五金配件群组测试报告 样板20版.docx
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五金配件群组测试报告样板20版
文件名称：
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版本
修订履历
修订日期
主办
审核
核准
01
修订文件封面用纸（总页数:
15页）
2020/01/04
02
03
04
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主办
发行单位
表单编号:
002/版次:
01文件封面TESTREPORT
ReportNo.
:
ORT-1702002
Applicant
:
LABDept.
Commodity
:
SerialATA.
ModelNo.
:
G12JD243-011
Quantity
:
48pcs.
DateofTesting
:
2019.12.12~2019.12.27
MeasureEnvironment
:
Temp.:
23±3℃,R.H.:
35%~75%
TestItem
:
Refertoparagraph1,TestGroup.
Note:
1.Thereportrefersonlytothespecimen（s）submittedtotesting.
2.Thereportshallnotbereproduced,exceptinfull,withoutpriorwrittenapprovalfromlaboratory.
3.Thereportisvalidaftersigningandtraceabletostandards.
Preparedby:
Testedby:
TestItems:
No.
TestDescription
1
LowlevelContactResistance
2
InsulationResistance
3
DielectricWithstandingVoltage
4
Vibration
5
Mating/UnmatingForce
6
Durability
7
Temperaturelife
8
ThermalShock&Humidity
9
SaltSpray
10
TemperatureRisevs.Current
11
ResistancetoSolderingHeat
12
ContactRetentionForce
TestGroupprocess:
TestDescriptionSequence
Testgroup
1
2
3
4
5
6
7
8
Examinationofproduct
1,7
1,5
1,8
1,9
1,5
1,3
1,3
1
LowLevelContactResistance
2,6
2,4
2,6
2,4
InsulationResistance
2,6
3,7
DielectricWithstandingVoltage
3,7
4,8
Mating/UnmatingForce
3,5
Durability
4
Vibration
3
Humidity
5
ThermalShock
4
SaltSpray
5
Temperaturelife
3
TemperatureRisevsCurrent
2
ResistancetoSolderingHeat
2
ContactRetentionForce
2
SampleSizeperTestGroup
6
6
6
6
6
6
6
6
Note:
Testspecimen（s）shallbepreparedinaccordancewithapprovalsheetsandshallbeselectedatrandom.
1TestGroup[Durability]
1.1TestItem&Testmethod:
TestItem
TestMethod
1
LLCR
AccordingtomethodEIA364-23
2
Mating/UnmatingForce
AccordingtomethodEIA364-13
3
Durability
AccordingtomethodEIA364-09
1.2Testcondition:
1.2.1.LLCR:
20mVmax.Opencircuitat100mAmax.
1.2.2.Mating/UnmatingForce:
Rate:
12.5mmperminute
1.2.3.Durability（withoutlatch）:
500insertion/extractioncyclesataMax.
Rateof200cyclesperhour.
1.3TestRequest:
1.3.1LLCR:
Initialvalue:
30mmax.Finalvalue:
45mmax.
1.3.2a.Mating/UnmatingForce:
MatingForce:
20NMax.
UnmatingForce:
4NMin.after500cycles;
1.3.3Durability:
Noevidenceofdamage
Theelectricalperformanceshouldmeetthespec.
1.4TestValue:
1
2
3
4
5
6
VisualInspect.
OK
OK
OK
OK
OK
OK
LLCR（m）
7.48
7.02
8.1
7.9
7.32
6.08
MatingForce（Kgf）
1.75
1.55
1.47
1.35
1.35
1.51
UnmatingForce（Kgf）
1.25
1.18
1.12
1.14
1.21
1.23
Durability
OK
OK
OK
OK
OK
OK
MatingForce（Kgf）
1.81
1.92
1.81
1.86
1.92
1.82
UnmatingForce（Kgf）
1.72
1.68
1.75
1.69
1.69
1.65
LLCR（m）
7.51
8.02
7.97
7.46
7.37
6.99
VisualInspect.
OK
OK
OK
OK
OK
OK
1.5TestResult:
Comment
PASS
2.TestGroup[vibration]:
2.1TestItem&Testmethod:
TestItem
TestMethod
1
Vibration
AccordingtomethodEIA364-28ConditionVTestletterA
2.2Testcondition:
2.2.1.LLCR:
20mVmax.Opencircuitat100mAmax.
2.2.2Vibration:
5.36G’sRMS.30minutesineachofthreemutuallyperpendicularplanes.
2.3TestRequest:
2.3.1LLCR:
Initialvalue:
30mmax.Finalvalue:
45mmax.
2.3.2Vibration:
2.3.2.1Noevidenceofdamage
2.3.2.2Nodiscontinuities>1µs.
2.3.2.3Theelectricalperformanceshouldmeetthespecified.
2.4TestValue:
1
2
3
4
5
6
VisualInspection
OK
OK
OK
OK
OK
OK
LLCR（m）
6.72
6.36
7.23
7.45
7.65
6.89
Vibration（Xaxis）
OK
OK
OK
OK
OK
OK
Vibration（Yaxis）
OK
OK
OK
OK
OK
OK
Vibration（Zaxis）
OK
OK
OK
OK
OK
OK
LLCR（m）
6.89
6.56
7.32
7.46
7.88
7.12
VisualInspection
OK
OK
OK
OK
OK
OK
2.5TestResult:
Comment
PASS
3.TestGroup[Thermalshock&Humidity]:
3.1TestItem&Testmethod:
TestItem
TestMethod
1
InsulationResistance
AccordingtomethodEIA-364-21D
2
DWV
AccordingtomethodEIA-364-20
3
ThermalShock
AccordingtomethodEIA364-32TestConditionI
4
Humidity
AccordingtomethodEIA364-31
3.2Testcondition:
3.2.1IR:
500VDC.
3.2.2DWV:
500VAC.
3.2.3ThermalShock:
-55~85℃,
10cycles.Exposuretimeattemp.Extremes:
30min.
3.2.4Humidity:
Temp.:
40C,
RH:
90~95%,96hours.
3TestRequest:
3.3.1IR:
1000MΩmin.
3.3.2DWV:
Noflashover,sparkover,excessleakageandbreakdown.
3.3.3.Humidity:
a.Nophysicaldamage.
b.Meetrequirementsofadditionaltestsasspecifiedinthesequence.
3.3.4ThermalShock:
a.Nophysicaldamage.
b.Meetrequirementsofadditionaltestsasspecifiedinthesequence.
3.4TestValue:
1
2
3
4
5
6
VisualInspect.
OK
OK
OK
OK
OK
OK
IR（M）
>1000
>1000
>1000
>1000
>1000
>1000
DWV
OK
OK
OK
OK
OK
OK
ThermalShock
OK
OK
OK
OK
OK
OK
Humidity
OK
OK
OK
OK
OK
OK
IR（M）
>1000
>1000
>1000
>1000
>1000
>1000
DWV
OK
OK
OK
OK
OK
OK
VisualInspect.
OK
OK
OK
OK
OK
OK
3.5TestResult:
Comment
PASS
4.TestGroup[SaltSpray]:
4.1TestItem&Testmethod:
TestItem
TestMethod
1
LLCR
AccordingtomethodEIA-364-23
2
InsulationResistance
AccordingtomethodEIA-364-21
3
DWV
AccordingtomethodEIA-364-20
4
SaltSpray
AccordingtomethodEIA364-26TestConditionA
4.2Testcondition:
4.2.1LLCR:
20mVmax.Opencircuitat100mAmax.
4.2.2IR:
500VDC.
4.2.3DWV:
500VACfor60seconds.
4.2.4SaltSpray:
Temp:
35±1.1℃
R.H.:
95~98%
PHvalue:
6.5~7.2,48hours.
4.3TestRequest:
4.3.1LLCR:
Initialvalue:
30mmax.
Finalvalue:
45mmax.
4.3.2IR:
1000MΩmin.
4.3.3DWG:
Noflashover,sparkover,excessleakageandbreakdown.
4.3.4SaltSpray:
a.Nophysicaldamage.
b.Meetrequirementsofadditionaltestsasspecifiedinthesequence.
4.4TestValue:
1
2
3
4
5
6
VisualInspect.
OK
OK
OK
OK
OK
OK
LLCR（m）
7.74
7.67
6.97
7.02
6.64
7.19
IR（M）
>1000
>1000
>1000
>1000
>1000
>1000
DWV
OK
OK
OK
OK
OK
OK
SaltSpray
OK
OK
OK
OK
OK
OK
LLCR（m）
7.94
7.37
7.26
7.09
6.33
7.48
IR（M）
>1000
>1000
>1000
>1000
>1000
>1000
DWV
OK
OK
OK
OK
OK
OK
VisualInspect.
OK
OK
OK
OK
OK
OK
4.5TestResult:
Comment
PASS
5.TestGroup[Temperaturelife]:
5.1TestItem&Testmethod:
TestItem
TestMethod
1
LLCR
AccordingtomethodEIA-364-23
2
Temperaturelife
AccordingtomethodEIA364-17TestCondition3MethodA
5.2Testcondition:
5.2.1LLCR:
20mVmax.Opencircuitat100mAmax.
5.2.2Temperaturelife:
Temperature:
852C;Duration:
250hours
5.3TestRequest:
5.3.1LLCR:
Initialvalue:
30mmax.Finalvalue:
45mmax.
5.3.2Temperaturelife:
a.Nophysicaldamage.
b.Meetrequirementsofadditionaltestsasspecifiedinthesequence.
5.4TestValue:
1
2
3
4
5
6
VisualInspect.
OK
OK
OK
OK
OK
OK
LLCR（m）
7.84
7.41
8.02
6.97
6.87
6.59
Temperaturelife
OK
OK
OK
OK
OK
OK
LLCR（m）
8.02
8.59
8.97
6.67
7.08
6.68
VisualInspect.
OK
OK
OK
OK
OK
OK
5.5TestResult:
Comment
PASS
6.Testgroup[Currentvs.TemperatureRise]:
6.1Testmethod:
TestItem
TestMethod
1
Currentvs.TemperatureRise
AccordingtomethodEIA364-70MethodB
6.2Testcondition:
6.2.1.CurrentRating:
1.5A.
6.2.2.Ambienttemperatureshallbeheldwithin23±3°C.
6.3TestRequest:
TheTshallnotexceed+30℃.
6.4TestValue:
1
2
3
4
5
6
TemperatureRise
8.7℃
10.4℃
8.7℃
8.4℃
10.9℃
10.4℃
6.5TestResult:
Comment
PASS
7.Testgroup[ResistancetoSolderingHeat]:
7.1Testmethod:
TestItem
TestMethod
1
ResistancetoSolderingHeat
/
7.2Testcondition:
7.2.1Heat:
260℃
7.2.2Duration:
5seconds.
7.3TestRequest:
7.3.1Noevidenceofdamage
7.3.2Theelectricalperformancesshouldmeetthespec.specified
7.4TestValue:
1
2
3
4
5
6
VisualCheck
OK
OK
OK
OK
OK
OK
ResistancetoSolderingHeat
OK
OK
OK
OK
OK
OK
VisualCheck
OK
OK
OK
OK
OK
OK
7.5TestResult:
Comment
PASS
8.TestGroup[ContactRetentionForce]:
8.1TestItem&Testmethod:
TestItem
TestMethod
1
ContactRetentionForce
AccordingtoEIA364-29A
8.2Testcondition:
Applyaxialcompressiveforcetoapinataspeedofapproximately25±3mmperminute.
8.3TestRequest:
0.6Kgf（5.88N）/pinMinimumforterminal
8.4TestValue:
1
2
3
4
5
6
VisualInspect.
OK
OK
OK
OK
OK
OK
ContactRetentionForceforterminal（Kgf）
2.18
1.67
2.44
2.08
2.20
1.98
8.5TestResult:
Comment
PASS
TestingEquipment:
Instrument
Model
Low-OHMMeter
CHENHWA／502B
InsulationResistanceMeter
CHENHWA／702A
WithstandingMeter
CHENHWA/9071
InsertionExtractionForceTester
SETESTYSTEMS/1220
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