PCB专业术语Word格式文档下载.docx

1、试生产部TDTechnology Development技术开发部R&DResearch&Development研发部PEProcess Engineering工程部PCProduction Control生管部TSTraffic&Shipping海关货运部ETElectrical Test电性测试ENIGElectroless Nickel and Immersion Gold化学镍金AOIAutomated Optical Inspection自动光学检测B/OBlack Oxide黑氧化HASLHot Air Soldering Level热风整平/喷锡PTHPlated Through

2、 Hole镀通孔DFDry Film干膜DESDevelop, Etch &Stripping显影,蚀刻,除胶EHSEnvironment Health&Safety环境保护部DPDirect Plating直接电镀B/FBond Film/Brown Oxide棕化I/LInner Layer内层线路O/LOuter Layer外层线路S/MSolder Mask防焊P/PPattern Plating图形电镀LCDLiquid Crystal Display液晶显视器2nd ESecond Exposure二次曝光NCNumerically Controlled数控钻孔二.其它缩略语QCQ

3、uality Control品质管控QMQuality Manual品质手册CIPContinuous Improvement Project持续改善项目CPControl Plan控制计划ICDInterconnection Defect内连缺陷问题RPNRisk Priority Number风险优先顺序APQPAdvanced Product Quality Plan先期产品品质计划PPAPProduction Part Approval Procedure生产零部件核准程序AQLAcceptable Quality Level品质允收水准AVLApproved Vendor List合

4、格供应商清单CPKProcess Capability Index制程能力指数FMEAFailure Mode And Effect Analysis失效模式与效应分析IPCThe Institute For Interconnection&美国电子电路互连及Packaging Electronic Circuits封装协会ISOInternational Organization for 国际标准化组织Standardization/International Standard OrganizationJITJust In Time及时MPIManufacturing Process Ins

5、truction制程作业说明书SOPStandard Operation Procedure标准操作规范SPCStatistical Process Control统计制程管制6 6 Sigma6个标准差CPCAChina Printed Circuit Association中国印刷电路板协会TPCATaiwan Printed Circuit Association台湾印刷电路板协会JPCAJapan Printed Circuit Association日本印刷电路板协会RRepeatability & Re-productivity重复性&再现性A/WArtwork底片OPOperat

6、ion Instruction操作说明IPAIsopropyl Alcohol异丙醇ICIonic Contamination离子污染度Integrated Circuit集成电路BGABall Grid Array球形栅格阵列AAAtomic Absorption Spectrophotometer原子吸收光谱仪CVSCyclic Voltametric Stripping循环伏安剥离分析仪Ion Chromatography离子液相色谱OGPOptical Gauging Products光学计量器/三次元OTDOn Time Delivery按时交货QPQuality Procedure

7、品质程序文件R.CResin Content胶含量R.FResin Flow胶流量SEMScanning Electronic Microscope扫描电子显微镜PPPrepreg预浸材料/半固化片ACCAccept接受REJReject拒收CARCorrective Action Request改善措施报告R/WRework重工MRBMaterial Review Board需确认之问题板SPECSpecification规格A/RAction Required待办事项SMDSurface Mount Device表面贴装装置WIPWork In Process在制品HDIHigh Dens

8、ity Interconnecting高密度互连UVUltraviolet Spectrophotometer紫外光分光光度计CDACompressed and Dried Air压缩气CTCooling Tower冷却塔CT WaterCity Water市水/自来水DBDistribution Board配电屏DI WaterDe-ionized Water去离子水FWFiltered Water过滤水M/CMachine机台PCBPrinted Circuit Board/Profit Come Back印刷线路板/利润到来SSBSingle-sided Printed Board单面印

9、制板DSBDouble-sided Printed Board双面印制板MLBMultilayer Printed Circuit Board多层线路印制板RO WaterReverse Osmosis Water反渗透水ROFReverse Osmosis Filter反渗透过滤器SWSoft Water软水TEMPTemperature温度TPMTotal Preventive Maintenance总体预防性维护Account Receivable应收款项A/PAccount Payable应付款项Capital Acquisition Request 资金获得申请DMDirect Ma

10、terial直接物料IDMIndirect Material间接物料Finance Module财务模块P&LProfit&Loss盈亏PBTProfit Before Tax税前利润COCosting Module（SAP）成本模块OSOutstanding杰出ERExceed Improvement优秀MRMeet Requirement良好NINeed Improvement待改进UAUnacceptable不可接受ASAPAs Soon As Possible尽可能快地D/CDate Code周期DOEDesign of Experiment实验设计ERPEnterprise Reso

11、urce Planning企业资源规划KPIKey Performance Index主要绩效指标MCSManagement Control System管理控制系统Material Request物料申请PCBAPrinted Circuit Board Assembly电路板组装P/NPart Number板号/料号POPurchase Order采购单PPick&Place贴片机PRPurchase Requisition采购申请SMTSurface Mount Technology表面贴装技术S/OSales Order业务单/销售单V/OVariation Order变异单F/OFa

12、cility Order工厂号NPTHNon-plated Through Hole非导通孔EDSEngineering Date Sheet工程数据单ECNEngineering Change Notice工程变更单PCB/PWBPrinted Circuit Board/Pinted Wiring Board印刷电路板MCPMetallization Continuous Plating垂直连续电镀D/SDouble Side双面板D/ODelivery Order送货单RCCResin Coated Copper背胶铜箔QFPQuarter Flat Pad四方形焊盘MSAMeasure

13、ment System Analysis量测系统分析Multilayer Printed Board多层印制板CCLCopper-clad Laminate覆铜板PTFEPolytetrafluoethylene聚四氟乙稀BCSButyl Cellosolve Solvent防白水KLMKey Line Manager主要负责人BUMBuild-up Multilayer积层法多层板DSCDifferential Scanning Calorimetry微差扫描热卡分析法DMADynamic Mechanical Analysis动态力分析法IAInformation Appliance信息家

14、电LPSMLiquid Photoimagible Solder Mask液态感光油墨PGAPin Grid Array针栅阵列PBGAPlastic-BGA塑料球栅阵列STHSiler Through Hole银胶贯孔TGAThermo Gravimetric Analysis热重量分析法RHRelative Humidity相对湿度三.PCB一般用语英文Marking标记Void空洞Fiducial Pad基准焊垫Package包装货运Warpage / Bow and Twist板弯板翘Via Hole导通孔（小于20mil）Plug Hole堵孔Annular Ring孔环Slot h

15、ole槽孔Traveler流程单Buy Off抽检Develop显影Legend文字Gold Potassium Cyanide金盐Routing铣切Silver银Gold金OSP（Organic Solderability Preservative）有机保护膜Line Width线宽Line Space线间距Board Thickness板厚Hole Size孔径Trace线路Drilling钻孔Impedance阻抗Bar Code条形码Acid Clean酸洗De-warpage板弯翘反直/矫正Master Drawing蓝图Defect缺陷Hot Air Repaid Drying O

16、ven快速烘箱Carton箱子Blind Via盲孔Copper Foil铜箔Tolerance公差X-Out打叉Customer客户Pin Gauge量规/针规/塞规Soldering Iron电烙铁Solderability Test焊锡性实验Final Finish表面处理Warehouse仓库Wicking渗镀/灯芯效应Laser Hole镭射孔Shipping Buy-off出货抽检Film Adhesive粘结膜Au Seepage金渗镀Vertical Desmear垂直除胶渣Scrapped Board报废板Audit稽核Stamping冲压C=0 Sampling Plan零

17、缺陷抽样计划Lay up&Press叠合&压合Touch up/Repair修补Smear Residue胶渣残留Immersion Silver沉银10X Eye Lupe10X放大镜Tape Test胶带试验Conditional Accept有条件允收Quarantine隔离Stop Shipping停止出货On Hold暂扣Stamp印章Tooling Hole定位孔Component Hole元件孔Mounting Hole安装孔Production产品Test Board测试板Conductor导线X-Section/Microsectioning切片Fisrst Article

18、Inspection首件/初片检查Final Cure最后烘烤Rigid Printed Board刚性印制板Build-up Multiplayer Printed Board积层多层印制板Flexible Printed Board挠性印制一路板Mother Board/Mouse Bite母板Daughter Board子板Back Plane Board背板Bare Board裸板Cable电缆Interconnection互连Transmission Line传输线Substrate基底Conductive Pattern导电图形Non-conductive Pattern非导电图形

19、Base Material基板Laminate层压板Composite Laminate复合层压板Thin Laminate薄层压板Bonding Sheet粘结片Stiffener Material增强板材Epoxy Resin环氧树脂Round Pad圆形盘Glass Fiber玻璃布Yarn纱线Filament单丝Weft Yarn纬纱Warp Yarn经纱Wasp-wise经向Split裂缝Rework Simulation模拟重工Square Pad方形盘Diamond Pad棱形盘Oblong Pad长方形焊盘Supportd Hole支撑孔Buried Via Hole埋孔Bur

20、ied/Blind Via埋/盲孔Check List点检表Hole Location孔位Hole Density孔密度Hole Pattern孔图Datum Reference参考基准Acceleration速化反应Integrity完整性Accuracy准确度Acrylic亚克力Blow Hole吹孔Bare Chip Assembly裸体芯片组装Bond Strength结合强度Bondability结合性Bonding Wire结合线Breakaway Panel可断拼板Breakdown Voltage崩溃电压/击穿电压Burr毛头/毛刺Chemical Resistance抗化学性

21、Chip芯片Alcohol酒精Moisture And Insulation Resistance湿气与绝缘电阻Core Board芯片/核心核Deburing去毛刺Dent凹陷Deposition沉积/储蓄Desmear除胶渣Dielectric Breakdown介质崩溃Dielectric Constant介质常数Dimensional Stability尺寸稳定性Drill Facet钻尖切削面Edge-Board Connector板边连接器Edge-Board Contace板边插头Negative Etchback反回蚀Electroless Deposition化学镀/无电镀Etchback回蚀Etch Factor蚀刻因子Etching Resist抗蚀刻Gel Time凝胶时间Gelation Particle凝胶点Holding Time停留时间Hole Wall Breakout孔偏破Hole Void孔壁空洞Hull Cell哈氏槽Imaging成像Logo标识Leakage Current漏电流Lifted Land焊垫浮起Measling白点/白斑Minimum Ann