光器件封装详解.docx
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光器件封装详解
光器件封装详解
有源光器件的结构和封装
1有源光器件的分
类....................................................................................................................5
2有源光器件的封装结
构.............................................................................................................5
2.1光发送器件的封装结
构.......................................................................................................6
同轴型光发送器件的封装结
构......................................................................................7
蝶形光发送器件的封装结
构..........................................................................................7
同轴型光接收器件的封装结
构......................................................................................8
蝶形光接收器件的封装结
构..........................................................................................9
1×9和2×9大封装光收发一体模
块.................................................................................9
GBIC(GigabitInterfaceConverter)光收发一体模块..............................................
10
SFF(SmallFormFactor)小封装光收发一体模块...................................................
11
SFP(SmallFormFactorPluggable)小型可插拔式光收发一体模块.......................
12光收发模块的子部
件...................................................................................................122.1.12.1.22.2
2.2.12.2.22.32.3.12.3.22.3.32.3.42.3.5
3.1
3.2
3.3光接收器件的封装结
构.......................................................................................................8光收发一体模
块的封装结构................................................................................................93有源
光器件的外
壳..................................................................................................................14机械
及环境保护................................................................................................................14热传
递...............................................................................................................................14
电通
路...............................................................................................................................15
玻璃密封引脚..............................................................................................................15
单层陶瓷.....................................................................................................................15
多层陶瓷.....................................................................................................................16同轴连接
器..................................................................................................................163.3.13.3.23.3.33.3.4
3.4
3.5光通
路...............................................................................................................................17
几种封装外壳的制作工艺和电特性实
例............................................................................18
小型双列直插封装(MiniDIL)...................................................................................18
多层陶瓷蝶形封装(Multilayerceramicbutterflytypepackages)............................
19射频连接器型封
装.......................................................................................................203.5.13.5.23.5.3
4.14有源光器件的耦合和对
准........................................................................................................20耦合方
式...........................................................................................................................20
直接耦合.....................................................................................................................21
透镜耦合.....................................................................................................................22
同轴型器件的对
准.......................................................................................................22
双透镜系统的对
准.......................................................................................................23直接耦合的
对准..........................................................................................................234.1.14.1.24.24.2.14.2.24.2.3
5.1
5.2
5.3对准技
术...........................................................................................................................225有源光器件的其它组件/子装配...............................................................................................23透镜..................................................................................................................................23热电制冷器
(TEC).........................................................................................................24底座..................................................................................................................................25
5.4
6.1
6.2
6.3
6.4激光器管芯和背光管组
件.................................................................................