电子元器件封装图示大全.docx

1、电子元器件封装图示大全电子元器件封装图示大全 LQFP 100LMETAL QUAD 100LPQFP 100LQFPQuad Flat PackageQFPQuad Flat PackageTQFP 100LRIMMRIMMFor Direct RambusSBGASC-70 5LSDIPSIMM30SIMM30PinoutSIMM30Single In-line Memory ModuleSIMM72SIMM72PinoutSIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIPSingle Inline

2、 PackageSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA

3、 AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32LSOJSOP EIAJ TYPE II 14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP 16LSSOPSocket 603FosterLAMINATE TCSP 20LChip Scale PackageTO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52

4、TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageLAMINATE UCSP 32LChip Scale PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid Array VL Bus VESA Local BusXT Bus8bitZIPZig-Zag Inline Package Gull Wing Leads HSOP28ISAIndustry Standard ArchitectureIT

5、O220ITO3pJ-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsJLCCLCCLDCCLGALLP 8LaLQFPPCDIPPCI 32bit 5VPeripheral Component InterconnectPCI 64bit 3.3VPeripheral Component InterconnectPCMCIAPDIPPGAPlastic Pin Grid ArrayPLCCPQFPPS/2PS/2mouse port pinoutPSDIPDIMM 168DIMM

6、 DDRDIMM168Dual In-line Memory ModuleDIMM168DIMM168PinoutDIMM184For DDR SDRAM Dual In-line Memory ModuleDIPDual Inline PackageDIP-tabDual Inline Package with Metal HeatsinkEIAEIAJEDEC formulated EIA StandardsEISAExtended ISA FBGAFDIPFTO220Flat PackAC97AC97v2.2 specification 详细规格AGP 3.3VAccelerated G

7、raphics PortSpecification 2.0详细规格AGP PROAccelerated Graphics Port PROSpecification 1.01详细规格AGPAccelerated Graphics PortSpecification 2.0详细规格AMRAudio/Modem RiserAX078AX14C-Bend Lead CERQUADCeramic Quad Flat PackCLCCCNRCommunication and Networking Riser Specification Revision 1.2CPGACeramic Pin Grid A

8、rrayCeramic CaseLAMINATE CSP 112LChip Scale Package窗体顶端窗体底端BGABall Grid ArrayEBGA 680LLBGA 160LPBGA 217LPlastic BallGrid ArraySBGA 192LTSBGA 680LCLCCCNR Communication and Networking RiserCPGA Ceramic Pin Grid ArrayDIP Dual Inline Package DIP-tab Dual Inline Package with Metal HeatsinkFBGAFDIPFTO-220

9、Flat PackHSOP-28ITO-220ITO-3PJLCCLCCLDCCLGALQFPPCDIPPGA Plastic Pin Grid Array PLCCPQFPPSDIPLQFP 100LMETAL QUAD 100LPQFP 100LQFP Quad Flat PackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603 FosterLAMINATE TCSP 20L Chip Scale PackageTO252TO263/TO2

10、68QFP Quad Flat PackageTQFP 100LSBGASC-70 5LSDIPSIP Single Inline PackageSO Small Outline PackageSOJ 32LSOJSOP EIAJ TYPE II 14LSOT220SSOP 16LTO247SSOPTO18TO220TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOP Thin Small Outline PackageTSSOP or TSOP II Thin Shrink Outline PackageuBGA Micro Ball Grid Arr

11、ayuBGA Micro Ball Grid ArrayZIP Zig-Zag Inline PackageBQFP132C-Bend Lead CERQUAD Ceramic Quad Flat PackCeramic CaseLAMINATE CSP 112L Chip Scale PackageGull Wing LeadsPDIPPLCCSNAPTKSNAPTKSNAPZPSOHAGP 3.3VAccelerated Graphics PortSpecification 2.0详细规格AGP PROAccelerated Graphics Port PROSpecification 1

12、.01详细规格AGPAccelerated Graphics PortSpecification 2.0详细规格AMRAudio/Modem RiserAX078AX14BGABall Grid ArrayBQFP132EBGA 680L详细规格LBGA 160L详细规格PBGA 217LPlastic Ball Grid Array详细规格SBGA 192L详细规格TEPBGA 288LTEPBGA 288L详细规格TSBGA 680L详细规格C-Bend Lead CERQUADCeramic Quad Flat PackCLCCCNRCommunication and Networking Riser Specification Revision 1.2详细规格CPGACeramic Pin Grid Array