IPC TM650实验方法手册.docx
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IPCTM650实验方法手册
IPCTM-650实验方法手册
IPCTM-650TestMethodsManual
IPCMemberTestingLaboratoriesList
Section1.0
ReportingandMeasurementAnalysisMethods
Section2.1
VisualTestMethods
Section2.2
DimensionalTestMethods
Section2.3
ChemicalTestMethods
Section2.4
MechanicalTestMethods
Section2.5
ElectricalTestMethods
Section2.6
EnvironmentalTestMethods
SECTION1.0-ReportingandMeasurementAnalysisMethods
1.1
Introduction
1.2
Calibration
1.3
AmbientConditions
1.4
Reporting,General
1.5
Reporting,Format
1.6
NumericalReporting
1.7
Reporting,InvalidTestResults
1.8
MeasurementPrecisionEstimationforBinaryData-1/03
MeasurementPrecisionCalculator-BinaryData
MeasurementPrecisionCalculatorUsersGuide
（forusewithtestmethod1.8）
1.9
MeasurementPrecisionEstimationforVariablesData-1/03
MeasurementPrecisionCalculator-VariableData
MeasurementPrecisionCalculatorUsersGuide
（forusewithtestmethod1.9）
SECTION2.1-VISUALTESTMETHODS
2.1.1D
Microsectioning-3/98
2.1.1.1
Microsectioning,CeramicSubstrate-12/87
2.1.1.2
Microsectioning-SemiorAutomaticTechniqueMicrosectionEquipment（Alternate）-7/93
2.1.2A
PinholeEvaluation,DyePenetrationMethod-3/76
2.1.3A
Plated-ThroughHoleStructureEvaluation-8/76
2.1.5A
SurfaceExamination,UncladandMetalCladMaterial-12/82
2.1.6B
ThicknessofGlassFabric-12/94
2.1.6.1
WeightofFabricReinforcements-12/94
2.1.7C
ThreadCountofGlassFabric-12/94
2.1.7.1
ThreadCount,OrganicFibers-12/87
2.1.8B
Workmanship-12/94
2.1.9
SurfaceScratchExaminationMetalCladFoil-5/86
2.1.10A
VisualInspectionforUndissolvedDicyandiamide-12/94
2.1.13A
InspectionforInclusionsandVoidsinFlexiblePrintedWiringMaterials-5/98
SECTION2.2-DIMENSIONALTESTMETHODS
2.2.1A
MechanicalDimensionalVerification-8/97
2.2.2B
OpticalDimensionalVerification-8/97
2.2.4C
DimensionalStability,FlexibleDielectricMaterials-5/98
2.2.5A
DimensionalInspectionsUsingMircosections-8/97
2.2.6A
HoleSizeMeasurement,Drilled-8/97
2.2.7A
HoleSizeMeasurement,Plated-5/86
2.2.8
LocationofHoles-4/73
2.2.10A
HoleLocationandConductorLocation-12/83
2.2.12A
ThicknessofCopperbyWeight-3/76
2.2.12.1
OverallThicknessandProfileFactorofCopperFoils
TreatedandUntreated-9/87
2.2.12.2
WeightandThicknessofCopperFoils
withReleasableCarriers-7/89
2.2.12.3
WeightandThicknessDeterminationofCopperFoils
WithEtchableCarriers-7/89
2.2.13.1A
Thickness,PlatinginHoles,MicrohmMethod-1/83
2.2.14
SolderPowderParticleSizeDistribution
-ScreenMethodforTypes1-4-1/95
2.2.14.1
SolderPowderParticleSizeDistribution
-MeasuringMicroscopeMethod-1/95
2.2.14.2
SolderPowderParticleSizeDistribution-OpticalImageAnalyzerMethod--1/95
2.2.14.3
DeterminationofMaximumSolderPowderParticleSize-1/95
2.2.15
CableDimensions（FlatCable）-6/79
2.2.16
ArtworkMasterEvaluationbyUseofaDrilledPanel-12/87
2.2.16.1
ArtworkMasterEvaluationbyOverlay-12/87
2.2.17
SurfaceRoughnessandProfileofMetallicFoils
（ContactingStylusTechnique）-3/90
2.2.17A
SurfaceRoughnessandProfileofMetallicFoils
（ContactingStylusTechnique）-2/01
2.2.18
DeterminationofThicknessofLaminatesby
MechanicalMeasurement-12/94
2.2.18.1
DeterminationofThicknessofMetallicCladLaminates,
Cross-sectional-12/94
2.2.19
MeasuringHolePatternLocation-12/87
2.2.19.1
Length,WidthandPerpendicularityofLaminateandPrepregPanels-12/94
2.2.20
SolderPasteMetalContentbyWeight-1/95
2.2.21
PlanarityofDielectricsforHighDensityInterconnection（HDI）MicroviaTechnology-11-98
SECTION2.3-CHEMICALTESTMETHODS
2.3.1
ChemicalProcessing,SuitableProcessingMaterial-4/73
2.3.1.1B
ChemicalCleaningofMetalCladLaminates-5/86
2.3.2F
ChemicalResistanceOfFlexiblePrintedWiringMaterials-5/98
2.3.3A
ChemicalResistanceofInsulatingMaterials-2/78
2.3.4B
ChemicalResistance,MarkingPaintsandInks-8/97
2.3.4.2A
ChemicalResistanceofLaminates,PrepregandCoatedFoilProducts,bySolventExposure-12/94
2.3.4.3
ChemicalResistanceofCoreMaterialstoMethyleneChloride-5/86
2.3.5B
Density,InsulatingMaterial-8/97
2.3.6A
Etching,AmmoniumPersulfateMethod-7/75
2.3.7A
Etching,FerricChlorideMethod-7/75
2.3.7.1A
CupricChlorideEtchingMethod-12/94
2.3.7.2A
AlkalineEtchingMethod-12/94
2.3.8A
Flammability,FlexibleInsulatingMaterials-12/82
2.3.8.1
FlammabilityofFlexiblePrintedWiring-12/88
2.3.9D
FlammabilityofPrepregandThinLaminate-8/97
2.3.10B
FlammabilityofLaminate-12/94
2.3.10.1
FlammabilityofSoldermaskonPrintedWiringLaminate-8/98
2.3.11
GlassFabricConstruction-4/73
2.3.13
DeterminationofAcidValueofLiquidSolderFlux-PotentiometricandVisualTitrationMethods-1/95
2.3.14
Print,Etch,andPlateTest-4/73
2.3.15C
Purity,CopperFoilorPlating-8/97
2.3.16B
ResinContentofPrepreg,byBurn-off-12/94
2.3.16.1C
ResinContentofPrepeg,byTreatedWeight--12/94
2.3.16.2
TreatedWeightofPrepreg-12/94
2.3.17D
ResinFlowPercentofPrepreg-8/97
2.3.17.1B
ResinFlowofAdhesiveCoatedFilmsandUnsupportedAdhesiveFilms-5/98
2.3.17.2B
ResinFlowof"NoFlow"Prepreg-8/97
2.3.18A
GelTime,PrepregMaterials-4/86
2.3.19C
VolatileContentofPrepreg-12/94
2.3.21
PlatingQuality,HullCellMethod-8/97
2.3.22
CopperProtectiveCoatingQuality-2-78
2.3.23B
Cure（Permanency）ThermallyCuredSolderMask-2/88
2.3.23.1A
Cure（Permanency）UVInitiatedDryFilmSolderMask-2/88
2.3.24
PorosityofGoldPlating-2/78
2.3.24.1
PorosityTestingofGoldElectrodepositedonaNickelPlatedCopperSubstrateElectrographicMethod-10/85
2.3.24.2A
PorosityofMetallicCoatingsonCopper-BasedAlloysandNickel（NitricAcidVaporTest）-8/97
2.3.25B
DetectionandMeasurementofIonizableSurfaceContaminants-8/97---Supersedes2.3.26and2.3.26.1
2.3.25C
DetectionandMeasurementofIonizableSurfaceContaminantsbyResistivityofSolventExtract-2/01
2.3.25.1
IonicCleanlinessTestingofBarePWBs
2.3.26A
SupersededbyTestMethod2.3.25
2.3.26.1
SupersededbyTestMethod2.3.25
2.3.26.2
MobileIonContentofPolymerFilms-7/95
2.3.27
CleanlinessTest-ResidualRosin-1/95
2.3.27.1
RosinFluxResidueAnalysis-HPLCMethod-1/95
2.3.28
IonicAnalysisofCircuitBoards,IonChromatographyMethod-1/95
2.3.29
Flammability,FlexibleFlatCable-11/88
2.3.30A
SolventpHDeterminationinAnhydrousFlourocarbonSolvents-11/81
2.3.31
RelativeDegreeofCureofU.V.CurableMaterial-2/88
2.3.32C
FluxInducedCorrosion（CopperMirrorMethod）-1/95
2.3.33C
PresenceofHalidesinFlux,SilverChromateMethod-1/95
2.3.34B
SolidsContent,Flux-1/95
2.3.34.1B
PercentageofFluxon/inFlux-Coatedand/orFlux-CoredSolder-1/95
2.3.35B
HalideContent,Quantitative（ChlorideandBromide）-1/95
2.3.35.1
FluoridesbySpotTest,Fluxes-Qualitative-1/95
2.3.35.2
FlourideConcentration,Fluxes-Quantitative--1/95
2.3.36
AcidAcceptanceofChlorinatedSolvents-10/85
2.3.37B
VolatileContentofAdhesiveCoatedDielectricFilms-5/98
2.3.38B
SurfaceOrganicContaminantDetectionTest-8/97
2.3.39B
SurfaceOrganicContaminantIdentificationTest（InfraredAnalyticalMethod）-8/97
2.3.40
ThermalStability-7/95
SECTION2.4-MECHANICALTESTMETHODS
2.4.1D
Adhesion,TapeTesting--8/97
2.4.1.1B
Adhesion,MarkingPaintsandInks--11/88
2.4.1.2
AdhesionofConductorsonHybridSubstrates--12/87
2.4.1.3
Adhesion,Resistors（HybridCircuits）--12/87
2.4.1.4
Adhesion,Overglaze（HybridCircuits）--12/87
2.4.1.5A
DeterminationofHeatTransfer--5/95
2.4.1.6
Adhesion,PolymerCoating--7/95
2.4.2A
DuctilityofCopperFoil--3/76
2.4.2.1D
FlexuralFatigueandDuctility,Foil--3/91
2.4.3D
FlexuralFatigue,FlexiblePrintedWiringMaterials--5/98
2.4.3.1C
FlexuralFatigueandDuctility,FlexiblePrintedWiring--3/91
2.4.3.2C
FlexuralFatigueandDuctility,FlexibleMetal-CladDielectrics--3/91
2.4.4B
FlexuralStrengthofLaminates（atAmbient Temperature）--12/94
2.4.4.1A
FlexuralStrengthofLaminates（atElevatedTemperature）--12/94
2.4.5
FoldingEndurance,FlexiblePrintedWiringMaterials--4/73
2.4.5.1
Flexibility-ConformalCoating
2.4.6
HotOil--4/73
2.4.7A
Machinability,PrintedWiringMaterials--7/75
2.4.8C
PeelStrengthofMetallicCladLaminates--12/94
2.4.8.1
PeelStrength,MetalFoil（KeyholeMethodforThinLaminates）--1/86
2.4.8.2A
PeelStrengthofMetallicCladLaminatesatElevatedTemperature（HotFluidMethod）--12/94
2.4.8.3A
PeelStrengthofMetallicCladLaminatesatElevatedTemperature（HotAirMethod）--12/94
2.4.8.4
CarrierRelease,ThinCopper--1/90
2.4.9D
PeelStrength,FlexibleDielectricMaterials--10/88
2.4.9.1
PeelStrengthofFlexibleCircuits-11/98
2.4.9.2
BondingProcess-11/98
2.4.10
PlatingAdhesion--4/73
2.4.11
ShearStrengthFlexibleDielectricMaterials--4/73
2.4.12A
Solderability,EdgeDipMethod--6/91
2.4.13F
SolderFloatResistanceFlexiblePrintedWiringMaterials--5/98
2.4.13.1
ThermalStressofLaminates--12/94
2.4.14
SolderabilityofMetallicSurfaces--4/73
2.4.14.1
Solderability,WaveSolderMethod--3/79
2.4.14.2
LiquidFluxActivity,WettingBalanceMethod--1/95
2.4.15A
SurfaceFinish,MetalFoil--3/76
2.4.16A
InitiationTearStrength,FlexibleInsulatingMaterials--12/82
2.4.17
TearStrength,Propagation--4/73
2.4.17.1A
Propagation,TearStrength,FlexibleInsulatingMaterials--12/82
2.4.18B
TensileStrengthandElongation,CopperFoil--8/80
2.4.18.1
TensileStrengthan
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