电子元器件封装图示大全.docx

1、电子元器件封装图示大全电子元器件封装图示大全 LQFP 100LMETAL QUAD 100LPQFP 100LQFPQuad Flat PackageQFPQuad Flat PackageTQFP 100LRIMMRIMMFor Direct RambusSBGASC-70 5LSDIPSIMM30SIMM30PinoutSIMM30Single In-line Memory ModuleSIMM72SIMM72PinoutSIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIPSingle Inline

2、 PackageSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA

3、 AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32LSOJSOP EIAJ TYPE II 14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP 16LSSOPSocket 603FosterLAMINATE TCSP 20LChip Scale PackageTO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52

4、TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageLAMINATE UCSP 32LChip Scale PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid Array? VL Bus VESA Local BusXT Bus8bitZIPZig-Zag Inline PackageGull Wing Leads HSOP28ISAIndustry Standard ArchitectureIT

5、O220ITO3pJ-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsJLCCLCCLDCCLGALLP 8LaLQFPPCDIPPCI 32bit 5VPeripheral Component InterconnectPCI 64bit 3.3VPeripheral Component InterconnectPCMCIAPDIPPGAPlastic Pin Grid ArrayPLCCPQFPPS/2PS/2mouse port pinoutPSDIPDIMM 168DIMM

6、 DDRDIMM168Dual In-line Memory ModuleDIMM168DIMM168PinoutDIMM184For DDR SDRAM Dual In-line Memory ModuleDIPDual Inline PackageDIP-tabDual Inline Package with Metal HeatsinkEIAEIAJEDEC formulated EIA StandardsEISAExtended ISA? FBGAFDIPFTO220Flat PackAC97AC97v2.2 specification 详细规格AGP 3.3VAccelerated

7、Graphics PortSpecification 2.0详细规格AGP PROAccelerated Graphics Port PROSpecification 1.01详细规格AGPAccelerated Graphics PortSpecification 2.0详细规格AMRAudio/Modem RiserAX078AX14C-Bend Lead CERQUADCeramic Quad Flat PackCLCCCNRCommunication and Networking Riser Specification Revision 1.2CPGACeramic Pin Grid

8、ArrayCeramic CaseLAMINATE CSP 112LChip Scale PackageBGABall Grid ArrayEBGA 680LLBGA 160LPBGA 217LPlastic BallGrid ArraySBGA 192LTSBGA 680LCLCCCNR Communication and Networking RiserCPGA Ceramic Pin Grid ArrayDIP Dual Inline Package DIP-tab Dual Inline Package with Metal HeatsinkFBGAFDIPFTO-220Flat Pa

9、ckHSOP-28ITO-220ITO-3PJLCCLCCLDCCLGALQFPPCDIPPGA Plastic Pin Grid Array PLCCPQFPPSDIPLQFP 100LMETAL QUAD 100LPQFP 100LQFP Quad Flat PackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603 FosterLAMINATE TCSP 20L Chip Scale PackageTO252TO263/TO268QFP Q

10、uad Flat PackageTQFP 100LSBGASC-70 5LSDIPSIP Single Inline PackageSO Small Outline PackageSOJ 32LSOJSOP EIAJ TYPE II 14LSOT220SSOP 16LTO247SSOPTO18TO220TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOP Thin Small Outline PackageTSSOP or TSOP II Thin Shrink Outline PackageuBGA Micro Ball Grid ArrayuBGA

11、Micro Ball Grid ArrayZIP Zig-Zag Inline PackageBQFP132C-Bend Lead CERQUAD Ceramic Quad Flat PackCeramic CaseLAMINATE CSP 112L Chip Scale PackageGull Wing LeadsPDIPPLCCSNAPTKSNAPTKSNAPZPSOHAGP 3.3VAccelerated Graphics PortSpecification 2.0详细规格AGP PROAccelerated Graphics Port PROSpecification 1.01详细规格AGPAccelerated Graphics PortSpecification 2.0详细规格AMRAudio/Modem RiserAX078AX14BGABall Grid ArrayBQFP132EBGA 680L详细规格LBGA 160L详细规格PBGA 217LPlastic Ball Grid Array详细规格SBGA 192L详细规格TEPBGA 288LTEPBGA 288L详细规格TSBGA 680L详细规格C-B