1、8D制作作业规范B1SCAR回复8D制作作业规范一、目的建立SCAR回复8D之制作与文件管制作业规范。二、适用范围凡处理FCPGA客户抱怨者皆可利用8D之制作方式,回复客户。三、相关文件3-1. 客户抱怨处理作业规范四、定义8D: 8 Disciplines, 八项项目,为intel所定义回复抱怨的一般格式。SCAR:Supplier Corrective Action Request,供货商改善对策要求,为intel对供货商要求改善之正式文件。五、作业流程图如下图所示。六、内容说明6-1. 8D格式制作说明:8D格式计有八个部分,范例如附件二所示。其中若是客户有开SCAR(Supplier
2、corrective action request)文件者,对于处理上有时效的限制,如防堵计划须于收到起24小时内处理完毕,整个异常处理须于1周内完成(有关Intel SCAR写作指引详细请参考附件三)。对于一般未开SCAR之客户抱怨,处理时在线相同,若同时发生时,则需评估严重性,依照优先级排序进行处理。以下针对每个部分进行说明。6-1-1 Team Approach成立问题解决团队,解决该问题。其成员为来自与该问题有相关之领域或问题之发生单位的专家或业务执行单位。并由理级以上之人员担任Owner。6-1-2 Problem Description问题描述:问题描述需基于客户所开的SCAR及遭
3、剔退的缺点板加以分析,将问题发生的时间、发生问题的内容如Failure Mode为何?影响的广度与深度为何?受影响的料号、批号为何?发生客户是谁?缺点率等相关问题陈述的内容加以说明,明确说明真正的问题。6-2-3 Analysis & Finding分析与发现:分析相关的异常信息,确认缺点或问题的形成过程,进行问题的澄清与验证。确认问题所影响的制程范围,如回溯问题批号之生产纪录,关参数数据如管制图有无异常,L/A 检验资料有无异常。6-2-4 Containment Action防堵行动计划:防堵计划应列出防堵对策结果有效的时间点,保证异常物料发生的期间内所有的物料皆已纳入并回溯确认该异常物料
4、,以区隔正常与异常的物料。计划中应列出确保其它的板子受到的影响程度减到最低。若有重供货sorting的计划(e.g. screen, source inspection etc.),应列入在计划中。6-2-5 Root Cause真正原因分析:真正原因分析应将确认真正原因的实验或对策法列出,定出时程表及附相关数据分析之结果,作为真正原因的分析。6-2-6 Corrective Action改善对策:改善对策应包括对策执行与完成的时程表,能透过系统化的方式将真正原因加以防止,利用永久改善对策来避免再发。6-2-7 Verification效果确认:改善对策的有效性应经由数据收集作确认,资料可来自
5、制程管制的数据、出货品质保证的数据、进料品质检验数据或与问题相关的数据,利用数据加以验证改善对策的有效性。6-2-8 Prevention防止再发:经确认用于永久改善之对策以避免再发之相关具体做法,可列于此作为对策实施之有效性验证,可附数据加以证明。七、查核作业响应客户之改善对策8D文件需列入文件管制,储存于蓝图室。CQE完成8D的报告后,经客户同意结案,8D文件需附上文件签核单(如附件一),依照该流程完成文件归档。品保工程师依照客户抱怨处理作业办法进行客户抱怨相关事务的处理。汇整来自与客户相关之会议、改善小组或SCAR之改善对策,附制程改善工程师(JE)之改善报告提出off spec参考of
6、f spec 作业规范并定出稽核频率及实施期间,经CCB核准后执行改善行动(Corrective Action)。透过对策稽核,依照稽核频率进行稽核,并将稽核结果响应给CQE,CQE依照实施之效果提出评估报告,判定是否结案或转入厂内稽核系统第三类稽核继续进行改善稽核,CQE则需将稽核结果分析汇整后评估改善行动的效果,提出评估报告检讨并响应客户品质改善成果。八、核准及施行1. 核准施行程序:本项规范由品保部品保课负责制作,经行政系统核准后实施,修订时亦同。2. 保密措施2-1. 保密等级:SCAR回复8D制作作业规范的保密等级区分,属于全厂可公开讨论,但不可泄漏于厂外人员,因此属于密级资料。2-
7、2. 规范保管方法:本规范经过制订、审核、核准程序后,由蓝图室负责登录于计算机,个人仅能依特定权限于终端机查阅,而且不得打印或复制。分发给蓝图室与相关单位的规范,禁止擅自复印并列入管制文件保管。九、其它A. SCAR及客户抱怨处理文件分成两类:A类:SCAR,B类:一般客户抱怨。B.客户抱怨分三种等级:A:SCAR抱怨、B:一般异常抱怨、C:偶发性异常抱怨。 十、附件附件一:SCAR 履 历 表 编号: .8D文件名称:客户抱怨处理纪录表 制订单位制订日期制作人审核会签品保部分发品质工程课核准90单位制作单位使用单位CTQ20CTQ20CTQ20客户名称: Intel影响料号: 抱怨内容:FC
8、PGA板边铜burr客户文件编号:文件分类:A (SCAR)客户抱怨等级:风险评估: LOW有无退货板:退货数量: units其它说明:1.客户抱怨内容说明摘要:-发生时间:-问题描述:-真正原因:-防堵措施计 项。-改善对策计 项。-结案时间:2.响应客户对策内容:(请条列AR内容、负责单位、预计完成时间)文件流程:制定单位制定单位主管审核90,品质工程课会签Q00核准90单位及使用单位存盘管理。本文件保存于蓝图室至履历表废止或变更。附件二:回复客户抱怨的8D范例:COMPEQ MANUFACTURING CO., LTD.PO Box 100 Tayuan, Taiwan, R.O.C.
9、33803Telephone: (886 3) 386-3000Facsimile: (886 3) 385-7711EIGHT DISCIPLINE WORKSHEET Rev.: _The supplier must submit the corrective action response in the 8-D format specified below. Note that the sections are due at different intervals.Serial #Open datePart NumberA1219105/05/00Defect DescriptionFo
10、reign material in sealed moisture bags and substrateRequesterChristopher Chun YeeClose dateSupplierCompeq Manufacturing. Co., Ltd.Supplier Contact Roger Chen (ext.: 5322)Discipline 1: TEAM APPROACH1. CT plant manager: Jerry Kuo.2. Owner: K. C. Tseng.3. Member: Ken Lee, Roger Chen, Samuel Peng, Shine
11、r Huang, Jason Lin.4. Customer: n/aDiscipline 2: PROBLEM DESCRIPTIONFailure mode: Foreign Material in the sealed moisture bags and on substrate.Date issue detected: WW19.5.Affected SLI Lot: SLI# CT017.619CT018.756. Affected Customer site: KM1-116K, PG-TBD, CV1-TBD, CR-n/aDefect rate: 100% Discipline
12、 3: ANALYSIS FINDINGS1. Inspected 100 white plastic covers and white color FM (as large as 4mm in length) was found falling off from the boards (refer to picture below). The “FM” is found to be the flakes of white plastic cover materials which was created during the cutting process. 2. Inventory sta
13、tus: (update WW20.1)Total Defective Materials: 5,000 unclean boards.Defective materials shipped to customer: 2,900 boards.Compeq inventory: 92k packed WIP 2,100 boardsDiscipline 4: COTAINMENT ACTIONContainment ActionOwnerECDStatus1Determine cleaning method2Screen & clean in-house materials- Packed u
14、nits (92k)- White plastic cover (2100 boards) ww20.5Done3Plastic cover materials supplier containment4Add air cleaning process prior to packing5Sent local rep to arrange containment support in Intel factoryDiscipline 5: ROOT CAUSEThe “FM” is found to be the flakes of white plastic cover materials. T
15、he result of investigation showed the plastic cover supplier had a process excursion where the steam air cleaner (after the cutting process) was out of order at April 8. The plastic cover with uncompleted process was shipped to Compeq without notification. Also, there is no IQC system in-place Compe
16、q to check on this plastic cover. Experiment OwnerECDStatus123 Discipline 6: CORRECTIVE ACTIONCorrective ActionOwnerECDStatus1Add plastic cover in IQC listww19.52Inspect plastic cover prior to packing31. Add plastic cover checking item in the packaging process, implemented by WW19.5.2. Add plastic c
17、over checking item in Compeq material IQC system. ECD: WW20.5.Discipline 7: VERIFICATIONData CollectedSample SizeResults1Out-going packaging check prior to shipping 153 k (100%) 0 FM2I1. 153k units, shipping at WW19.6 and WW20.1, were checked without defect found.2. Supplier corrective action verifi
18、cation: (update WW20.1)The new coming 3,000 units were checked with no white FM in side.Discipline 8: PREVENTION1.The first step, utilizing IQC system to monitor the raw material.2. The second step, using the revised packaging process to detect the nonconforming units.附件三:INTEL SCAR 写作指引SUPPLIER COR
19、RECTIVE ACTION REQUEST (SCAR) INSTRUCTIONSThe Supplier Corrective Action Request form is intended to be in response to failures related to any aspect of supplier performance, including but not limited to product delivery or performance and the suppliers management system performance. Its main object
20、ive is to systematically document efforts by the supplier to accomplish the following things either in advance of or following the occurrence of a problem.Recover the commitment or schedule for the item effected.Contain the problem by identifying the other items effected by the problem and putting i
21、n place plans maintaining their original commitments or performance.Systematically develop a Root Cause System Fix for the problem such that the suppliers system will not allow the problem to reoccur.Follow up on corrective actions with permanent Specification and/or Contract Change Notices that bri
22、ng expectations into alignment.SCAR PROCESS1. Intel Procedures:1.1 When a problem occurs the Intel Material Quality Engineer (MQE) or Commodity Specialist (CS) will initiate a Supplier Corrective Action Request (SCAR) for the commodity team. 1.2 The Intel MQE/CS will document the details regarding t
23、he discrepant material, attach supporting documentation, and forward the SCAR to the supplier using the Intel SCAR tool.1.3 The SCAR package will then be electronically mailed to the supplier with copies sent to the appropriate Intel personnel and the Suppliers customer management team. 1.4 The supp
24、lier will acknowledge receipt of the SCAR and will include in the acknowledgment commit dates for delivery to Intel of the Containment Plan and the Root Cause/Corrective Action Plan.2. Supplier Acknowledgment response:2.1. The supplier should acknowledge the SCAR within 24 hours of receipt of the do
25、cument.3. Supplier Recovery and Containment analysis and plan:3.1 The analysis and plan must be received from the supplier within the time required by the Intel commodity team in those cases where current or future units or shipments can be affected. 3.2 In the case of a post mortem type of situatio
26、n where the SCAR is issued after the fact, the supplier recovery and containment activities can be documented with the Root Cause response.4. Supplier Root Cause/Corrective Action Plan:4.1 The plan must be delivered supplier within the time required by the Intel commodity team from the receipt of th
27、e SCAR. 4.2 If an extension is needed, the supplier must notify the Intel Commodity Manager in advance of the required period and still respond within the required period4.3 Extensions must be accompanied by the following: Preliminary root cause/corrective action Schedule for completion of the final
28、 root cause/corrective action New date at which time the final root cause and corrective action plan will be documented to the Intel MQE/CS.4.4 The supplier must include the following with the root cause/corrective action response: Supporting documentation (e.g. process flow chart changes, specifica
29、tion drafts, revised documentation, etc.) to verify the approach taken and document the changes made such that Intel will have a complete understanding of the problem and actions. Supporting or implementation data that verifies the effectiveness of the system fix.5. If there are any recommended corr
30、ective actions to be taken by Intel as a result of the root cause/corrective action by the supplier, they should be noted by the supplier in their report and they will be taken into consideration by the appropriate commodity team.6. If the supplier corrective action is acceptable, the SCAR will be closed.7. Contested SCARs7.1 If the supplier corrective action does not meet Intels requirements, a formal communication shall be sent to the suppliers management indicating that the SCAR response is unsatisfactory. 7.2 The supplier must then resubmit a revised corrective action plan to arrive
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