TFT相关中英文对照表.docx

1、TFT相关中英文对照表工艺流程、材料、设备、生产常用中英文标准名称 版 号： 1.0 总 页 数： 23 制定部门： 生效日期： 年 月 日 拟 制： 审 核： 标 准 化： 会 签： 批 准： 发布 实施 更改状态更改内容更改人更改日期一TFT工艺流程中英文标准名称Array Process Flow阵列段工艺流程Input投料Unpacking拆包装Initial clean预备清洗Particle count尘埃粒子测试Gate栅电极层Clean before depo成膜前清洗Gate （Mo/Al alloy ) Film depo栅电极成膜RS meter电阻测量Macro Ins

2、pection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry(VCD)光刻胶低压干燥PR soft bake前烘Expose曝光Titler Expose/Edge Expose打标/边缘曝光Develop显影PR hard bake坚膜ADI 显影后自动光学检查Mic/Mac Inspection宏微观检查CD after develop显影后关键尺寸检查Total pitch长寸测量Gate Wet etch栅电极湿刻Contact angle接触角测量PR strip光刻胶剥离CD after etch刻蚀后关

3、键尺寸测量AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Laser Repair激光修补Active层Clean before depo成膜前清洗Active film depoActive成膜AOI自动光学检查Macro Inspection宏观检查Thickness Measurement厚度测量Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Mic/Mac Ins

4、pection宏微观检查Active film Dry etch & AshingActive膜干刻与灰化Thickness Measurement厚度测量PR strip光刻胶剥离AEI刻蚀后自动光学检查Mic/Macro Inspection宏微观检查S/D源/漏电极层Clean before depo成膜前清洗S/D Mo film depo源/漏电极成膜RS meter电阻测量MACRO Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝

5、光Edge expose边缘曝光Develop显影PR hard bake坚膜ADI 显影后自动光学检查MIC/MAC Inspection宏微观检查CD after develop显影后关键尺寸检查Hard bake by oven烘炉坚膜S/D Mo Wet etch源电极/漏电极湿刻n+ a-Si Dry etchn+高掺杂膜干刻PR strip光刻胶剥离Thickness Measurement厚度测量CD after etch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Clean before O/S test短路/开路测试前清洗O

6、pen/Short Test短路/开路测试Passivation保护层Clean before depo成膜前清洗Passn film depo保护膜成膜AOI自动光学检查MACRO Inspection宏观检查Thickness Measurement厚度测量Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Edge expose边缘曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Micro/Macro Inspection宏微观检查SinX

7、Dry etch & ASHING氮化硅干刻与灰化PR strip光刻胶剥离AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查ITOITO层Clean before PR成膜前清洗a-ITO film depoITO成膜RS meter电阻测试Anneal煺火Macro Inspection宏观检查Clean before PR涂胶前清洗Pre bake预烘PR Coating光刻胶涂布PR vacuum dry光刻胶低压干燥PR soft bake前烘Expose曝光Develop显影PR hard bake坚膜ADI显影后自动光学检查Micro/Macro In

8、spection宏微观检查ITO film etchITO膜湿刻PR strip光刻胶剥离AEI刻蚀后自动光学检查Micro/Macro Inspection宏微观检查Final E/T最终电测Anneal煺火Array test阵列测试Array repair阵列修补TEG testTEG测试Sort分级Cell Process flow制盒段工艺流程CF Input彩膜投料CF Initial Clean彩膜预备清洗CF AOI彩膜自动光学检查CF Sort彩膜分级PI配向膜Clean before PI 配向膜涂布前清洗PI Print配向膜涂布Pre-cure预固化PI Inspect

9、ion配向膜检查PI Thickness Measurement配向膜厚度测量Main-cure固化PI rework配向膜返工ODFCF&TFT MatchingCF&TFT匹配Rubbing配向摩擦Rubbing Inspection摩擦检查Loader & Un loader上料机/下料机Buffer缓冲器CST Buffer工装栏缓冲器Rotation/Cooling Unit旋转/冷却单元Turn Align Unit旋转/对位单元Turn Over Unit翻转单元After Rubbing Cleaner摩擦后清洗Spacer Spray衬垫球散布Spacer Counter衬垫

10、球计数Spacer rework衬垫球返工Spacer Cure衬垫球附着固化Short Dispense导电胶涂布Sealant Dispense边框胶涂布Seal Inspection边框胶检查LC Dispense液晶滴下Vacuum Assembly真空贴合UV Cure紫外线固化Mis-alignment check错位检查Seal Oven边框胶热固化Eye Inspection目视检查Cell gap Measurement盒厚测试Cutting切割1/4(1/6)Sheet Cutting,1/4(1/6)切割Stick Cutting,切条Cell Cutting切粒Visu

11、al TestVisual 测试ECPEdge Grind磨边Dipping clean浸泡式清洗Clean before Pol 贴片前清洗Pol Attach贴片Pol Inspection贴片检查Pol rework贴片返工Auto ClaveAuto Clave消泡Laser TrimmerLaser Trimmer激光切线Test测试Gross Test终检Repair修补Bin sorter分级OQC Test出货检查Store货栈Module Process Flow模块段工艺流程COGPad cleaning端子清洗IC BondingIC 邦定Microscope Inspe

12、ctionAOI 镜检自动光学检查Adhesive test粘接力测试FOGACF AttachingACF 粘贴FOG BondingFOG 邦定Microscope Inspection镜检Peeling strength test拉力测试ET test1电测1IC or FPC Repair修补UV glue sealing 封胶FPC reinforcement补强UV glue curingUV胶固化Assembly组装ET test2电测2anti-ultraviolet tape attaching遮光胶带粘贴protected tape attaching保护胶带粘贴Backl

13、ight assembly背光源组装Backlight soldering背光源焊接Touch panel assembly触摸屏组装Final ET test最终电测Rework返工Aging老化QC testQC检验Code printing喷码Packing包装OQC Test出货检验Finished good shipment合格品出货CIM name集成控制系统名称CIM计算机集成制造系统CIM System计算机集成制造系统Manufacturing Execution System(MES)制造执行系统（MES）Preventive Maintenance System(PMS)

14、设备预防保养系统（PMS）Statistical Process Control(SPC)统计过程管理（SPC）Equipment Automation Program(EAP)设备自动化（EAP）Report报表Engineering Data Analysis(EDA)工程数据分析（EDA）Finished Good Management System(FGMS)成品管理系统（FGMS）Product产品Glass玻璃基板Panel面板Process Flow工艺流程Operation操作EDC工程数据收集Equipment设备Chamber腔体Unit单体Sub Unit副单体Port端

15、口OIC (Operator Interface Client)操作者界面EDB工程数据库FGMS成品管理系统Dispatcher派货Create建立Start下线Scrap报废Un scrap取消保废Complete完成Ship出货Un ship取消出货Receive收料Track In入账Track Out出账Wait等待Hold滞留Release释放Rework返工Vehicle搬运车Robot机械手AGV (Automatic Guided Vehicle)自动搬运车MGV (Manual Guided Vehicle)人工搬运车Clean lifter净化电梯LIM (Linear

16、Induction Motor) Carrier线性感应马达传送载具OHS (Overhead Handling System)天车搬送系统Stocker (clean depot)工装篮存放架Battery电池Bay作业区Inter-bay作业区和作业区之间Intra-bay作业区之内Bumper减震缓冲器Charger充电器Controller控制器Conveyor传送带Crane吊车（在Stocker内）FFU (Fan Filter Unit)风扇过滤器Host主机I/O (Input / Output)输入/输出IR (Infra-Red)红外线IRIF(Infra-Red Inte

17、rface)红外接口Load上料Unload下料Magnetic tape磁条(AGV路径所使用的磁条)Retrieve检索RTM (Rotary Transfer Machine)旋转传送机构SCARA armAGV传送臂Reset重新设定Transportation传输Recipe工艺参数的组合Stock out将工装篮取出货栈Request要求,请求Transfer传送,运送Instruction命令,指令Select选择Cancel取消Operation作业,操作Support支援,支持Process工艺Start开始Batch批量Lot批(指生产线的在制品或产品控制单位)ID (Id

18、entity)识别码(如Lot ID or Chip ID)Sheet片(Array区玻璃基版计数单位)Inspection检验Defect缺陷Hold滞留Release释放Equipment设备（简称为EQP）Tool工具,机台WIP (Work In Process)在制品（工艺在制品）Maintenance维修保养Cassette工装篮(阵列段),卡匣(制盒段及模块段)Empty空的Reserve预备Report报告Rework返工Log on登录，入系统Log off注销登录，离开系统Note批注Unpacking line拆包线Un packer拆包机Glass conveyor玻璃

19、传送带Initial Cleaner预清洗Un loader下料机Cassette Manual Guide Vehicle (MGV)工装篮人工搬运车Array CassetteArray工装篮ODF CassetteODF工装篮Automated Material Handling System(AMHS)自动物料搬运系统Clean Stocker(STK)洁净工装篮存放架（STK）Overhead Handling System (OHS)天车搬送系统（OHS）Material Control System (MCS)物料控制系统（MCS）Clean Robot洁净机械手Loader/U

20、n loader上/下料机Sorter分片机二TFT材料中英文标准名称类型TypeMaterials name材料名称玻璃GlassGlass玻璃基板Color filter彩色滤光膜Bare glass白玻璃基板LCD Panel液晶面板靶材TargetAlNd/Al Target铝钕/铝靶材MoNb/Mo Target钼铌/钼靶材ITO TargetITO靶材化学液体ChemicalAl EtchantAl蚀刻液ITO EtchantITO蚀刻液HNO3硝酸CH3COOH乙酸Developer显影液Stripper剥离液MEA单乙醇胺Photo Resist光刻胶Organic Photo

21、 Resist有机膜用光刻胶Thinner稀释剂NMPN-甲基-2-吡咯烷酮HF氢氟酸Acetone丙酮IPA异丙醇Ethanol酒精辅助器材Sub materialPhoto Mask光罩APR PlateAPR版Rubbing Cloth摩擦绒布Adhesive Tape双面胶布Probe frame for array tester阵列电测架E/T Frame电测用探测架Cell ET Probe Unit屏电测用探测头Open/Short tester and prober开路、短路电测用探测头Teflon Tape特氟龙带Silicon rubber硅胶皮Wiper Tape无尘卷布

22、高纯气体High purity gasNF3三氟化氮SiH4硅烷SF6六氟化硫NH3氨气Cl2氯气HCL氯化氢CHF3三氟甲烷PH3磷烷CF4四氟甲烷N2氮气O2氧气H2氢气Ar氩气He氦气液晶LCLC液晶材料胶膜FilmPolarizer偏光片Diffuser散光膜涂料DopePaintPI聚酰亚胺树脂ResinSealant边框胶UV glueUV胶ACF各向异性导电膜Conductive Spacer导电衬垫球Spacer used in Sealant边框胶内衬垫球Spacer used in Cell（White）盒内衬垫球(白）Spacer used in Cell（Black）盒

23、内衬垫球(黑）元器件PartsBack Light Unit背光源Integrated circuit/Driver IC集成电路/驱动ICPCB印刷电路板FPC柔性印刷线路板Module Frame模块外框Touch Panel/Touch film触摸屏/触摸膜RCL阻容器件焊接材料SolderingmaterialFLUX助焊剂SOLDER CREAM焊锡/焊接剂三TFT设备中英文标准名称English name中文名称PHOTO曝光Exposer曝光机Coater Developer陈列黄光制程清洗机-涂布机-显影机long size measuring and critical di

24、mension measuring multiple equipment测长仪和线宽测量仪 Titler& Edge Exposer打标机和边缘曝光复合机 Edge Exposer边缘曝光机AFM原子力显微镜FIB聚焦离子束系统FE-SEM场发射扫描电子显微镜UV MeterUV照度计EXCIMER UV准分子紫外清洗机Ionizer Bar除静电棒Fire Extinguisher灭火器Photo Ionizer软X射线静电消除器PVD&WET溅射&湿式PVD(Multi-chamber type sputtering system)磁控溅射成膜机Particle counter尘埃粒子测量

25、仪Ultrasonic Cleaner超声波清洗机Stripper脱膜机Contact Angle Analyzer接触角测量仪RS Meter(4point Probe)四探针仪Cassette Cleaner工装篮清洗机Initial Cleaner预备清洗机Pre CVD cleaner成膜前清洗机HF Cleaner before S/DS/D成膜前带HF清洗机Liquid Particle Counter液体内尘埃粒子测量仪CCSS中央化学品供应系统Anneal Oven 退火炉Hard Bake Oven后烘炉Film Tester薄膜附着力测试仪 Etchant Concentr

26、ation Management System刻蚀液浓度管理系统DMS显影液浓度管理系统DRS显影液溶剂回收系统RMS剥离液浓度管理系统Wet Etcher湿刻机4.5G-Macro Review System4.5G宏观检查机4.5G-Mic/Mac Review System4.5G宏观、微观检查机RGA(Residual Gas Analyzer)残余气体分析仪PECVD化学气相沉积Hot N2 Transfer System热N2供应系统PECVD等离子增强化学气相淀积设备Special Gas Supply & Monitor System特种气体供应和监视管理系统Temperature Recorder温度记录仪Gas Scrubber for PECVDPECVD用尾气处理装置Full Automatic Spectroscopic Ell