1、PCB术语中英文对照表培训讲学PCB术语中英文对照表Adhesion附着力AnnularRing孔环AOI(automaticopticalinspection)自动光学检测AQL(acceptablequalitylevel)可接受的质量等级B²it(buriedbumpinterconnectiontechnology)埋入凸块焊点互连技术BBH(buriedblindhole)埋盲孔BGA(ballgridarray)球栅阵列Blister起泡BoardEdges板边Burr毛头/毛刺BUM(Build-upmultilayer)积层式多层板BVH(buried/blindvi
2、ahole)埋/盲导通孔CAD(computeraideddesign)计算机辅助设计CAM(computeraidedmanufacturing)计算机辅助制造Carbonoil碳油CEM(compositeepoxymaterial)环氧树脂复合板材chamfer倒角Characteristicimpedance特性阻抗CNC(computerizednumericalcontrol)计算机化数字控制ConductorCrack导体破裂ConductorSpacing导线间距connector连接器Copperfoil铜箔(皮)Crazing微裂纹(白斑)Delamination分层Dew
3、etting半润湿(缩锡)DFM(designformanufacturing)可制造性设计DIP(dualin-linepackage)双列直插式组件Dk(dielectricconstant)介电常数DRC(designrulechecking)设计规则检查drawing图纸ECN(engineeringchangenotice)工程更改通知ECO(engineeringchangeorder)工程更改指令Eglass电子级玻璃entekOSP处理Epoxyresin环氧树脂ESD(electrostaticdischarge)静电释放EtchedMarking蚀刻标记Flatness翘曲
4、度ForeignInclusion外来夹杂物Flameresistant阻燃性FR-2(flame-retardant2)耐燃酚醛纸基板FR-3(flame-retardant3)耐燃环氧纸基板FR-4(flame-retardant4)耐燃环氧玻璃布基板FR-5(flame-retardant5)耐燃多功能环氧玻璃布基板ground地面(层)Haloing晕圈HDI(highdensityinterconnection)高密度互连技术HASL(hotairsolderleveling)热风焊料整平(整平)IC(integratedcircuits)集成电路InkStampedMarking盖
5、印标记Insulationresistance绝缘电阻Ioncleanliness离子清洁度IPC(theinstituteforinterconnectingandpackagingofelectroniccircuits)印制电路互连与封装协会ISO(Internationalorganizationforstandardization)国际标准化组织LaminateVoids压合空洞laser激光LDI(laserdirectimaging)激光直接成像legend文字标记、符号LiftedLands焊盘浮起logo标志LPI(liquidphotoimageable)液态感光成像LPI
6、SM(liquidphotoimageablesoldermask)液态感光阻焊膜marking标记Measling白斑Microvoids微坑mil密耳(千分之一英寸)MIL-STD(militarystandard)美国军用标准NegativeEtchback欠蚀Nicks缺口Nodules镀镏Nonwetting不润湿(拒锡)open开路OSP(organicsolderabilitypreservatives)表面抗氧化oxides氧化物pad焊盘panel拼板pattern板面图形PCB(printedcircuitboard)印制电路板Pcs(pieces)件、片、只Peeling
7、剥落pinhole针孔PinkRing粉红圈Pits凹坑pitch中心距PlatingVoids镀层破洞plug塞PositiveEtchback过蚀power电源层prepreg半固化片PTFE(polytetrafluoroethylene)聚四氟乙烯PTH(platedthrough-hole)金属化孔PWB(printed-wiringboard)印制线路板Registration对准QA(qualityassurance)质量保证QC(qualitycontrol)质量控制QE(qualityengineering)质量工程QFP(quadflatpackage)方形扁平组件repa
8、ir修理RCC(resincoatedcopper)已涂覆树脂的铜箔Referencedimension参考尺寸registration对准度resin树脂rejection拒收revision修订版RF(radiofrequency)射频Ripples纹路rout外形铣scratch划伤ScreenedMarking纲印标记scoring刻槽short短路signal信号Silkscreen丝网SkipCoverage漏印slot开槽SMD(surfacemountdevice)表面安装器件SMOBC(soldermaskoverbarecopper)裸铜覆盖阻焊膜SMT(surfacemo
9、unttechnology)表面安装技术smear毛刺solder焊锡S/M(soldermask)绿油solderability可焊性SodaStrawing(汽水)吸管式浮空SPC(statisticalprocesscontrol)统计过程控制spacing间距Tapetest胶带实验TCE(thermalcoefficientofexpansion)热胀系数TDR(time-domainreflectometry)时域反射测试tolerance公差Tenting盖孔TextureCondition显布纹Tg(glasstransitiontemperature)玻璃软化温度THT(th
10、roughholetechnology)通孔(插装)技术trace线路(条)UL(underwriterslaboratories)安全实验所NPTH非金属化孔UV(ultraviolet)紫外线辐射v-cutV刻Viahole导通孔(过线孔)void空洞warp板弯Waves波浪WeaveExposure露织物wetting沾锡Wicking灯芯效应(渗铜)Wrinkles起皱五、形状与尺寸:1、导线(通道):conduction(track)2、导线(体)宽度:conductorwidth3、导线距离:conductorspacing4、导线层:conductorlayer5、导线宽度/间
11、距:conductorline/space6、第一导线层:conductorlayerno.17、圆形盘:roundpad8、方形盘:squarepad9、菱形盘:diamondpad10、长方形焊盘:rectanglepad11、子弹形盘:bulletpad12、泪滴盘:teardroppad13、雪人盘:snowmanpad14、v形盘:v-shapedpad15、环形盘:annularpad16、非圆形盘:non-circularpad17、隔离盘:isolationpad18、非功能连接盘:monfunctionalpad19、偏置连接盘:offsetland20、腹(背)裸盘:back-bardland21、盘址:anchoringspaur22、连接盘图形:landpattern23、连接盘网格阵列:lan
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