal surface去铜箔面Len gth wise directi on纵向cross wise directi on横向Core material内层芯材2.2基材的材料A-stage res inA阶树脂B-stage resi nB阶树脂C -stage res inC阶树脂epoxy res in环氧树脂Polymer聚合物Photose nsitive

5、resin感光性树脂Thermosetti ng resin热固性树脂Thermoplastic res in热塑性树脂Adhe nsive胶粘剂Curing age nt固化剂Flame retarda nt阻燃剂opaquer遮光剂Polyester film (PET)聚酯薄膜Polyimide film (PI)聚酰亚胺薄膜Polytetrafluoetyle ne(PTFE)聚四氟乙烯Non-wove n fabric非织布/无纺布Glass fiber玻璃纤维Glass fabric玻璃布 |Warp-wise经向Weft-wise纬向Copper foil铜箔Eletrodepo

6、sited copper foil电解铜箔Rolled copper foil压延铜箔Resin coated copper foil (RCC)涂树脂铜箔2.3基材的制造Polymerize聚合Thermoplastic热塑性Thermoset热固性Clad覆箔Layup叠层amin ati ng层压Postcure后固化Curing time固化时间Resi nflow树脂流动度Resin content树脂含量PCB英语词汇（二）3设计3.1通用术语Computer-aided desig n(CAD)计算机辅助设计Computer-aided man ufacturi ng (CAM)

7、计算机辅助制造Rout ing布线Layout布图设计Comp onent den sity元件密度Arry阵列3.2形状与尺寸Con ductor导线Con ductor width导线宽度Con ductor spac ing导线间距Con ductor width/space导线宽度/间距Con ductor layer导线层Comp onent hole元件孔Moun ti ng hole安装孔Supported hole支撑孔Un supported hole非支撑孔Via导通孔Plated through hole镀通孔Blind via (hole)盲孔Buried via (h

8、ole)埋孔Buried/ bli nd via埋/盲孔Any layer inner via hole (ALIVH)任意层内部导通孔Tooli ng/ pilot hole定位孔Lan dless hole无连接盘导通孔Via-i n-pad在连接盘中导通孔Pitch节距Fine pitch精细节距3.3电气互连n terfacial conn ecti on表面间连接In terlayer conn ecti on层间连接nn erlayer conn ecti on内层连接Pad, la nd连接盘Comp onent lead3.4其他Primary side主面Secon dary

9、 side辅面Sign al layer信号层Crosstalk串扰Capacita nee电容Electromag netic in terfere nee (EMT)电磁干扰Electromag netic shieldi ng电磁屏蔽Impeda nee特性阻抗n ducta nee电感Copla narity共面性（度）Core material芯板Thin type multilayer board薄型多层板Buried and bli nd via hole mutilayer board埋/盲孔多层板Buried bump in terc onn ecti on tech no

10、logy (B2it)嵌入凸块互连技术Multichip module (MCM)多芯片模块Alig nment mark对准标记Registrati on mark对位标记Layer to layer registrati on层间重合度PCB英语词汇（三）4.制造4.1通用术语Subtractive process减成法Additive process加成法Semi-additive process半加成法Full-additive process全加成法Build up process积层法Solder mask on bare copper(SMOBC)裸铜覆阻焊工艺Tenting掩蔽

11、法 Seque ntial lam in ati on顺序层压法Wet process湿处理Panel plati ng process板面电镀法Patter n plati ng process图形电镀法Fin ishi ng最终修饰Reworki ng返工Tooli ng feature工艺标识Pan el在制板，拼板First article首板Prototype试样板End product最终产品Process flow工艺流程Process win dow工艺范围Lot size/ batch批量Job traveller工作流程单4.2照相底版制作Artwork照相底图Photot

12、ool照相底版Artwork master照相原版Work ing master工作原版Producti on master生产底版Photographic film照相底片Silver film银盐底片Diazo film重氮底片Positive正像Positive patter n正像图形Negative负像Negative patter n负像图形Photo plott ing光绘图Laser platt ing激光绘图Gerber fileGerber文件Photoplotter光绘机Laser plotter激光绘图机 Registrati on mark 定位标记4.3图形转移Pr

13、inting ink印料Etchi ng resist ink抗蚀印料Plat ing resist ink耐电镀印料Resist抗蚀剂Photo resist光致抗蚀剂Dry film photoresist干膜光致抗蚀剂Liquid photoresist液体光致抗蚀剂Positive-act ing resist正性抗蚀剂Negative-act ing resist负性抗蚀剂Plati ng resist耐电镀抗蚀剂Plated resist抗蚀镀层Perma nent resist永久性保护层Electro-deposited photoresist电沉积光致抗蚀剂Mask掩膜Sol

14、der resist 、solder mask阻焊剂Solder mask ink阻焊印料Dry film solder mask阻焊干膜Liquid photose nsitive solder resist液体光致阻焊剂Marking ink 、lege nd ink标记印料Con ductive paste导电膏Hole fili ng ink堵孔油墨Peelable solder mask ink可剥性防焊油墨Thermally curable 、heat cured热固化Ultraviolet curable (UV cured)紫外线固化Scree n pri nti ng网版印刷

15、Silk scree n丝印网版Ste ncil网版Scree nability网印能力Chase、frame网框Fabric、cloth丝网Mesh cou nt网目数Squeegee刮板PCB英语词汇（四）（续上一页）Skip pri nti ng漏印Thinner、diluent稀释剂Viscosity粘度Imagi ng成像Imagi ng tran sfer图像转移Dry film imagi ng干膜制图形Lam in ati on贴膜Wet lam in ati on湿法贴膜Exposure曝光holding time停留时间develop ing显影developer显影液an

16、 ti-foamer/ntresoluti on分辨率an ti-foam ing age消泡剂defi niti on逼真度ghost image重影halati on晕环air in clusi on夹杂气泡tack in ess粘着性post cure后固化shelf life保存期pot life/ working life适用期dip coat ing浸涂法roller coati ng辊涂法spray coat ing喷涂法curta in coat ing帘幕法laser direct imagi ng激光直接成像4.4清洗与蚀刻rinsing / rinse水洗electrol

17、ytic clea ning电解清洗alkali ne degreas ing化学除油electrolytic degreas ing电解除油overflow溢流dei oni zed water去离子水表面活性surface active age nt /surfacta nt剂surface tension表面张力wetti ng润湿wett ing age nt / wetter润湿剂tarnish污化drag in/ drag out带进/带出brushi ng / scrubb ing磨刷abrasive磨料scrubber磨刷机mecha ni cal clea ning机械清洗c

18、hemical clear ing化学清洗浮石粉/火山灰pumice powersand blast ing喷砂deburri ng去披峰/去毛刺mecha ni cal polishi ng机械抛光chemical polishi ng化学抛光electropolish ing电抛光etcha nt蚀刻剂/蚀刻液un der etch侧蚀microetch微蚀over etchi ng过腐蚀stripper剥离液bright dip浸亮4.5电镀和涂覆Plat ing镀覆electrochemistry电化学electrolyte电解质electrolytic soluti on电解液ele

19、ctrochemical corrosi on电化学腐蚀chemical corrosi on化学腐蚀oni zati on电离migrati on迁移solubility溶解度addition agent/additive添加剂brighte ning age nt/brighte ner光亮剂levelli ng age nt整平剂catalyst/catalyzer催化剂activator/activati ng age nt活化剂accelerati on age nt/accelerator增速剂chelat ing age nt/chela nt螯合剂complex络和物swell

20、i ng age nt/sweller膨松剂plasma等离子体electroplati ng电镀metal electroplat ing金属电沉积bright plat ing光亮电镀PCB英语词汇（五）（续上一页）alloy plat ing合金电镀strike plat ing冲击镀flash/flash plat ing闪镀pulse plat ing脉冲电镀rack plati ng挂镀barrel plat ing滚镀brush plat ing刷镀selective plat ing选择性电镀Auxiliary anode辅助阳极Auxiliary cathode辅助阴极Pre

21、plati ng镀前处理Postplat ing镀后处理Plati ng up电镀加厚Patter n plat ing图形电镀Panel plat ing整板电镀Copper (electro) plati ng电镀铜Tin-lead plat ing电镀锡铅Plati ng line电镀线Electroless plati ng, electroless depositi on无电电镀Immersio n plate浸镀Plated throughElectroless copperhole孔金属化plat ing化学沉铜Direct plat ing直接电镀Roughe ning粗化Ac

22、tivati ng敏化Catalyz ing催化Men tallizati on金属化Accelerati on增速Chemisorpti on化学吸附Swelli ng溶胀Hole con diti oning整孔Hole clea ning洗孔Desmear, smear去钻污Etchback凹蚀removalPlasma desmear等离子去钻污passivati on钝化acid dipp ing弱浸蚀pickli ng强浸蚀hot melt ing热熔fus ing fluid热熔液solder levelli ng焊料整平tin immersio n浸锡solder焊锡solde

23、r coat焊锡涂层flux助焊剂preflux预焊剂orga nic solderability preservatives (OSP)有机保护剂black oxidati on黑氧化brow n oxidati on棕氧化Pink ring粉红圈（环）pits麻点peeli ng起皮blister起泡ora nge peel桔皮pores针孔porosity孔隙率hard ness硬度tar nish金属变色4.6机械加工和压制drilli ng钻孔n umerical con trol (NC)数控back-up垫板entry material盖板spi ndle主轴ring / col

24、lar钻套feed rate进给速率off set钻面不匀resin smear树脂钻污foil burr铜箔毛刺break-out破出hole cou nter数孔机aser via hole激光钻孔photo via hole光致穿孔plasma via hole等离子穿孔cou nterbor ing沉头孔（埋头孔）cou nters inking锥形孔plate n热压板ope nin g/daylight开档press plate压模板bonding layer / bonding sheet粘结层kraft paper牛皮纸lamin ati on void层间空洞dent凹蚀cr

25、ease皱褶pun chi ng冲切bugle hole冷冲die冲模shear ing / cutt ing喇叭孔rout ing铣切bevell ing倒斜边chamfer倒角scori ng刻槽V cutV槽切割Sewi ng hole缝纫孔Fixture夹具In dex ing hole基准孔Tooli ng feature定位特征PCB英语词汇（六）（续上一页）5 检测5.1通用术语n specti on检验test试验as received验收态producti on board成品板test board测试板coupon附连板qualificati ontest ing鉴定试验a

26、ccepta nee tests验收试验accelerated test加速试验agi ng老化qualitycon forma neetest ing质量一致性试验 storage life贮存期specificati on规范sta ndard标准tolera nee容差/公差noncon formity不合格nonconforming item(u nit)不合格品defect缺陷sampli ngn specti on抽样检验acceptable quality level (AQL)可接收质量水平5.2外观和尺寸visualexam in ati on/visual目佥blister起泡n specti onblow hole气孔bulge凸起crack ing裂缝craz ing微裂纹burr毛刺dishdow n凹陷measli ng白斑delam in ati on分层dent / inden tati on压痕fiber exposure露纤维