PCB专业术语.docx

1、PCB专业术语缩写全称中文CALCalibration仪教CLChemicalLaboratory化验室FVFinalVisualInspection最终目视检验CQECustomerQualityEngineer客服工程师IPQCInProcessQualityControl制程品质管控IQCIncomingQualityControl进料品质管控OQCOutgoingQualityControl出货品质管控OQAOutgoingQualityAssurance出货品质保证QAQualityAssurance品质保证部RELLABReliabilityLaboratory信赖性实验室QMSQ

2、ualityManagementSystem品质管理系统VQAVendorQualityAssurance供应商品质保证SQESupplierQualityEngineer供应商品质工程师MISManagementInformationSystem管理信息系统DCCDocument Control Center文管中心HRHumanResources人力资源部FIFinance财务部MKTMarketing市场营销部PURPurchasing采购部MAINMaintenance维护部GMGeneralManager总经理GMGeneralMotors通用汽车VPVicePresident副总C

3、EOChiefExecutionOffice执行总裁/首席执行官CFOChiefFinancialOfficer财务总监WTWasteTreatment废水处理部PPEPre-productionEngineering试生产部TDTechnologyDevelopment技术开发部缩写全称中文R&DResearch&Development研发部PEProcessEngineering工程部PCProductionControl生管部TSTraffic&Shipping海关货运部ETElectricalTest电性测试ENIGElectrolessNickelandImmersionGold化学

4、镍金AOIAutomatedOpticalInspection自动光学检测B/OBlackOxide黑氧化HASLHotAirSolderingLevel热风整平/喷锡PTHPlatedThroughHole镀通孔DFDryFilm干膜DESDevelop,Etch&Stripping显影,蚀刻,除胶EHSEnvironmentHealth&Safety环境保护部DPDirectPlating直接电镀B/FBondFilm/BrownOxide棕化I/LInnerLayer内层线路O/LOuterLayer外层线路S/MSolderMask防焊P/PPatternPlating图形电镀LCDL

5、iquidCrystalDisplay液晶显视器2ndESecondExposure二次曝光NCNumericallyControlled数控钻孔二.其它缩略语缩写全称中文QCQualityControl品质管控QMQualityManual品质手册CIPContinuousImprovementProject持续改善项目CPControlPlan控制计划缩写全称中文ICDInterconnectionDefect内连缺陷问题RPNRiskPriorityNumber风险优先顺序APQPAdvancedProductQualityPlan先期产品品质计划PPAPProductionPartAp

6、provalProcedure生产零部件核准程序AQLAcceptableQualityLevel品质允收水准AVLApprovedVendorList合格供应商清单CPKProcessCapabilityIndex制程能力指数FMEAFailureModeAndEffectAnalysis失效模式与效应分析IPCTheInstituteForInterconnection&美国电子电路互连及PackagingElectronicCircuits封装协会ISOInternationalOrganizationfor国际标准化组织Standardization/InternationalStan

7、dardOrganizationJITJustInTime及时MPIManufacturingProcessInstruction制程作业说明书SOPStandardOperationProcedure标准操作规范SPCStatisticalProcessControl统计制程管制66Sigma6个标准差CPCAChinaPrintedCircuitAssociation中国印刷电路板协会TPCATaiwanPrintedCircuitAssociation台湾印刷电路板协会JPCAJapanPrintedCircuitAssociation日本印刷电路板协会R&RRepeatability&

8、Re-productivity重复性&再现性A/WArtwork底片OPOperationInstruction操作说明IPAIsopropylAlcohol异丙醇ICIonicContamination离子污染度ICIntegratedCircuit集成电路BGABallGridArray球形栅格阵列缩写全称中文AAAtomicAbsorptionSpectrophotometer原子吸收光谱仪CVSCyclicVoltametricStripping循环伏安剥离分析仪ICIonChromatography离子液相色谱OGPOpticalGaugingProducts光学计量器/三次元OTD

9、OnTimeDelivery按时交货QPQualityProcedure品质程序文件R.CResinContent胶含量R.FResinFlow胶流量SEMScanningElectronicMicroscope扫描电子显微镜PPPrepreg预浸材料/半固化片ACCAccept接受REJReject拒收CARCorrectiveActionRequest改善措施报告R/WRework重工MRBMaterialReviewBoard需确认之问题板SPECSpecification规格A/RActionRequired待办事项SMDSurfaceMount Device表面贴装装置WIPWork

10、InProcess在制品HDIHighDensityInterconnecting高密度互连UVUltravioletSpectrophotometer紫外光分光光度计CDACompressedandDriedAir压缩气CTCoolingTower冷却塔CTWaterCityWater市水/自来水DBDistributionBoard配电屏DIWaterDe-ionizedWater去离子水FWFilteredWater过滤水M/CMachine机台缩写全称中文PCBPrintedCircuitBoard/ProfitComeBack印刷线路板/利润到来SSBSingle-sidedPrin

11、tedBoard单面印制板DSBDouble-sidedPrintedBoard双面印制板MLBMultilayerPrintedCircuitBoard多层线路印制板ROWaterReverseOsmosisWater反渗透水ROFReverseOsmosisFilter反渗透过滤器SWSoftWater软水TEMPTemperature温度TPMTotalPreventiveMaintenance总体预防性维护A/RAccountReceivable应收款项A/PAccountPayable应付款项CARCapitalAcquisitionRequest资金获得申请DMDirectMate

12、rial直接物料IDMIndirectMaterial间接物料FIFinanceModule财务模块P&LProfit&Loss盈亏PBTProfitBeforeTax税前利润COCostingModule(SAP)成本模块OSOutstanding杰出ERExceedImprovement优秀MRMeetRequirement良好NINeedImprovement待改进UAUnacceptable不可接受ASAPAsSoonAsPossible尽可能快地D/CDateCode周期DOEDesignofExperiment实验设计ERPEnterpriseResourcePlanning企业资

13、源规划KPIKeyPerformanceIndex主要绩效指标缩写全称中文MCSManagementControlSystem管理控制系统MRMaterialRequest物料申请PCBAPrintedCircuitBoardAssembly电路板组装P/NPartNumber板号/料号POPurchaseOrder采购单P&PPick&Place贴片机PRPurchaseRequisition采购申请SMTSurfaceMount Technology表面贴装技术S/OSalesOrder业务单/销售单V/OVariationOrder变异单F/OFacilityOrder工厂号NPTHNo

14、n-platedThroughHole非导通孔EDSEngineeringDateSheet工程数据单ECNEngineeringChangeNotice工程变更单PCB/PWBPrintedCircuitBoard/PintedWiringBoard印刷电路板MCPMetallizationContinuousPlating垂直连续电镀D/SDoubleSide双面板D/ODeliveryOrder送货单RCCResinCoatedCopper背胶铜箔QFPQuarterFlatPad四方形焊盘MSAMeasurementSystemAnalysis量测系统分析MLBMultilayerPr

15、intedBoard多层印制板CCLCopper-cladLaminate覆铜板PTFEPolytetrafluoethylene聚四氟乙稀BCSButylCellosolveSolvent防白水KLMKeyLineManager主要负责人BUMBuild-upMultilayer积层法多层板DSCDifferentialScanningCalorimetry微差扫描热卡分析法缩写全称中文DMADynamicMechanicalAnalysis动态力分析法IAInformationAppliance信息家电LPSMLiquidPhotoimagibleSolderMask液态感光油墨PGAPi

16、nGridArray针栅阵列PBGAPlastic-BGA塑料球栅阵列STHSilerThroughHole银胶贯孔TGAThermoGravimetricAnalysis热重量分析法RHRelativeHumidity相对湿度三.PCB一般用语英文中文Marking标记Void空洞FiducialPad基准焊垫Package包装Shipping货运Warpage/BowandTwist板弯板翘ViaHole导通孔(小于20mil)PlugHole堵孔AnnularRing孔环Slothole槽孔Traveler流程单BuyOff抽检Develop显影Legend文字GoldPotassium

17、Cyanide金盐Routing铣切Silver银英文中文Gold金OSP(OrganicSolderabilityPreservative)有机保护膜LineWidth线宽LineSpace线间距BoardThickness板厚HoleSize孔径Trace线路Drilling钻孔Impedance阻抗BarCode条形码AcidClean酸洗De-warpage板弯翘反直/矫正MasterDrawing蓝图Defect缺陷HotAirRepaidDryingOven快速烘箱Carton箱子BlindVia盲孔CopperFoil铜箔Tolerance公差X-Out打叉Customer客户P

18、inGauge量规/针规/塞规SolderingIron电烙铁SolderabilityTest焊锡性实验FinalFinish表面处理Warehouse仓库Wicking渗镀/灯芯效应LaserHole镭射孔英文中文ShippingBuy-off出货抽检FilmAdhesive粘结膜Warehouse仓库AuSeepage金渗镀LaserHole镭射孔VerticalDesmear垂直除胶渣ShippingBuy-off出货抽检ScrappedBoard报废板Audit稽核Stamping冲压C=0SamplingPlan零缺陷抽样计划Layup&Press叠合&压合Touchup/Repa

19、ir修补SmearResidue胶渣残留ImmersionSilver沉银10XEyeLupe10X放大镜TapeTest胶带试验ConditionalAccept有条件允收Quarantine隔离StopShipping停止出货OnHold暂扣Stamp印章ToolingHole定位孔ComponentHole元件孔MountingHole安装孔Production产品TestBoard测试板Conductor导线英文中文X-Section/Microsectioning切片FisrstArticleInspection首件/初片检查FinalCure最后烘烤RigidPrintedBoar

20、d刚性印制板Build-upMultiplayerPrintedBoard积层多层印制板FlexiblePrintedBoard挠性印制一路板MotherBoard/MouseBite母板DaughterBoard子板BackPlaneBoard背板BareBoard裸板Cable电缆Interconnection互连TransmissionLine传输线Substrate基底ConductivePattern导电图形Non-conductivePattern非导电图形BaseMaterial基板Laminate层压板CompositeLaminate复合层压板ThinLaminate薄层压板

21、BondingSheet粘结片StiffenerMaterial增强板材EpoxyResin环氧树脂RoundPad圆形盘GlassFiber玻璃布Yarn纱线Filament单丝WeftYarn纬纱英文中文WarpYarn经纱Wasp-wise经向Split裂缝ReworkSimulation模拟重工SquarePad方形盘DiamondPad棱形盘OblongPad长方形焊盘SupportdHole支撑孔BuriedViaHole埋孔Buried/BlindVia埋/盲孔CheckList点检表HoleLocation孔位HoleDensity孔密度HolePattern孔图DatumRe

22、ference参考基准Acceleration速化反应Integrity完整性Accuracy准确度Acrylic亚克力BlowHole吹孔BareChipAssembly裸体芯片组装BondStrength结合强度Bondability结合性BondingWire结合线BreakawayPanel可断拼板BreakdownVoltage崩溃电压/击穿电压Burr毛头/毛刺ChemicalResistance抗化学性英文中文Chip芯片Alcohol酒精MoistureAndInsulationResistance湿气与绝缘电阻CoreBoard芯片/核心核Deburing去毛刺Dent凹陷D

23、eposition沉积/储蓄Desmear除胶渣DielectricBreakdown介质崩溃DielectricConstant介质常数DimensionalStability尺寸稳定性DrillFacet钻尖切削面Edge-BoardConnector板边连接器Edge-BoardContace板边插头NegativeEtchback反回蚀ElectrolessDeposition化学镀/无电镀Etchback回蚀EtchFactor蚀刻因子EtchingResist抗蚀刻GelTime凝胶时间GelationParticle凝胶点HoldingTime停留时间HoleWallBreako

24、ut孔偏破HoleDensity孔密度HoleVoid孔壁空洞HullCell哈氏槽Imaging成像Logo标识英文中文LeakageCurrent漏电流LiftedLand焊垫浮起Measling白点/白斑MinimumAnnularRing最小环宽LaserAblation镭射烧孔GeneralRequirement概述性要求Nodule节瘤Non-wetting不沾银Nylon尼龙Outgassing出气Outgrowth侧出OverPotential过电位PanelPlating全板电镀PeelStrength剥离强度Permittivity介电常数PorosityTest孔隙度试验PatternPlating图形电镀QualityConformanceTest品质符合试验Registration对准度Resist阻剂Resolution解像ReverseIma