半导体微电子专业词汇中英文对照.docx

1、半导体微电子专业词汇中英文对照半导体微电子专业词汇中英文对照Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Acoustic Surface Wave 声外表波Active region 有源区Active component 有源元Active device有源器件Activation 激活Activation energy 激活能Active region有源

2、放大区 A/D conversion模拟数字转换 Adhesives粘接剂Admittance 导纳Aging老化Airborne 空载Allowed band 允带allowance容限，公差Alloy-junction device 合金结器件Aluminum(Aluminum)铝Aluminum - oxide 铝氧化物Aluminum Nitride 氮化铝Aluminum passivation 钻5屯化Ambipolar双极的Ambient temperature 环境温度A M light振幅调制光，调幅光amplitude limiter 限幅器Amorphous无定形的，非晶

3、体的Amplifier功放放大器Analogue(Analog) comparator 模拟比拟器Angstrom 埃Anneal退火Anisotropic各向异性的Anode阳极Antenna 天线Aperture 孑L 径Arsenide (As)币巾Array阵列Atomic原子的Atom Clock原子钟Attenuation 衰减Audio声频Auger俄歇Automatic自动的Automotive 汽车的Availability 实用性Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation 雪崩激发Background c

4、arrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias反向偏置Ball bond球形键合Band能带Band gap能带间隙Bandwidth 带宽Bar巴条发光条Barrier 势垒Barrier layer 势垒层Barrier width势垒宽度Base基极Base contact基区接触Base stretching基区扩展效应Base transit time基区渡越时间Base transport efficiency 基区输运系数Base-width modulation 基区宽度调制Batch批次Battery 电池

5、Beam束光束电子束Bench工作台Bias偏置Bilateral switch 双向开关Binary code二进制代码Binary compound semiconductor 二元化合物半导体Bipolar双极性的Bipolar Junction Transistor (BJT)双极晶体管Bit位比特Blocking band 阻带Bodycentered体心立方Body-centred cubic structure 体立心纟吉构Boltzmann波尔兹曼Bond键、键合Bonding electron 价电子Bonding pad 键合点Boron 硼Borosilicate gla

6、ss 硼硅玻璃Bottom-up由下而上的 Boundary condition 边界条件 Bound electron 束缚电子 Bragg effect布拉格效应 Breadboard模拟板、实验板 Break down 击穿Break over 转折Brillouin 布里渊 FBrillouin zone 布里渊区Buffer缓冲器Built-in内建的Build-in electric field 内建电场Bulk体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn-in 老化Burn out 烧毁B

7、uried channel 埋沟Buried diffusion region 隐埋扩散区Bus总线Calibration校准，检定，定标、刻度，分度Capacitance 电容Capture cross section 俘获截面Capture carrier俘获载流子Carbon dioxide (CO2)二氧化碳Carrier载流子、载波Carry bit进位位Cascade 级联Case管壳Cathode 阴极Cavity腔体Center中心Ceramic陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel do

8、ping 沟道掺杂Channel shortening 沟道缩短Channel width沟道宽度Characteristic impedance 特征阻抗Charge电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemical etching化学腐蚀法Chemically-Polish 化学抛光Chemically-Mechanically Polish (CMP)化学机械抛光 Chem

9、ical vapor deposition (cvd)化学汽相淀积Chip芯片Chip yield芯片成品率Circuit 电路Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clean清洗Clock rate时钟频率Clock generator时钟发生器Clock flip-flop时钟触发器Close-loop gain 闭环增益Coating涂覆涂层Coefficient of thermal expansion 热膨胀系数Coherency相干性Collector集电极Collision 碰撞Compensated OP-AMP 补偿运

10、放Common-base/collector/emitter connection 共基极/集电极/发 射极连接Common-gate/drain/source connection 共栅/漏/源连接 Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR)共模抑制比Communication 通信Compact致密的Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体C

11、omplementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-SemiconductorField-Effect-Transistor(CMOS)互补金属氧化物半导体场效 应晶体管Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/测试/制造Component 元件Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge)导带(底)Conduction level/state 导带态

12、Conductor 导体Conductivity 电导率Configuration 结构Conlomb 库仑Constants物理常数Constant energy surface 等能面Constant-source diffusion 恒定源扩散Contact 接触Continuous wave 连续波Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Controlled 受控的Converter转换器Conveyer传输器Cooling 冷却Copper interconnection system 纟同互连系统

13、Corrosion 腐蚀Coupling 耦合Covalent共阶的Crossover 交叉Critical临界的Cross-section 横断面Crucible 堆烟Cryogenic cooling system 冷却系统Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶 格Cubic crystal system 立方晶系Current density 电流密度Curvature 曲率Current drift/drive/sharing 电流漂移/驱动/共享Current Sense电流取样Curve曲线Custom integr

14、ated circuit 定制集成电路Cut off截止Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique切克劳斯基技术Cz法直拉晶体J Dangling bonds 悬挂键Dark current 喑电流Dead time空载时间Decade十进制Decibel (dB)分贝Decode解码Deep acceptor level 深受主能级Deep donor level深施主能级Deep energy level 深能级Deep impurity level深度杂质能级Deep trap深陷阱Defeat缺陷Degener

15、ate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近彳以Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽 MOSDepletion region 耗尽区Deposi

16、ted film 淀积薄膜 Deposition process 淀积工艺 Design mles设计规那么Detector探测器Developer显影剂Diamond金刚石Die芯片复数diceDiode二极管Dielectric Constant 介电常数Dielectric isolation 介质隔离 Difference-mode input 差模输入 Differential amplifier 差分放大器 Differential capacitance 微分电容 Diffraction 衍射Diffusion 扩散Diffusion coefficient 扩散系数Diffus

17、ion constant 扩散常数 Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势4垒/ 电流/炉Digital circuit 数字电路Dimension (1)尺寸量钢维，度Diode二极管Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Directional antenna 定 向天线Discharge 放电Discrete compon

18、ent 分立元件Disorder无序的Display显示器Dissipation 耗散Dissolution 溶解Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor施主Donor exhaustion 施主耗尽Dopant掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Dose剂量Double-diffusive MOS(DMOS)双扩散 MOSDrift漂移Drift fi

19、eld漂移电场Drift mobility 迁移率Dry etching T法腐蚀Dry/wet oxidation 干/湿法氧化Dose剂量Dual-polarization双偏振，双极化Duty cycle丄作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect厄利效应Early failure早期失效Effect效应Effective mass 有效质量Electric Erase Programmable Read Only

20、 Memory(E2PROM)电可擦除只读存储器Electrode 电极Electromigration 电迁移Electron affinity 电子亲和势Electron-beam 电子束Electroluminescence 电致发光Electron gas 电子气Electron trapping center 电子俘获中心Electron Volt (eV)电子伏Electro-optical 光电的Electrostatic 静电的Element元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Emitter发射极Emitter-coup

21、led logic发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect发射极集边拥挤效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量动量EK图Enhancement mode增强型模式Enhancement MOS 增强性 MOSEnteric 低共溶的Environmental test 环境测试Epitaxial外延的Epitaxial layer 夕卜延层Epita

22、xial slice 外延片Epoxy坏氧的Equivalent circuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子 Equipment 设备Erasable Programmable ROM EPROM可搽取编程存储 器Erbium laser掺餌激光器Error function complement 余误差函数Etch刻蚀Etchant刻蚀剂Etching mask抗蚀剂掩模Excess carrier过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Expo

23、nential 指数的Extrapolation 外推法Extrinsic非本征的Extrinsic semiconductor 杂质半导体Fabry-Perot amplifier法布里珀罗放大器Face - centered 面心立方Fall time下降时间Fan-in扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快外表态Feedback 反响Fermi level费米能级Femi potentia 1 费米势Fiber optic 光纤Field effect transistor 场效应晶体管Field oxide场氧化层Figur

24、e of merit 品质因数Filter滤波器Filled band 满带Film薄膜Fine pitch细节距Flash memory闪存存储器Flat band 平带Flat pack扁平封装Flatness平整度Flexible柔性的Flicker noise闪烁变噪声Flip-chip倒装芯片Flip- flop toggle触发器翻转Floating gate 浮栅Fluoride etch氟化氢刻蚀Focal plane 焦平而Forbidden band 禁带Formulation列式，表达Forward bias正向偏置Forward blocking /conducting

25、 正向阻断/导通Free electron自由电子Frequency deviation noise 频率漂移噪声Frequency response 频率响应Function 函数Gain增益Gallium-Arsenide(GaAs)不巾化镣Gallium Nitride 氮化稼Gate门、栅、控制极Gate oxide栅氧化层Gate width 栅宽Gauss (ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生复合Geometries几何尺寸Germanium(Ge)错Gold 金Graded缓变

26、的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain晶粒Gradient 梯度Graphene石墨烯Grating 光栅Green laser绿光激光器Ground接地Grown junction 生长结Guard ring保护坏Guide wave导波 波导Gunn - effect狄氏效应Gyroscope陀螺仪Hardened device辐射加固器件Harmonics 谐波Heat diffusion 热扩散Heat sink散热器、热沉Heavy/light hole band 重/轻 空穴带Hell - effect霍尔效应H

27、ertz赫兹Heterojunction 异质结Heterojunction structure 异质 结结构Heterojunction Bipolar Transistor (HBT)异质结双极型晶体 High field property 高场特性High-performance MOS(H-MOS)高性能MOS器件High power大功率Hole空穴Homojunction 同质结Horizontal epitaxial reactor 卧式夕卜延反响器Hot carrier热载流子Hybrid integration 混合集成Illumination (1)照明照明学Image -

28、 force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion注入离子Impurity 杂质Impurity scattering 杂志散射Inch英寸Incremental resistance电阻增量(微分电阻)In-contact mask接触式掩模Index of refraction 折射率Indium 钢Indium tin oxide (ITO)锢锡氧化物Inductance 电感Induced channel 感应沟道Infrared

29、红外的Injection 注入Input power输入功率Insertion loss 插入损耗Insulator绝缘体Insulated Gate FET(IGFET)绝缘栅FETIntegrated injection logic 集成注入逻辑Integration集成、积分Integrated Circuit 集成电路Interconnection 互连Interconnection time delay 互连延H寸Interdigitated structure 交互式结构Interface 界面Interference 干预International system of union

30、s 国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter倒相器Ion离子Ion beam离子束Ion etching离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic各向同性Junction FET(JFET)结型场效应管Junction isolation 结隔离Junction spacing 结间距