半导体工艺介绍PACKAGE.pptx
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1,2,Puman,3,WaferManufacturing,FrontEnd,Wafer,Test,BackEnd,CMP,4,(QFP),Waferbackgrinding,Wafermount,Wafersaw&clean,Dieattach,Epoxycure,Plasmaclean,Wirebond,Molding,Marking,Postmoldcure,Deflash&Trim,Solderplating,Forming&singulation,FVI,Packing,5,:
BTEpoxyPTFEPolyimidecompound,UBMPSVAPPESoldermaskP.R,95Pb/5Sn37Pb/63Sn(,183)NoLead,Ally,Sn3.9/Ag0.6/Cu5.5,235Low-Ally,:
AubondAllybond,LeadFrame:
Substrate:
(tape),HiTCETMBCBTM!
TAPE:
BlueTapeUVTape,HeatSink:
#,6,Polishingmachine&CMPUVtapeattachmachineDicingmachineUVirradiationmachineTaperemovermachine,Pick&Placemachine,Packagemachine,(F/T):
trim&form,80,7,!
8,IC,$%IC,&chip(system,)*+,-./0.12IC345,88,99,:
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USMTSurfaceMountingTechnologyBC4?
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USOPSmallOut-LinePackage/SOJSmall,Out-LineJ-Leadpackage?
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QuarterSizeOutlinePackage:
QuarterSizeVerySmallOutlinePackage,13,14,TU?
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AAA100MHzB)CDEF;G8HIJ&“Cross,Talk”KL)MN=IC&OPQRS208Pin,B)CD&,EEE,ETTTUUUVVV4,44WWW)XXXYYYZZZQFP,E)KR,QQ,&PPQQ_aa,_bb_cdefMYZ,BGA(BallGridArrayPackage)$%1,OPI!
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(FlipChip)?
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1.CBGA(CeramicBGA),2.PBGA(PlasticBGA)3.TBGA(TapeBGA)4.MBGA(MetalBGA),BGA?
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1,1.PBGA(PasticBGA),ball:
0.550.75mmballcount:
1001000ballpitch:
1.01.7mmsubstrateThk:
0.56mmbodyThk:
1.561.73mmPKGThk:
2.162.33mm2.LBGA(Low-profileBGA)ball:
0.300.60mmballcount:
1001000ballpitch:
0.81.0mmsubstrateThk:
0.36mmbodyThk:
0.90mmPKGThk:
1.301.60mm,26,3.LTBGA(Low-profileTapeBGA),ball:
0.45mmballcount:
1001000ballpitch:
0.80mmsubstrateThk:
0.1mmbodyThk:
0.80mmPKGThk:
1.20mm4.TFBGA(Thin&FinepitchBGA)ball:
0.300.60mmballcount:
1001000ballpitch:
0.501.0mmsubstrateThk:
0.36mmbodyThk:
0.89mmPKGThk:
1.201.60mm,27,5.TFTBGA(Thin&Fine-pitchTapeBGA),ball:
0.40mmballcount:
1001000ballpitch:
0.75mmsubstrateThk:
0.10mmbodyThk:
0.75mmPKGThk:
1.10mm6.EDHSBGA(ExposedDrop-inHeatSinkBGA)ball:
0.75mmballcount:
1001000ballpitch:
1.27mmsubstrateThk:
0.56mmbodyThk:
1.73mmPKGThk:
2.33mm,28,6.STFBGA(StackedThin&Fine-pitchBGA),ball:
0.801.0mmballcount:
1001000ballpitch:
0.40mmsubstrateThk:
0.26mmbodyThk:
0.96mmPKGThk:
1.40mm,7.CDTBGA(CavityDownTapeBGA),ball:
0.600.75mmballcount:
1001000ballpitch:
1.01.27mmsubstrateThk:
1.01.2mmbodyThk:
1.01.2mmPKGThk:
1.60mm,29,8.L2BGA/EBGA,(LaserlaminateBGA/EnhancedBGA)LaserlaminateBGA/EnhancedBGAarecavitydown,thermallyenhancedBGAwithlaminatedsubstrate.Theyaresuitableforsolutionsforhighpowerdissipationapplications(6w).L2BGAwithlaserdrilledviaenhancescircuitryEBGAusesBTlaminatedwithmultiplelayersataverycompetitivecost.Superiorelectricalperformanceisachievedbymultiplemetallayerlaminatebasedconstruction.ball:
0.600.75mmballcount:
1001000ballpitch:
1.01.27mmsubstrateThk:
1.01.2mmbodyThk:
1.01.2mmPKGThk:
1.60mm,30,9.MCMBGA(Multi-chipModuleBGA),ball:
0.600.75mmballcount:
1001000ballpitch:
1.27mm