1、 k-1 撈型 (N/C Routing ) (Milling) k-2 模具沖 (Punch) k-3 板面清洗烘烤 (Cleaning & Backing) k-4 V型槽 ( V-Cut)(V-Scoring) k-5 金手指斜邊 ( Beveling of G/F) L. 短斷路測試 (Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光學檢查 ( AOI Inspection) l-2 VRS 目檢 (Verified & Repaired) l-3 复合型治具測試 (Universal Tester) l-4
2、 專用治具測試 (Dedicated Tester) l-5 飛針測試 (Flying Probe) M. 終檢 ( Final Visual Inspection)m-1 壓板翹 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包裝及出貨 (Packing & shipping)m-4 目檢 ( Visual Inspection) m-5 清洗 及烘烤( Final Clean & Baking) m-6 護銅劑 (ENTEK Cu-106A)(OSP) m-7 離子殘餘量測試 (Ionic Contamination Test )(C
3、leanliness Test) m-8 冷熱衝擊試驗 (Thermal cycling Testing) m-9 焊錫性試驗 ( Solderability Testing )N. 雷射鑽孔(Laser Ablation) N-1 雷射鑽Tooling孔 (Laser ablation Tooling Hole) N-2 雷射曝光對位孔(Laser Ablation Registration Hole) N-3 雷射Mask製作(Laser Mask) N-4 雷射鑽孔(Laser Ablation) N-5 AOI 檢查及VRS ( AOI Inspection & Verified &
4、Repaired) N-6 Blaser AOI (after Desmear and Microetching) N-7 除膠渣 (Desmear) N-8 微蝕 (Microetching )A/W (artwork) 底片Ablation 燒溶(laser),切除 abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蝕accelerated test 加速試驗 acceleration 速化反應 accelerator 加速劑acceptable 允收act
5、ivator 活化液active work in process 實際在製品adhesion 附著力adhesive method 黏著法air inclusion 氣泡air knife 風刀amorphous change 不定形的改變amount 總量 amylnitrite 硝基戊烷analyzer 分析儀anneal 回火annular ring 環狀墊圈;孔環anode slime (sludge) 陽極泥anodizing 陽極處理AOI ( automatic optical inspection ) 自動光學檢測applicable documents 引用之文件AQL sa
6、mpling 允收水準抽樣aqueous photoresist 液態光阻aspect ratio 縱橫比(厚寬比)As received 到貨時back lighting 背光back-up 墊板banked work in process 預留在製品base material 基材 baseline performance 基準績效batch 批beta backscattering 貝他射線照射法 beveling 切斜邊;斜邊biaxial deformation 二方向之變形black-oxide 黑化blank controller 空白對照組blank panel 空板blank
7、ing 挖空blip 彈開blister 氣泡;起泡blistering 氣泡blow hole 吹孔board-thickness error 板厚錯誤bonding plies 黏結層bow ; bowing 板彎break out 從平環內破出bridging 搭橋;橋接BTO (Build To Order) 接單生產 burning 燒焦burr 毛邊(毛頭)camcorder 一體型攝錄放機carbide 碳化物carlson pin 定位梢carrier 載運劑catalyzing 催化catholic sputtering 陰極濺射法caul plate 隔板;鋼板calibr
8、ation system requirements 校驗系統之各種要求 center beam method 中心光束法central projection 集中式投射線certification 認證chamfer 倒角 (金手指)chamfering 切斜邊;倒角characteristic impedance 特性阻抗charge transfer overpotential 電量傳遞過電壓chase 網框checkboard 棋盤chelator 蟹和劑chemical bond 化學鍵chemical vapor deposition 化學蒸著鍍circumferential voi
9、d 圓周性之孔破clad metal 包夾金屬clean room 無塵室clearance 間隙coat 鍍外表coating error 防焊覆蓋錯誤coefficient of thermal expansion (CTE) 熱澎脹系數cold solder joint 冷焊點cold-weld 金屬粉末冷焊color 顏色color error 顏色錯誤compensation 補償competitive performance 競爭力績效complex salt 錯化物complexor 錯化物component hole 零件孔component side 零件面concentri
10、c 同心conformance 密貼性consumer products 消費性產品contact resistance 接觸電阻continuous performance 連續發揮效能contract service 協力廠controlled split 均裂式conventional flow 亂流方式conventional tensile test 傳統張力測試法conversion coating 轉化層convex 突出coordinate list 資料清單copper claded laminates (CCL) 銅箔基板copper exposure 線路露銅copper
11、 mirror 鏡銅copper pad 銅箔圓配copper residue (copper splash) 銅渣corrosion rate numbering 腐蝕速率計數系統corrosion resistance 抗蝕性coulombs law 庫倫定律countersink 喇叭孔coupon 試樣coupon location 試樣點covering power 遮蓋力CPU 中央處理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交聯聚合cross talk 呼應作用crosslinking 交聯crystal collection 結晶收集cur
12、ing 聚合體current efficiency 電流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 學習循環cycle-time reduction 交期縮短date code 週期deburring 去毛頭dedicated 專用型degradation 退變delamination 分層dent / pin hole 凹陷 / 針孔department of defense 國防部designation 字碼簡示法de-smear 除膠渣developing 顯影dewetting 縮錫dewetting time 縮錫時間di
13、mension error 外形尺寸錯誤 dielectric constant 介質常數difficulty 困難度difunctional 雙功能dimension 尺寸dimension stability 尺寸安定性dimension and tolerance 尺寸與公差dirty hole 孔內異物discolor hole 孔黑;孔灰;氧化discoloration 變色disposable eyelet method 消耗性鉚釘法distortion factor 尺寸變形函數 double side 雙面板downtime 停機時間drill 鑽孔drill bit 鑽頭dr
14、ill facet 鑽尖切萷面drill pointer 鑽尖重(研)磨機drilled blank board 已鑽孔之裸板drilling 鑽孔dry film 乾膜 W/Fductility 延展性economy of scale 經濟規模edge spacing 板邊空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 電測electrical testing 電測;測試electrochemical machine ECM 電化學加工法electrochemical reactor 電化學反應器ele
15、ctroforming 電鑄electroless plate 化學銅electroless-deposition 無電鍍electropolishing 電解拋光electrorefining 電解精鍊electrowinning 電解萃取elliptical set 橢圓形embrittlement 脆性entitlement performance 可達成績效entrapment 電鍍夾雜物epoxy 環氧樹酯equipotential 電位線error data file 異常情形etch rate 蝕銅速率etchants 蝕刻液etchback 回蝕evaluation progr
16、am 評估用程式exposure 曝光external pin method 外部插梢法eyelet hole 鉚釘孔Eyeletting 鉚眼fabric 網布failure 故障fast response 快速回應fault 瑕庛;缺陷fiber exposure 纖纹顯露fiber protrusion 纖纹突出fiducial mark 光學點,基準記號filler 填充料film 底片filtration 過濾finished board 成品fixing 固著fixture 電測夾具(治具)flaking off 粹離flammability rating 燃性等級flare 喇叭
17、形孔flat cable 併排電纜feedback loop 回饋循環first-in-first-out (FIFO) 先進先出flexible manufacturing system (FMS) 彈性製造系統flux 助焊劑foil distortion 銅層變形fold 空泡foreign include 異物foreign material 基材內異物free radical chain polymerization 自由基連鎖聚合fully additive 加成法fully annealed type 徹底回火軔化之類形function 函數fundamental and bas
18、ic 基本fungus resistance 抗黴性funnel flange 喇叭形摺翼galvanized 加法尼化製程gap 鑽尖分開gauge length 有效長度gel time 膠化時間general resist ink 一般阻劑油墨general 通論general industrial 一般性(電子)工業級geometrical levelling 幾何平整glass transition temperature (Tg) 玻璃態轉換溫度Gold 金gold finger 金手指gold plating 鍍金golden board 標準板gouges 刷磨凹溝gougin
19、g 挖破grain boundary 金屬晶體之四邊green 綠色grip 夾頭ground plane 接地層ground plane clearance 接地空環 hackers 駭客 HAL ( hot air leveling ) 噴錫haloing 白邊;白圈hardener 硬化劑hardness 硬度hepa filter 空氣濾清器high performance industrial 高性能(電子)工業級high reliability 高可靠度high resolution 高解析度high temperature elongation (HTE) 高溫延展性銅箔high
20、 temperature epoxy (HTE) 高溫樹酯hit 擊hole counter 數孔機hole diameter 孔徑hole diameter error 孔徑錯誤hole location 孔位hole number 孔數hole wall quality 孔壁品質hook 外弧hot dip 熱浸法hull cell 哈氏槽hybrid 混成積體電路hydrogen bonding 氫鍵hydrolysis 水解hydrometallurgy 濕法冶金法image analysis system 影像分析系統image transfer 影像轉移immersion gold
21、 浸金 (化鎳金) immersion plating 浸鍍法impedance 阻抗infrared reflow 紅外線重熔inhibitor 熱聚合抑制劑injection mold 射模ink 油墨innerlayer & outlayer 內外層insulation resistance 絕緣電阻intended position 應該在的位置intensifier 增強器intensity 強度inter molecular exchange 交互改變interconnection 互相連通ionic contaminants 離子性污染物ionic contamination t
22、esting 離子污染試驗IPA 異丙醇5I : inspiration 啟蒙 identification 確認計劃目標 implementation 改善方案 information 數據信息 internalization 制度化invisible inventory 無形的庫存knife edges 刀緣Knoop 努普(硬度單位)kraft paper 牛皮紙laminar flow 層流laminate 基層板laminating 壓合lamination 壓合laminator 壓膜機land 焊墊lay back 刃角磨損lay up 組合疊板layout 佈線;佈局lead
23、screw 牽引螺絲leakage 漏電learning curve 學習曲線legend 文字標記leveling 平整levelling additive 平整劑levelling power 平整力life support 維繫生命limiting current 極限電流line space 線距line width 線寬linear variable differential transformer(LVDL) 線性可變差動轉換器 liquid 液狀(態)liquid crystal resins 液晶樹脂liquid photoimageable solder resist ink 液態感光防焊油墨liquid photoresist ink 液態光阻劑油墨lot size 批量lower carrier 底部承載板mechanical plating 機祴鍍法machine scrub 刷磨清潔法macrothrowing power 巨分佈力margin 鑽頭刃帶market share 市場佔有率marking error 文字錯誤masked leveling 儰裝平整mass lamination 大型壓板mass transfer 質量傳送效應mass transfer overpotential 質量傳遞過電壓mass transportation 質傳
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