工厂英语缩写.docx

1、工厂英语缩写制造业中常用的英文缩写QSA：Quality System Audit 品质系统稽核 SQE（供应商管理）用的比较多QPA:Quality Process Audit 品质制程稽核GR&R：Gauge repeatability &Reproducibility评价重复性和再现性，是MSA的一种常用方法MSA（MeasurementSystemAnalysis）使用数理统计和图表的方法对测量系统的分辨率和误差进行分析，以评估测量系统的分辨率和误差对于被测量的参数来说是否合适，并确定测量系统误差的主要成分。品质人员名称类QC quality control 品质管理人员FQC fin

2、al quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理 PQC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人

3、员品质保证类FAI first article inspection 新品首件检查 FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准 SS Sample size 抽样检验样本大

4、小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的 QRS QualityReliabilityService 品质可靠度服务PN Part Number 料号LN Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一 制程统计品管专类SPC Statistical Process Control 统计制程管制S

5、QC Statistical Quality Control 统计质量管理 GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径 N Number 样品数其它品质术语类 QIT Quality Improvement Team 品质改善小组 ZD Zero Defect 零缺点QI Quality Improvement 品质改善 QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理 RMA Return

6、 Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering *ge Notice 工程变更通知(供货商)ECO Engineering *ge Order 工程改动要求(客户) PCN Process *ge Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序- SOP Standard Operation Procedure 制造作业规范 IS Inspection

7、Specification 成品检验规范 BOM Bill Of Material 物料清单 S Package Specification 包装规范 SPEC Specification 规格 DWG Drawing 图面 系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准 ISO International Standard Organization 国际标准化组织 GS General Specification 一般规格部类 PMC Production & Material Control

8、生产和物料控制 PCC Product control center 生产管制中心 PPC Production Plan Control 生产计划控制MC Material Control 物料控制 DC Document Center 资料中心QE Quality Engineering 品质工程(部) QA Quality Assurance 品质保证(处) QC Quality Control 质量管理(课) PD Product Department 生产部 LAB Laboratory 实验室 IE Industrial Engineering 工业工程 R&D Research

9、& Design 设计开发部 生产类 PCs Pieces 个(根,块等) PRS Pairs 双(对等) CTN Carton 卡通箱 PAL Palletskid 栈板 PO Purchasing Order 采购订单 MO Manufacture Order 生产单 DC Date Code 生产日期码 IDC Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求LN Lot Number 批号 PN Part Number 料号 OEM Original Equipment Manufacture 原设备制造 PC Pe

10、rsonal Computer 个人计算机 CPU Central Processing Unit 中央处理器 A.S.A.P As Soon As Possible 尽可能快的 E-MAIL Electrical-Mail 电子邮件NA Not Applicable 不适用 QTY Quantity 数量 IO inputoutput 输入输出 NG Not Good 不行,不合格 C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认 ASSY Assembly 装配,组装 TP True Position 真位度 5WIH When,

11、Where, Who, What, Why, How to 6M Man, Machine, Material, Method, Measurement, Message 4M1H Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证 QA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assuran

12、ce 销售及服务品质保证 LRR Lot Reject Rate 批退率 DVD Digital Video DiskVCD Video Compact Disk LCD Liquid Crystal Display CAD Computer Aided Design CAM Computer Aided Manufacturing CAE Computer Aided Engineering PCB Printed Circuit Board 印刷电路板 CAR Correction Action Report 改善报告NG Not Good 不良 WDR Weekly Delivery R

13、equirement 周出货要求 PPM Percent Per Million 百万分之一 TPM Total Production Maintenance 全面生产保养 MRP Material Requirement Planning 物料需计划OS Operation System 操作系统 TBA To Be Assured 待定,定缺 DC Drawing *ge PP Plans & Procedure EMI Electrical-Music Industry 电子音乐工业 Electrical Magnetic Interference 电子干扰RFI Read Freque

14、ncy Input 读频输入MMC Maximum Material Condition MMS Maximum Material Size XsLMC Least Material ConditionLMS Least Material Size Um LED lighting-emitting diode 发光二极管QBR Quarter Business Record CIP Continuous improvement process FGI Forecasted Goal Inventory CNC Computerized numeral controller B2C Busine

15、ss to customer B2B Business to business AVL Approved vendor list OP Procedure of packaging EOL End of life VDCS Vender defect correcting sheet PDCS Process defect correcting sheet GRN Goods receiving note AR Accounting receivable AP Accounting payable 部门名称的专有名词QS :Quality system品质系统CS: Coutomer Sevi

16、ce 客户服务QC: Quality control品质管理IQC: Incoming quality control 进料检验LQC: Line Quality Control 生产线品质控制IPQC: In process quality control 制程检验FQC: Final quality control 最终检验OQC: Outgoing quality control 出货检验QA: Quality assurance 品质保证SQA: Source(supplier) Quality Assurance 供应商品质保证(VQA)CQA：Customer Quality As

17、surance客户质量保证PQA: Process Quality Assurance 制程品质保证QE: Quality engineer 品质工程CE: component engineering零件工程EE: equipment engineering设备工程ME: manufacturing engineering制造工程TE: testing engineering测试工程PPE: Product Engineer 产品工程IE: Industrial engineer 工业工程ADM: Administration Department行政部RMA:客户退回维修CSDI:检修PC:

18、 producing control生管MC: mater control物管GAD: General Affairs Dept总务部AD: Accountant Finance Dept会计LAB: Laboratory实验室DOE:实验设计HR:人资PMC:企划RD:研发WH:仓库SI:客验PD: Product Department生产部PA:采购(PUR: Purchasing Dept)SMT:Surface mount technology 表面粘着技术MFG:Manufacturing 制造MIS:Management information system 资迅管理系统DCC:d

19、ocument control center 文件管制中心厂内作业中的专有名词QT:Quality target品质目标QP:Quality policy目标方针QI:Quality improvement品质改善CRITICAL DEFECT:严重缺点（CR）MAJOR DEFECT:主要缺点（MA）MINOR DEFECT:次要缺点（MI）MAX: Maximum最大值MIN: Minimum最小值DIA: Diameter直径DIM: Dimension尺寸LCL: Lower control limit管制下限UCL: Upper control limit管制上限EMI:电磁干扰ES

20、D:静电防护EPA:静电保护区域ECN:工程变更ECO: Engineering change order工程改动要求（客户）ECR:工程变更需求单CPI: Continuous Process Improvement 连续工序改善DWG: Drawing图面ZD: Zero defect零缺点BOM:Bill of material物料清单CPU: central processing unit(中央处理器)IC: Integrated circuit(集成电路)Memory IC: Memory Integrated circuit（记忆集成电路）RAM: Random Access Me

21、mory（随机存取存储器）DRAM: Dynamic Random Access Memory（动态随机存取存储器）SRAM: Staic Random Access Memory（静态随机存储器）ROM: Read-only Memory（只读存储器）EPROM:Electrical Programmable Read-only Memory（电可抹只读存诸器）EEPROM: Electrical Erasbale Programmable Read-only Memory（电可抹可编程只读存储器）CMOS: Complementary Metal-Oxide-Semiconductor（互

22、补金属氧化物半导体）BIOS: Basic Input Output System（基本输入输出系统）LED:发光二极体ID：identification识别,鉴别,证明PILOT RUN: (试投产)FAI:首件检查FPIR：First Piece Inspection Report首件检查报告FAA:首件确认SPC：统计制程管制CP: capability index（准确度）CPK: capability index of process(制程能力)PMP:制程管理计划（生产管制计划）MPI:制程分析DAS: Defects Analysis System 缺陷分析系统PPB：十亿分之一

23、Flux：助焊剂PN:料号LN：Lot Number批号Version：版本Quantity：数量Valid date：有效日期MIL-STD：Military-Standard军用标准ICT: In Circuit Test (线路测试)ATE：Automatic Test Equipment自动测试设备MO: Manafacture Order生产单TU: Touch Up (锡面修补)IN:手插件PT:初测FT: Function Test (功能测试-终测)ASY:组立PK:包装TQM:Total quality control全面品质管理MDA:manufacturing defec

24、t analysis制程不良分析(ICT)RUN-IN:老化实验HI-pot：高压测试FMI：Frequency Modulation Inspect高频测试DPPM: Defect Part Per Million (不良率的一种表达方式：百万分之一) 1000PPM即为0.1%Corrective Action: (CAR改善对策)ACC：允收REJ:拒收SS：Sample size抽样检验样本大小SI-SIV：Special I-Special IV特殊抽样水平等级CON：Concession Waive特采ISO:国际标准化组织ISA：Industry Standard Archite

25、cture工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action计划，执行，检查，总结WIP:在制品（半成品）SO: Sales Order (业务订单)PO: Purchase Order (采购订单)PR: Purchase Request (请购单)AQL:acceptable quality level允收品质水准LQL;Limiting quality level最低品质水准QVL:qualified vendor list合格供应商名册AVL ：认可的供货商清单(Approved Vendor List)QCD: Quality

26、 cost delivery（品质，交期，成本）MPM:Manufacturing project management制造专案管理KPI:Key performance indicate重要绩效指标MVT:Manufacturing Verification Test制造验证试产QRS：QualityReliabilityService质量可靠度服务STL:ship to line（料到上线）NTF:No trouble found误判CIP:capacity improvement plan（产能改善计划）MRB:material review board（物料审核小组）MRB:Mater

27、ial reject bill退货单JIT:just in time（即时管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整顿，清扫，清洁，修养）SOP:standard operation process（标准作业程序）SIP:Specification inspection process制程检验规格TOP: Test Operation Process (测试作业流程)WI: working instruction（作业指导书）SMD:surface mounting device（表面粘着原件）FAR:failure aualysis rep

28、ort故障分析报告CAR:Corrective action report改善报告BPR： 企业流程再造 (Business Process Reengineering)ISAR ：首批样品认可(Initial Sample Approval Request)-JIT：实时管理 (Just In Time)QCC ：品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面品质环境管理)PD: Production Department (制造)LOG

29、: Logistics (后勤支持) Shipping: (进出口)AOQ：Average Output Quality平均出货质量AOQL：Average Output Quality Level平均出货质量水平FMEA：failure model effectiveness analysis失效模式分析CRB: Change Review Board (工程变更会议)CSA：Customer Simulate Analysis客户模拟分析SQMS：Supplier Quality Management System供应商品质管理系统QIT: Quality Improvement Team

30、 品质改善小组QIP：Quality Improvement Plan品质改善计划CIP：Continual Improvement Plan持续改善计划M.Q.F.S: Material Quality Feedback Sheet (来料品质回馈单)SCAR: Supplier Corrective Action Report (供货商改善对策报告)8D Sheet: 8 Disciplines sheet ( 8D单)PDCA：PDCA (Plan-Do-Check-Action) (管理循环)MPQ: Material Packing Quantity (物料最小包装量)DSCN: D

31、elivery Schedule Change Notice (交期变更通知)QAPS: Quality Assurance Process Sheet (品质工程表)DRP ：运销资源计划 (Distribution Resource Planning)DSS：决策支持系统 (Decision Support System)EC ：电子商务 (Electronic Commerce)EDI ：电子资料交换 (Electronic Data Interchange)EIS ：主管决策系统 (Excutive Information System) ：企业资源规划 (Enterprise Reso