电气工程英文简历表格简历模.docx

1、电气工程英文简历表格简历模电气工程英文简历表格_简历模板作为求职者想要凭借个人简历求职成功就必须要知道自己有什么样的求职优势，了解自己的求职优势才能够掌握编写个人简历中的侧重点。金无足赤人无完人，在个人简历的编写中要学会扬长避短。如果你没有高等学历就需要着重编写专业技能，如果你没有工作经验就需要着重编写学业成就，如果你没有专业技能就需要着重编写英语水平。在个人简历中要挑选自己擅长的技能编写，这样才能够更大程度上取得用人单位的青睐，从而获得面试机会。有针对性的个人简历更容易获得面试机会，想要通过个人简历获得招聘人员的认可在编写个人简历之前就要知道自己想要在用人单位中获得一个什么样的职位。当明确自

2、己的职位过后就可以按照职位所需要的人才来编写自己的个人简历，并且在编写工作经验时也需要选择与职位相关的来编写。Name:Sex：Date of Birth：Hukou：Residency：Work Experience：Current Salary：Tel：E-mail：Career ObjectiveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesired Position：Senior Hardware Engineer

3、 ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary：NegotiableWork Experience2006/06Present*CompanyIndustry: Electronics/Semiconductor/ICIntel Flash Engineering Department Individua

4、l Contributor Responsibilities：I have been working in Intel Flash Assembly & Test EngineeringDepartment as an Individual Contributor since June of 2006.Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:1.The yield of yea

5、r 2006 has been dramatically increased than that of year 2005.2.The yield of all products, consecutively meets the goal.3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team memb

6、ers, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.Report Directly to: Department ManagerNumber of Subordinate: 14Refere

7、nce: Bao PowelAchievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.Our efforts are paid off:1.The yield of year 2006 has been dramatically increased than that of year 2005.2.The yield of all products, consecutively meets the goal.3.The

8、 total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities am

9、ong team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.2006/012006/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/ICIntel STTD-China Department Electronics Development Engineer Responsibilities：1.I had been

10、working in STTD-China since Jan 2006 to May 2006 as a senior module engineer.2.At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.Report Directly to: Hopman MarkNumbe

11、r of Subordinate: 14Reference: Bao PowelReason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2006.Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSI

12、VELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.2005/052006/01Nanyang University of Science & TechnologyIndustry: Electronics/Semiconductor/ICElectronics & Electrical Engineering Department Research Fellow Responsibilities：1.I work in Electronics & Electri

13、cal Engineering Department of Nanyang University of Science & Technology as a Research Fellow.2.I majored at Gate Oxide Reliability Research in the duration.Report Directly to: Professor Pey Kin LeohSubordinate: 3Reference: Patrick LowReason for Leaving: I completed the project which I undertook by

14、myself, and want to do more challenging job.Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.Project Experience2008/01PresentAssembly NPI (New Product Introduction)Project Description: To introduce more products into Intel Fla

15、sh Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI ca

16、ndidate, make Assembly build plan, follow up the progress.2007/012007/12Marginal Electrical Boards RescueProject Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on ea

17、ch kind of board and around &2.5 million dollars was saved finally.Responsibility: Being the team leader, I took the job of data analysis, define each members role, make program plan, coordinate each team member and follow up the progress.2006/102007/05Optimization the current Test Process Order for

18、 Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.2006/052006/12Test

19、Yield of Flash memory ImprovementProject Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency

20、case, coordinated each team member and make pro-active plan to avoided unexpected things happen.Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.Education and Training 2005/052006/01Nanyang University of Science & Technology

21、Microelectronics DoctorateI worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.2004/032005/03Seoul National University of Korea Microelectronics OthersI had been working in National Physical Lab of Seoul National Uni

22、versity in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in

23、Semiconductor Science and Technology.2001/032004/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate1998/092001/03Nanjing University of Science & Technology Material Science and Engineering MasterBeing a master student of this pe

24、riod, I have published one EI paper about Super-fine metal powers electrical characteristics.1993/091997/07Nanjing University of Science & Technology Material Science and Engineering Bachelor1997/071998/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Hena

25、n resistant Engineer in Quality Verification DepartmentProfessional SkillsLanguage Skills：English: EXCELLENTKorean:AVERAGEComputer Skills：Technology skilled 96MonthSAPunderstanding 8MonthCertificate：2000/11MCSE1999/06CET6Self-appraisal7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.